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1. 发明授权

US08227907B2 Flexible interconnect pattern on semiconductor package 有权
标题翻译：半导体封装上的柔性互连图案
公开(公告)号：US08227907B2
公开(公告)日：2012-07-24
申请号：US13004815
申请日：2011-01-11
申请人： Yoshihiro Tomita , David Chau , Gregory M. Chrysler , Devendra Natekar
发明人： Yoshihiro Tomita , David Chau , Gregory M. Chrysler , Devendra Natekar
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L21/4867 , H01L21/563 , H01L23/3675 , H01L23/42 , H01L23/5389 , H01L24/24 , H01L2223/6677 , H01L2224/16225 , H01L2224/18 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/73259 , H01L2224/73267 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1423 , H01L2924/15311 , H01L2924/16152 , H01L2924/351 , H01L2924/00
摘要： An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.
摘要翻译：本发明的一个实施例是制造金属互连的技术。将第一金属迹线印刷在附接到封装中的散热器的基板或空腔的管芯上，以将第一金属迹线电连接到基板中的电源触点。设备安装在第一个金属轨迹上。当封装电源时，该设备从基板接收电力。

2. 发明授权

US07915081B2 Flexible interconnect pattern on semiconductor package 有权
标题翻译：半导体封装上的柔性互连图案
公开(公告)号：US07915081B2
公开(公告)日：2011-03-29
申请号：US11395549
申请日：2006-03-31
申请人： Yoshihiro Tomita , David Chau , Gregory M. Chrysler , Devendra Natekar
发明人： Yoshihiro Tomita , David Chau , Gregory M. Chrysler , Devendra Natekar
IPC分类号： H01L21/00 , H01L21/44
CPC分类号： H01L21/4867 , H01L21/563 , H01L23/3675 , H01L23/42 , H01L23/5389 , H01L24/24 , H01L2223/6677 , H01L2224/16225 , H01L2224/18 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/73259 , H01L2224/73267 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1423 , H01L2924/15311 , H01L2924/16152 , H01L2924/351 , H01L2924/00
摘要： An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.
摘要翻译：本发明的一个实施例是制造金属互连的技术。将第一金属迹线印刷在附接到封装中的散热器的基板或空腔的管芯上，以将第一金属迹线电连接到基板中的电源触点。设备安装在第一个金属轨迹上。当封装电源时，该设备从基板接收电力。

3. 发明授权

US08518750B2 Flexible interconnect pattern on semiconductor package 有权
公开(公告)号：US08518750B2
公开(公告)日：2013-08-27
申请号：US13734861
申请日：2013-01-04
申请人： Yoshihiro Tomita , David Chau , Gregory M. Chrysler , Devendra Natekar
发明人： Yoshihiro Tomita , David Chau , Gregory M. Chrysler , Devendra Natekar
IPC分类号： H01L21/00
CPC分类号： H01L21/4867 , H01L21/563 , H01L23/3675 , H01L23/42 , H01L23/5389 , H01L24/24 , H01L2223/6677 , H01L2224/16225 , H01L2224/18 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/73259 , H01L2224/73267 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1423 , H01L2924/15311 , H01L2924/16152 , H01L2924/351 , H01L2924/00
摘要： An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.

4. 发明申请

US20070231953A1 Flexible interconnect pattern on semiconductor package 有权
标题翻译：半导体封装上的柔性互连图案
公开(公告)号：US20070231953A1
公开(公告)日：2007-10-04
申请号：US11395549
申请日：2006-03-31
申请人： Yoshihiro Tomita , David Chau , Gregory M. Chrysler , Devendra Natekar
发明人： Yoshihiro Tomita , David Chau , Gregory M. Chrysler , Devendra Natekar
IPC分类号： H01L21/00
CPC分类号： H01L21/4867 , H01L21/563 , H01L23/3675 , H01L23/42 , H01L23/5389 , H01L24/24 , H01L2223/6677 , H01L2224/16225 , H01L2224/18 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/73259 , H01L2224/73267 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1423 , H01L2924/15311 , H01L2924/16152 , H01L2924/351 , H01L2924/00
摘要： An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.
摘要翻译：本发明的一个实施例是制造金属互连的技术。将第一金属迹线印刷在附接到封装中的散热器的基板或空腔的管芯上，以将第一金属迹线电连接到基板中的电源触点。设备安装在第一个金属轨迹上。当封装电源时，该设备从基板接收电力。

5. 发明申请

US20130122656A1 FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE 有权
标题翻译：半导体封装上的柔性互连图案
公开(公告)号：US20130122656A1
公开(公告)日：2013-05-16
申请号：US13734861
申请日：2013-01-04
申请人： Yoshihiro Tomita , David Chau , Gregory M. Chrysler , Devendra Natekar
发明人： Yoshihiro Tomita , David Chau , Gregory M. Chrysler , Devendra Natekar
IPC分类号： H01L21/768
CPC分类号： H01L21/4867 , H01L21/563 , H01L23/3675 , H01L23/42 , H01L23/5389 , H01L24/24 , H01L2223/6677 , H01L2224/16225 , H01L2224/18 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/73259 , H01L2224/73267 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1423 , H01L2924/15311 , H01L2924/16152 , H01L2924/351 , H01L2924/00
摘要： An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.
摘要翻译：本发明的一个实施例是制造金属互连的技术。将第一金属迹线印刷在附接到封装中的散热器的基板或空腔的管芯上，以将第一金属迹线电连接到基板中的电源触点。设备安装在第一个金属轨迹上。当封装电源时，该设备从基板接收电力。

6. 发明申请

US20120289002A1 FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE 有权
标题翻译：半导体封装上的柔性互连图案
公开(公告)号：US20120289002A1
公开(公告)日：2012-11-15
申请号：US13556079
申请日：2012-07-23
申请人： Yoshihiro Tomita , David Chau , Gregory M. Chrysler , Devendra Natekar
发明人： Yoshihiro Tomita , David Chau , Gregory M. Chrysler , Devendra Natekar
IPC分类号： H01L21/50
CPC分类号： H01L21/4867 , H01L21/563 , H01L23/3675 , H01L23/42 , H01L23/5389 , H01L24/24 , H01L2223/6677 , H01L2224/16225 , H01L2224/18 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/73259 , H01L2224/73267 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1423 , H01L2924/15311 , H01L2924/16152 , H01L2924/351 , H01L2924/00
摘要： An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.
摘要翻译：本发明的一个实施例是制造金属互连的技术。将第一金属迹线印刷在附接到封装中的散热器的基板或空腔的管芯上，以将第一金属迹线电连接到基板中的电源触点。设备安装在第一个金属轨迹上。当封装电源时，该设备从基板接收电力。

7. 发明申请

US20110103438A1 FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE 有权
标题翻译：半导体封装上的柔性互连图案
公开(公告)号：US20110103438A1
公开(公告)日：2011-05-05
申请号：US13004815
申请日：2011-01-11
申请人： Yoshihiro Tomita , David Chau , Gregory M. Chrysler , Devendra Natekar
发明人： Yoshihiro Tomita , David Chau , Gregory M. Chrysler , Devendra Natekar
IPC分类号： H04B1/38 , H01L23/495
CPC分类号： H01L21/4867 , H01L21/563 , H01L23/3675 , H01L23/42 , H01L23/5389 , H01L24/24 , H01L2223/6677 , H01L2224/16225 , H01L2224/18 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/73259 , H01L2224/73267 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1423 , H01L2924/15311 , H01L2924/16152 , H01L2924/351 , H01L2924/00
摘要： An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.
摘要翻译：本发明的一个实施例是制造金属互连的技术。将第一金属迹线印刷在附接到封装中的散热器的基板或空腔的管芯上，以将第一金属迹线电连接到基板中的电源触点。设备安装在第一个金属轨迹上。当封装电源时，该设备从基板接收电力。

8. 发明授权

US07211890B2 Integrating thermoelectric elements into wafer for heat extraction 有权
标题翻译：将热电元件集成到晶片中进行热萃取
公开(公告)号：US07211890B2
公开(公告)日：2007-05-01
申请号：US10676585
申请日：2003-09-30
申请人： Shriram Ramanathan , Gregory M. Chrysler , David Chau , Ryan Lei
发明人： Shriram Ramanathan , Gregory M. Chrysler , David Chau , Ryan Lei
IPC分类号： H01L23/34
CPC分类号： H01L23/38 , H01L2924/0002 , H01L2924/00
摘要： An embodiment of the present invention is a technique to provide heat extraction for semiconductor devices. At least a thermoelectric film is fabricated onto a bare wafer. The backside of the bare wafer is bonded to an active wafer having at least a device. The bonded bare and active wafers are annealed.
摘要翻译：本发明的一个实施例是一种为半导体器件提供热提取的技术。在裸晶片上至少制造热电膜。裸晶片的背面与至少具有器件的活性晶片结合。粘合的裸露和活性晶圆进行退火。

9. 发明授权

US07795711B2 Microelectronic cooling apparatus and associated method 有权
标题翻译：微电子冷却装置及相关方法
公开(公告)号：US07795711B2
公开(公告)日：2010-09-14
申请号：US11255678
申请日：2005-10-20
申请人： Ioan Sauciuc , Gregory M. Chrysler
发明人： Ioan Sauciuc , Gregory M. Chrysler
IPC分类号： H01L23/495
CPC分类号： H01L23/38 , H01L35/16 , H01L2224/73253 , H01L2924/12044 , H01L2924/16152
摘要： An apparatus and associated method to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling apparatus comprising a heat spreader and one or more thermoelectric cooler(s) thermally coupled to the heat spreader provides cooling to one or more hot spot(s) of a microelectronic device, the one or more thermoelectric cooler(s) having a single heat exchanging element of a single material.
摘要翻译：通常描述了向微电子器件提供局部冷却的装置和相关方法。在这方面，根据一个示例性实施例，包括散热器和热耦合到散热器的一个或多个热电冷却器的冷却装置向微电子器件的一个或多个热点提供冷却，一个或多个具有单个材料的单个热交换元件的热电冷却器。

10. 发明授权

US07538476B2 Multi-layer piezoelectric actuators with conductive polymer electrodes 有权
标题翻译：具有导电聚合物电极的多层压电致动器
公开(公告)号：US07538476B2
公开(公告)日：2009-05-26
申请号：US11694762
申请日：2007-03-30
申请人： Gregory M. Chrysler , Ioan Sauciuc
发明人： Gregory M. Chrysler , Ioan Sauciuc
IPC分类号： H01L41/047 , H01L41/083 , H01L41/187
CPC分类号： F04D33/00 , H01L41/083 , H01L41/193
摘要： A multi-layer piezoelectric actuator with conductive polymer electrodes is described. The piezoelectric actuator comprises a stack of alternating conductive electrode layers and piezoelectric layers. The conductive electrode layers are comprised of a polymeric electrically conductive material. A device for cooling by forced-air convection may comprise the piezoelectric actuator, a fan blade and an alternating current supply. The piezoelectric actuator coupled with the fan blade and the alternating current supply, which is provided for vibrating the fan blade. A method of cooling by forced-air convection comprises supplying an alternating current to the piezoelectric actuator, wherein the alternating current has a frequency and causes the fan blade to vibrate with the same frequency.
摘要翻译：描述了具有导电聚合物电极的多层压电致动器。压电致动器包括交替的导电电极层和压电层的堆叠。导电电极层由聚合物导电材料构成。用于通过强制空气对流冷却的装置可以包括压电致动器，风扇叶片和交流电源。与风扇叶片和用于使风扇叶片振动的交流电源相连接的压电致动器。通过强制空气对流冷却的方法包括向压电致动器提供交流电流，其中交流电具有频率并使风扇叶片以相同的频率振动。

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