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1. 发明授权

US06987668B2 Liquid cooling system and personal computer using thereof 失效
标题翻译：液体冷却系统及其使用的个人计算机
公开(公告)号：US06987668B2
公开(公告)日：2006-01-17
申请号：US10847334
申请日：2004-05-18
申请人： Makoto Kitano , Takashi Naganawa , Yuji Yoshitomi , Rintaro Minamitani , Shigeo Ohashi , Noriyuki Ashiwake , Yoshihiro Kondo , Tsuyoshi Nakagawa
发明人： Makoto Kitano , Takashi Naganawa , Yuji Yoshitomi , Rintaro Minamitani , Shigeo Ohashi , Noriyuki Ashiwake , Yoshihiro Kondo , Tsuyoshi Nakagawa
IPC分类号： G06F1/20
CPC分类号： G06F1/203 , G06F2200/201 , G06F2200/203
摘要： A liquid cooling system having a circulator for circulating a cooling liquid therethrough including an input portion for receiving the cooling liquid and a separate output portion for supplying the cooling liquid. A heat receiving jacket supplied with the cooling liquid from the circulator and positioned to received heat generated from a heat generation body, a heat radiation portion for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a member for circulating the cooling liquid passing through the heat radiation portion into the circulation means so that the cooling liquid circulates within a closed flow passage. An accumulating portion is further formed within a portion of the closed flow passage for accumulating the cooling liquid therein.
摘要翻译：一种液体冷却系统，具有用于循环冷却液的循环器，包括用于接收冷却液的输入部分和用于供应冷却液的单独的输出部分。供给来自循环器的冷却液的受热套，并且被配置为接收从发热体产生的热量，散热部，其由通过所述受热外套的冷却液供给的散热用的散热部，以及用于循环的部件冷却液通过散热部分进入循环装置，使得冷却液体在封闭的流动通道内循环。在封闭流路的一部分内进一步形成蓄积部，用于将冷却液积存在其中。

2. 发明授权

US06885556B2 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US06885556B2
公开(公告)日：2005-04-26
申请号：US10874232
申请日：2004-06-24
申请人： Yoshihiro Kondo , Shinji Matsushita , Shigeo Ohashi , Takashi Naganawa , Rintaro Minamitani , Tsuyoshi Nakagawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou
发明人： Yoshihiro Kondo , Shinji Matsushita , Shigeo Ohashi , Takashi Naganawa , Rintaro Minamitani , Tsuyoshi Nakagawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou
IPC分类号： G06F1/20 , H01L23/473 , H05K7/20
CPC分类号： G06F1/203 , G06F2200/201 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An electronic apparatus includes a case mounting a semiconductor element within an inside thereof, a heat-receiving member thermally connected with the semiconductor element, a heat-radiation member disposed on an inner side surface of the casing, and a liquid driver for driving a liquid coolant between the heat-radiation member and the heat-receiving member. The apparatus further includes a tank accumulating the liquid coolant therein with at least a predetermined volume of the coolant to delimit a coolant surface within the tank, wherein the tank, the heat-radiation member and the heat-receiving member are connected with tubes, and a suction end portion of a suction pipe connected into the tank is located at a position which is always below the coolant surface irrespective of change of position of the tank.
摘要翻译：一种电子设备，包括在其内部安装半导体元件的壳体，与半导体元件热连接的受热部件，设置在壳体的内侧表面上的散热部件和用于驱动液体的液体驱动器散热构件和受热构件之间的冷却剂。该装置还包括储存有至少预定体积的冷却剂的液体冷却剂的罐，以限定罐内的冷却剂表面，其中罐，散热构件和受热构件与管连接，连接到罐中的吸入管的吸入端部位于始终低于冷却剂表面的位置，而与罐的位置的变化无关。

3. 发明授权

US06430042B1 Electronic apparatus having means for cooling a semiconductor element mounted therein 有权
标题翻译：具有用于冷却安装在其中的半导体元件的装置的电子设备
公开(公告)号：US06430042B1
公开(公告)日：2002-08-06
申请号：US09653584
申请日：2000-08-31
申请人： Shigeo Ohashi , Yoshihiro Kondo , Takashi Naganawa , Tsuyoshi Nakagawa
发明人： Shigeo Ohashi , Yoshihiro Kondo , Takashi Naganawa , Tsuyoshi Nakagawa
IPC分类号： H05K720
CPC分类号： G06F1/203 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： An electronic apparatus comprises a semiconductor element mounted inside a housing, a keyboard fitted to the housing, a heat radiating member provided on one face of the semiconductor element and a thermal conductive duct provided on the other face of the element. The electronic apparatus further comprises a wall thermally connecting an upper wall and a lower wall of the duct. The duct is provided with a fan.
摘要翻译：电子设备包括安装在壳体内的半导体元件，装配到壳体的键盘，设置在半导体元件的一个面上的散热构件和设置在元件的另一个面上的导热管。电子设备还包括热连接管道的上壁和下壁的壁。管道设有风扇。

4. 发明授权

US6094343A Heat dissipation structure for electronic equipment including two heat dissipation block assemblies and a heat conductive coupler 有权
标题翻译：包括两个散热块组件和导热耦合器的电子设备的散热结构
公开(公告)号：US6094343A
公开(公告)日：2000-07-25
申请号：US145737
申请日：1998-09-02
申请人： Tsuyoshi Nakagawa , Yasushi Neho , Naoyuki Sakamoto , Shigeo Ohashi , Yoshito Ohmura , Yukiko Iwama , Tadakatsu Nakajima , Yoshihiro Kondo , Susumu Iwai , Hitoshi Matsushima
发明人： Tsuyoshi Nakagawa , Yasushi Neho , Naoyuki Sakamoto , Shigeo Ohashi , Yoshito Ohmura , Yukiko Iwama , Tadakatsu Nakajima , Yoshihiro Kondo , Susumu Iwai , Hitoshi Matsushima
IPC分类号： G06F1/20 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/36 , H05K7/20
CPC分类号： G06F1/203 , H05K1/141 , H05K1/0203 , H05K1/0204 , H05K1/182 , H05K2201/066 , H05K2201/09054 , H05K2201/09072 , H05K3/368
摘要： A personal computer comprises a heat dissipation plate installed on a floor of its case, a motherboard disposed apart from the heat dissipation plate by a predetermined distance, and a daughter board disposed in such a manner that the motherboard is positioned between the heat dissipation plate and the daughter board. The daughter board is mounted with a central processing unit which generates heat. The motherboard is provided with a hole. A heat dissipation block extends from the heat dissipation plate through the hole in the motherboard, and is connected to the central processing unit through a heat conductive coupler. This forms a heat dissipation path which passes through the central processing unit, the heat dissipation block, the heat dissipation plate, and the case. In addition, another heat dissipation block is interposed between a keyboard and the daughter board so that another heat dissipation path can be formed through the central processing unit, another heat dissipation block, another heat dissipation plate, and the keyboard.
摘要翻译：个人计算机包括安装在其壳体的地板上的散热板，与散热板隔开预定距离的母板和设置成使得主板位于散热板和女儿板。子板安装有产生热量的中央处理单元。主板上有一个孔。散热块从散热板延伸穿过主板的孔，并通过导热耦合器连接到中央处理单元。这形成了通过中央处理单元，散热块，散热板和壳体的散热路径。此外，在键盘和子板之间插入另一个散热块，从而可以通过中央处理单元，另一个散热块，另一个散热板和键盘形成另一个散热路径。

5. 发明申请

US20050157466A1 Liquid cooling system and personal computer using the same 失效
公开(公告)号：US20050157466A1
公开(公告)日：2005-07-21
申请号：US11079264
申请日：2005-03-15
申请人： Rintaro Minamitani , Makoto Kitano , Noriyuki Ashiwake , Shigeo Ohashi , Yoshihiro Kondo , Takashi Naganawa , Yuji Yoshitomi , Tsuyoshi Nakagawa
发明人： Rintaro Minamitani , Makoto Kitano , Noriyuki Ashiwake , Shigeo Ohashi , Yoshihiro Kondo , Takashi Naganawa , Yuji Yoshitomi , Tsuyoshi Nakagawa
IPC分类号： F28D15/02 , F01P11/06 , G06F1/20 , H01L23/473 , H05K7/20 , H05K5/00
CPC分类号： G06F1/203 , F01P2011/066 , F28D15/0266 , G06F2200/201 , Y10S165/905
摘要： A liquid cooling system which is utilizable in a personal computer includes a pump for supplying a cooling liquid; a heat receiving jacket supplied with the cooling liquid and positioned to receive heat generated from a heat generation body, a heat radiation pipe for radiating heat which is supplied by the cooling liquid passing through the heat receiving jacket, and a passage for circulating the cooling liquid passing through the heat radiation pipe into the pump. The heat radiation pipe is made of material having a corrosion resistance that is higher than that of the heat receiving jacket.

6. 发明申请

US20050082036A1 Cooling device of electronic apparatus 审中-公开
标题翻译：电子设备冷却装置
公开(公告)号：US20050082036A1
公开(公告)日：2005-04-21
申请号：US10968059
申请日：2004-10-20
申请人： Rintaro Minamitani , Shigeo Ohashi , Yoshihiro Kondo , Yuji Yoshitomi , Takashi Naganawa , Masato Nakanishi , Tsuyoshi Nakagawa
发明人： Rintaro Minamitani , Shigeo Ohashi , Yoshihiro Kondo , Yuji Yoshitomi , Takashi Naganawa , Masato Nakanishi , Tsuyoshi Nakagawa
IPC分类号： G06F1/20 , H01L23/473 , H05K7/20 , F28F7/00
CPC分类号： G06F1/203 , F28D15/0266 , G06F2200/201
摘要： A cooling device for an electronic apparatus includes a heat generating element attached within a housing, a heat receiving jacket connectable with the heat generating element, a heat exchanger for exchanging heat between the heat receiving jacket and outside of the electronic apparatus and a liquid driver which supplies a cooling liquid to the heat receiving jacket. A part of pipework connected between the heat receiving jacket, the heat exchanger, and the liquid driver is made of a flexible tube of resin, and an ion exchanger is provided in a portion of the pipework. The cooling liquid has a corrosion inhibitor therein.
摘要翻译：一种用于电子设备的冷却装置，包括附接在壳体内的发热元件，可与发热元件连接的热接收护套，用于在热接收护套和电子设备外部之间进行热交换的热交换器，以及液体驱动器向冷却液供应冷却液。连接在热接收套管，热交换器和液体驱动器之间的管道的一部分由柔性的树脂管制成，并且在管道的一部分中提供离子交换器。冷却液中含有腐蚀抑制剂。

7. 发明申请

US20050078450A1 Electronic apparatus 审中-公开
标题翻译：电子仪器
公开(公告)号：US20050078450A1
公开(公告)日：2005-04-14
申请号：US10968010
申请日：2004-10-20
申请人： Shigeo Ohashi , Yoshihiro Kondo , Rintaro Minamitani , Takashi Naganawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou , Tsuyoshi Nakagawa
发明人： Shigeo Ohashi , Yoshihiro Kondo , Rintaro Minamitani , Takashi Naganawa , Yuuji Yoshitomi , Masato Nakanishi , Hajime Katou , Tsuyoshi Nakagawa
IPC分类号： F25D17/02 , F28F1/22 , G06F1/20 , H01L23/473 , H05K7/20
CPC分类号： G06F1/203 , F28F1/22 , G06F2200/201 , G06F2200/203
摘要： A water-cooling device for cooling a heat-generating element within an electronic apparatus. The water-cooling device includes a water-cooling jacket which is thermally connectable with the heat-generating element, a heat-radiation pipe, a tank, and a liquid driver which forms a circulation flow passage through which a cooling liquid flows. At least one of the water-cooling jacket, the heat-radiation pipe, the tank and the liquid driver is attached on a plate, and the water-cooling device is detachable with respect to the heat-generating element by the plate.
摘要翻译：一种用于冷却电子设备内的发热元件的水冷装置。水冷装置包括可与发热元件热连接的水冷套，散热管，罐和液体驱动器，其形成冷却液流过的循环流路。水冷套，散热管，罐和液体驱动器中的至少一个安装在板上，并且水冷装置通过板相对于发热元件可拆卸。

8. 发明申请

US20050047083A1 Electronic equipment 有权
标题翻译：电子设备
公开(公告)号：US20050047083A1
公开(公告)日：2005-03-03
申请号：US10962472
申请日：2004-10-13
申请人： Yoshihiro Kondo , Shigeo Ohashi , Rintaro Minamitani , Takashi Naganawa , Yuji Yoshitomi , Masato Nakanishi , Yasuhiko Sasaki , Tsuyoshi Nakagawa , Osamu Suzuki , Shinji Matsushita , Yasunori Yamada
发明人： Yoshihiro Kondo , Shigeo Ohashi , Rintaro Minamitani , Takashi Naganawa , Yuji Yoshitomi , Masato Nakanishi , Yasuhiko Sasaki , Tsuyoshi Nakagawa , Osamu Suzuki , Shinji Matsushita , Yasunori Yamada
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： H05K7/20781 , G06F1/20 , G06F2200/201
摘要： An electronic module which is detachably mounted on electronic equipment. The electronic module includes a board having a heat generator mounted on a surface thereof, and a cooling jacket which is integrally attached to the electronic module. The cooling jacket is thermally coupled to the heat generator and has a passage of a cooling fluid therewithin.
摘要翻译：一种可拆卸地安装在电子设备上的电子模块。电子模块包括安装在其表面上的具有发热体的板和与电子模块一体地连接的冷却套。冷却套与热发生器热耦合，并且在其中具有冷却流体的通道。

9. 发明授权

US6094344A Heat dissipation structure for a personal computer including two heat dissipation block assemblies and two heat dissipation plates 有权
标题翻译：包括两个散热块组件和两个散热板的个人计算机的散热结构
公开(公告)号：US6094344A
公开(公告)日：2000-07-25
申请号：US433209
申请日：1999-11-04
申请人： Tsuyoshi Nakagawa , Yasushi Neho , Naoyuki Sakamoto , Shigeo Ohashi , Yoshito Ohmura , Yukiko Iwama , Tadakatsu Nakajima , Yoshihiro Kondo , Susumu Iwai , Hitoshi Matsushima
发明人： Tsuyoshi Nakagawa , Yasushi Neho , Naoyuki Sakamoto , Shigeo Ohashi , Yoshito Ohmura , Yukiko Iwama , Tadakatsu Nakajima , Yoshihiro Kondo , Susumu Iwai , Hitoshi Matsushima
IPC分类号： G06F1/20 , H05K1/02 , H05K1/14 , H05K1/18 , H05K3/36 , H05K7/20
CPC分类号： G06F1/203 , H05K1/141 , H05K1/0203 , H05K1/0204 , H05K1/182 , H05K2201/066 , H05K2201/09054 , H05K2201/09072 , H05K3/368
摘要： A personal computer including a bottomed case, a keyboard, a top cover forming with said keyboard, an upper face covering said bottomed case, and a heat dissipation structure disposed between the upper face and the bottomed case. The heat dissipation structure includes a printed circuit board having a current consuming device mounted thereon, a first heat dissipation plate disposed under the keyboard, and a first heat conductive block coupled to the first heat dissipation plate and the printed circuit board. The heat conductive block conducts heat generated by the current consuming device to the first heat dissipation plate. The heat dissipation structure further includes a second heat dissipation plate disposed on the bottomed case, and a second heat conductive block coupled to the second heat dissipation plate and the printed board, wherein the second heat conductive block conducts the heat generated by the current consuming device to the second heat dissipation plate.
摘要翻译：一种个人计算机，包括底壳，键盘，用所述键盘形成的顶盖，覆盖所述有底壳体的上表面，以及设置在所述上表面和所述有底壳体之间的散热结构。散热结构包括其上安装有电流消耗装置的印刷电路板，设置在键盘下方的第一散热板和耦合到第一散热板和印刷电路板的第一导热块。导热块将由电流消耗装置产生的热量传导到第一散热板。散热结构还包括设置在有底壳体上的第二散热板和耦合到第二散热板和印刷板的第二导热块，其中第二导热块传导由电流消耗装置产生的热量到第二散热板。

10. 发明申请

US20050045309A1 Electronic apparatus 审中-公开
标题翻译：电子仪器
公开(公告)号：US20050045309A1
公开(公告)日：2005-03-03
申请号：US10791771
申请日：2004-03-04
申请人： Yoshihiro Kondo , Tsuyoshi Nakagawa
发明人： Yoshihiro Kondo , Tsuyoshi Nakagawa
IPC分类号： F28D15/00 , F28D15/02 , F28F7/00 , H01L23/427 , H01L23/46 , H01L23/473 , H05K7/20
CPC分类号： H01L23/473 , H01L23/427 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： In an electronic apparatus, having a heat diffusion structure having high efficiency, for corresponding to small-sizing and high-performances of an electronic part therein, a liquid sealing portion is provide on a cover on a side of the electronic part, which builds up a water-cooling jacket attached on an upper portion of the electronic part. Further, within an inside of this liquid sealing portion, a heat diffusion plate is provided, extending from the vicinity of the center of the water-cooling jacket in zigzag manner. With this, heat generated from the electronic part can be spread all over the cover, as a whole, on the side of the electronic part, with an aid of the evaporation heat of the liquid. The heat spread can be transmitted into the cooling liquid circulating within a housing thereof, through liquid flow passages of the water-cooling jacket, thereby being radiated into the atmosphere from the portion having a large or wide heat radiation area of the housing. Further, the heat generated from the electronic parts can be further spread, up to the water-cooling jacket having a wide area.
摘要翻译：在具有高效率的热扩散结构的电子设备中，为了对应于其中的电子部件的小尺寸和高性能，在电子部件的一侧的盖上提供液体密封部分，该盖子积聚附着在电子部件的上部的水冷套管。此外，在该液体密封部的内部设置有散热板，其以锯齿形的方式从水冷套的中心附近延伸。由此，借助于液体的蒸发热量，电子部件产生的热可以整体覆盖整个电子部件的一侧。散热可以通过水冷套管的液流通道传递到在其外壳内循环的冷却液，从而从具有大的或宽的散热区域的部分辐射到大气中。此外，从电子部件产生的热量可以进一步扩展，直到具有广泛面积的水冷套管。

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