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1. 发明申请

US20100124012A1 BLADE SERVER 有权
标题翻译：刀片服务器
公开(公告)号：US20100124012A1
公开(公告)日：2010-05-20
申请号：US12620742
申请日：2009-11-18
申请人： Yoshihiro KONDO , Tadakatsu NAKAJIMA , Akio IDEI , Shigeyasu TSUBAKI , Hiroyuki TOYODA , Tomoo HAYASHI
发明人： Yoshihiro KONDO , Tadakatsu NAKAJIMA , Akio IDEI , Shigeyasu TSUBAKI , Hiroyuki TOYODA , Tomoo HAYASHI
IPC分类号： G06F1/20
CPC分类号： G06F1/20 , H05K7/20818
摘要： A server system with a cooling ability that can cope with an increase in the amount of heat generated by a CPU of a server module detachably mounted on a blade server. The server module includes an enclosure accommodating therein a motherboard on which a CPU, memory, and the like are mounted, and part of a boil cooling device for cooling heat generated by the CPU. A fan accommodated in a fan module is adapted to blow air into the server module through an opening of the server module enclosure. The boil cooling device includes a first heat transmission member disposed in the server module enclosure, a second heat transmission member disposed outside the server module enclosure, and a plurality of pipes connecting them. The first heat transmission member is a box body with an internal space for hermetically sealing a refrigerant therein, one external planar face of which is thermally connected to the CPU and the other external planar face of which is provided with a heat sink. The second heat transmission member is disposed in the fan module unit, and a heat radiation member provided for the pipes forms an airflow passage together with the motherboard.
摘要翻译：一种具有冷却能力的服务器系统，其可以应对可拆卸地安装在刀片服务器上的服务器模块的CPU产生的热量的增加。服务器模块包括容纳其中安装有CPU，存储器等的母板的壳体和用于冷却由CPU产生的热的沸腾冷却装置的一部分。容纳在风扇模块中的风扇适于通过服务器模块外壳的开口将空气吹入服务器模块。沸腾冷却装置包括设置在服务器模块外壳中的第一传热构件，设置在服务器模块外壳外部的第二传热构件和连接它们的多个管道。第一传热构件是具有用于气密地密封制冷剂的内部空间的盒体，其一个外部平面被热连接到CPU，而另一个外部平面设置有散热器。第二传热构件设置在风扇模块单元中，并且用于管道的散热构件与主板一起形成气流通道。

2. 发明申请

US20110048676A1 COOLING SYSTEM AND ELECTRONIC APPARATUS APPLYING THE SAME THEREIN 有权
标题翻译：冷却系统和应用其的电子设备
公开(公告)号：US20110048676A1
公开(公告)日：2011-03-03
申请号：US12852556
申请日：2010-08-09
申请人： Hiroyuki TOYODA , Tadakatsu NAKAJIMA , Yoshihiro KONDO , Shigeyuki SASAKI , Akio IDEI , Shigemasa SATOH
发明人： Hiroyuki TOYODA , Tadakatsu NAKAJIMA , Yoshihiro KONDO , Shigeyuki SASAKI , Akio IDEI , Shigemasa SATOH
IPC分类号： F28D15/02
CPC分类号： F28D15/0266 , F28D1/05366 , F28D15/046 , F28F1/325 , F28F13/187 , F28F2215/12 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A cooling system applying a thermo siphon therein, being superior in energy saving and/or ecology, with an effective cooling, and also an electronic apparatus applying that therein, in particular, for cooling a CPU 200 mounted on a printed circuit board 100 within a housing thereof, comprises a heat-receiving jacket 310, being thermally connected with a surface of the CPU generating heats therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof, a condenser 320 for receiving refrigerant vapor from the heat-receiving jacket within a pressure-reduced inner space thereof and for condensing the refrigerant vapor into a liquid by transferring the heats into an outside of the apparatus, a vapor tube 331, and a liquid return tube 332, with applying the thermo siphon for circulating the refrigerant due to phase change thereof, wherein the condenser forms fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also formed flat in a cross-section thereof, for cooling the refrigerant vapor from the heat-receiving jacket on the inner wall surface thereof, efficiently.
摘要翻译：一种在其中施加热虹吸的冷却系统，具有优异的节能和/或生态学，有效的冷却，以及在其中应用的电子设备，特别是用于冷却安装在印刷电路板100内的CPU 200 其壳体包括与在其中产生加热的CPU的表面热连接的热接收套310，并且用于通过发热而蒸发存储在减压内部空间中的液体制冷剂;冷凝器320，用于从在其减压的内部空间内的热接收套管，并且通过将热量传递到设备的外部，蒸气管331和液体返回管332将制冷剂蒸汽冷凝成液体，同时施加热虹吸用于使制冷剂由于其相变而循环，其中，冷凝器在其内壁表面上沿着r的流动方向形成细槽制冷剂，并且也在其横截面上形成为平坦的，用于有效地从其受热套管的内壁表面冷却制冷剂蒸汽。

3. 发明申请

US20100033931A1 COOLING UNIT, ELECTRONIC APPARATUS RACK, COOLING SYSTEM, AND CONSTRUCTION METHOD THEREOF 审中-公开
标题翻译：冷却单元，电子设备机架，冷却系统及其结构方法
公开(公告)号：US20100033931A1
公开(公告)日：2010-02-11
申请号：US12393320
申请日：2009-02-26
申请人： Tomoyuki MIYAZAWA , Takeshi ARAYA , Akio IDEI , Hiroshi IWATA , Kaname IETA , Tsuyoshi EBATO
发明人： Tomoyuki MIYAZAWA , Takeshi ARAYA , Akio IDEI , Hiroshi IWATA , Kaname IETA , Tsuyoshi EBATO
IPC分类号： H05K7/20 , B21D53/02
CPC分类号： H05K7/20745 , Y10T29/4935
摘要： A cooling unit which improves the cooling efficiency of a server rack and minimizes rise in the server room temperature. A cooling unit for a server rack housing a server with a heat source includes: a fan unit having an array of fans for discharging hot air generated by the heat source from the rack; and a radiator unit having an array of pipes for guiding coolant to remove heat from the hot air discharged from the rack by rotation of the fans; and a frame unit which integrally combines the fan unit and the radiator unit. The cooling unit constructs a back door from which the hot air inside the rack is discharged.
摘要翻译：一个冷却单元，提高了服务器机架的冷却效率，并最大程度地降低了服务器的室内温度。用于容纳具有热源的服务器的服务器机架的冷却单元包括：风扇单元，具有用于从所述架子排出由热源产生的热空气的风扇阵列; 以及散热器单元，其具有用于引导冷却剂的管阵列，以通过风扇的旋转从通过齿条排出的热空气除去热量; 以及将风扇单元和散热器单元整体结合的框架单元。冷却单元构成后门，排出机架内部的热空气。

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