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    • 4. 发明申请
    • RESISTANCE-VARIABLE MEMORY DEVICE
    • 电阻可变存储器件
    • US20130250656A1
    • 2013-09-26
    • US13605746
    • 2012-09-06
    • Takayuki ISHIKAWAYoshifumi NishiDaisuke MatsushitaMasato Koyama
    • Takayuki ISHIKAWAYoshifumi NishiDaisuke MatsushitaMasato Koyama
    • H01L45/00G11C11/21
    • H01L45/04H01L45/1233H01L45/145
    • A memory device includes a first electrode, a second electrode, a third electrode, a first variable resistance layer between the first electrode and the third electrode, and a second variable resistance layer between the second electrode and the third electrode. The first, second, and third electrodes, and the first and second variable resistance layers are formed of materials that cause the first variable resistance layer to transition from a high resistance state to a low resistance state when a voltage is applied across the first and second electrodes and maintain the high resistance state when the voltage is cut off, and cause the second variable resistance layer to transition from a high resistance state to a low resistance state when the voltage is applied across the first and second electrodes and transition from the high resistance state to the low resistance state when the voltage is cut off.
    • 存储器件包括第一电极,第二电极,第三电极,第一电极和第三电极之间的第一可变电阻层,以及在第二电极和第三电极之间的第二可变电阻层。 第一,第二和第三电极以及第一和第二可变电阻层由当第一和第二电极层施加电压时使第一可变电阻层从高电阻状态转变为低电阻状态的材料形成 电极,当电压被切断时保持高电阻状态,并且当电压施加在第一和第二电极两端并从高电阻转变时,使第二可变电阻层从高电阻状态转变到低电阻状态 当电压被切断时,状态为低电阻状态。
    • 8. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08658999B2
    • 2014-02-25
    • US13728552
    • 2012-12-27
    • Yoshifumi NishiTakao MarukameTakayuki IshikawaMasato Koyama
    • Yoshifumi NishiTakao MarukameTakayuki IshikawaMasato Koyama
    • H01L29/02
    • H01L45/14H01L27/2472H01L45/08H01L45/1233H01L45/1253H01L45/16
    • According to an embodiment, a semiconductor device includes first and second memristors. The first memristor includes a first electrode made of a first material, a second electrode made of a second material, and a first resistive switching film arranged between the first and second electrodes. The first resistive switching film is connected to both the first and second electrodes. The second memristor includes a third electrode made of a third material, a fourth electrode made of the second material, and a second resistive switching film arranged between the third and fourth electrodes. The second resistive switching film is connected to both the third and fourth electrodes. The work function of the first material is smaller than that of the second material. The work function of the third material is larger than that of the second material.
    • 根据实施例,半导体器件包括第一和第二忆阻器。 第一忆阻器包括由第一材料制成的第一电极,由第二材料制成的第二电极和布置在第一和第二电极之间的第一电阻切换膜。 第一电阻开关膜连接到第一和第二电极。 第二忆阻器包括由第三材料制成的第三电极,由第二材料制成的第四电极和布置在第三和第四电极之间的第二电阻切换膜。 第二电阻开关膜连接到第三和第四电极。 第一材料的功函数小于第二材料的功函数。 第三种材料的功函数大于第二种材料的功函数。
    • 9. 发明授权
    • Apparatus and system for improved thermal radiation for a mobile computing device and case
    • 用于移动计算设备和壳体的用于改进热辐射的装置和系统
    • US08355248B2
    • 2013-01-15
    • US12970859
    • 2010-12-16
    • Yoshifumi Nishi
    • Yoshifumi Nishi
    • H05K7/20
    • G06F1/203
    • Embodiments of an apparatus and system are described for a thermally radiating mobile computing device and case. An apparatus may comprise, for example, a thermally radiating case for a mobile computing device having a first portion arranged to receive the mobile computing device, a thermally conductive coupling arranged to removably couple the case to one or more internal heat generating components of the mobile computing device, and a second portion thermally coupled to the first portion and the thermally conductive coupling, the second portion comprising one or more thermally conductive materials arranged to radiate thermal energy away from the one or more heat generating components. Other embodiments are described and claimed.
    • 对于热辐射移动计算设备和情况描述了设备和系统的实施例。 设备可以包括例如用于移动计算设备的散热壳体,其具有布置成接收移动计算设备的第一部分,布置成将壳体可移除地耦合到移动设备的一个或多个内部发热部件的导热联接器 计算装置,以及热耦合到第一部分和导热联接件的第二部分,第二部分包括一个或多个导热材料,其布置成将热能辐射离开一个或多个发热部件。 描述和要求保护其他实施例。