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1. 发明授权

US08525333B2 Electronic device and manufacturing method therefor 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US08525333B2
公开(公告)日：2013-09-03
申请号：US12736191
申请日：2009-03-17
申请人： Yoshifumi Kanetaka
发明人： Yoshifumi Kanetaka
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L23/49816 , H01L23/49838 , H01L2924/0002 , H01L2924/12044 , H01L2924/15311 , H05K3/321 , H05K3/3436 , H05K2201/094 , H05K2201/09781 , Y02P70/613 , H01L2924/00
摘要： An electronic device includes the electronic element, the interposer substrate, on one surface of which the electronic element is mounted, and the interconnection substrate, on one surface of which the interposer substrate is mounted. One portion of the connection parts is an electrical connection part that electrically interconnects the interposer substrate and the interconnection substrate. The remaining portion is a dummy connection part that produces no functional deficiency even when the dummy connection part does not electrically interconnect the interposer substrate with the interconnection substrate. The dummy connection part includes at least one of the connection parts that at least partially overlap with the electronic element in a plan projection and are preferably arranged along an outer rim of the plan projection of the electronic element.
摘要翻译：电子设备包括电子元件，插入器基板，其一个表面上安装有电子元件，以及互连基板，其一个表面上安装有插入器基板。连接部分的一部分是将插入器基板和互连基板电连接的电连接部分。剩余部分是虚拟连接部分，即使虚拟连接部分不将互连基板与互连基板电气互连，也不产生功能缺陷。虚拟连接部分包括在平面突起中至少部分地与电子元件重叠的连接部分中的至少一个，并且优选地沿着电子元件的平面突起的外边缘布置。

2. 发明申请

US20080190657A1 Circuit Board 有权
标题翻译：电路板
公开(公告)号：US20080190657A1
公开(公告)日：2008-08-14
申请号：US10597306
申请日：2005-01-06
申请人： Yoshifumi Kanetaka , Naomi Ishizuka
发明人： Yoshifumi Kanetaka , Naomi Ishizuka
IPC分类号： H05K1/11 , H01R12/04
CPC分类号： H05K1/116 , H05K3/3447 , H05K2201/094 , H05K2201/09854 , H05K2201/10189 , Y10T29/49139
摘要： A circuit board includes a plurality of through holes (14, 44) into which a plurality of leads (18) of one electronic devices are inserted and soldered. Among these through holes (14, 44), the volume of through hole (14b, 24b, 34b, 44b, 54, 64b) into which the outermost end lead of leads (18) of the electronic device is inserted, is set greater than the volume of through hole (14a, 44a), into which the lead at the position nearest to the center of the electronic device is inserted. Alternatively, the size of through hole (14b, 24b, 34b, 44b, 54, 64b), into which the outermost end lead of leads (18) is inserted, the size being measured in a direction of a straight line that connects a position of the outermost end lead of leads (18) of the electronic device, which is mounted before being soldered, and a center position of the electronic device at the time when the electronic device is mounted, is larger than the size of through hole (14a, 44a), into which the lead of leads (18) which is located at the position nearest to the center of the electronic device is inserted, the size being measured in any direction in a plane. Alternatively, the center position of through hole (74b), into which outermost end lead (18) of the electronic device is inserted, is shifted in a direction away from or approaching the center position of the electronic device at the time when the electronic device is mounted, from the position of outermost end lead (18) of the electronic device, which is mounted before being soldered, in accordance with the relationship between the amount of thermal expansion of the electronic device and that of the circuit board.
摘要翻译：电路板包括多个通孔（14,44），一个电子设备的多个引线（18）插入并焊接到其中。在这些通孔（14,44）中，插入电子装置的引线（18）的最外端引线的通孔（14b，24b，34b，44b，54,64b）的容积被设定为大于通孔（14a，44a）的体积，最靠近电子设备中心的位置处的引线插入其中。或者，引线（18）的最外端引线插入的贯通孔（14b，24b，34b，44b，54bbb）的尺寸在直线方向上测量的尺寸连接安装在焊接前的电子设备的引线（18）的最外端引线的位置与安装电子设备时的电子设备的中心位置的线大于尺寸的通孔（14a，44a），其中位于最靠近电子设备中心的位置处的引线（18）的引线插入其中，该尺寸被测量在平面中的任何方向上。或者，电子设备的最外端引线（18）插入其中的通孔（74b）的中心位置在电子设备的电子设备时沿远离或接近电子设备的中心位置的方向移动装置根据电子装置的热膨胀量与电路板的热膨胀量之间的关系，从焊接前安装的电子装置的最外端引线（18）的位置安装。

3. 发明申请

US20110006433A1 ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREFOR 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US20110006433A1
公开(公告)日：2011-01-13
申请号：US12736191
申请日：2009-03-17
申请人： Yoshifumi Kanetaka
发明人： Yoshifumi Kanetaka
IPC分类号： H01L23/52 , H01L21/50
CPC分类号： H01L23/49816 , H01L23/49838 , H01L2924/0002 , H01L2924/12044 , H01L2924/15311 , H05K3/321 , H05K3/3436 , H05K2201/094 , H05K2201/09781 , Y02P70/613 , H01L2924/00
摘要： An electronic device includes the electronic element, the interposer substrate, on one surface of which the electronic element is mounted, and the interconnection substrate, on one surface of which the interposer substrate is mounted. One portion of the connection parts is an electrical connection part that electrically interconnects the interposer substrate and the interconnection substrate. The remaining portion is a dummy connection part that produces no functional deficiency even when the dummy connection part does not electrically interconnect the interposer substrate with the interconnection substrate. The dummy connection part includes at least one of the connection parts that at least partially overlap with the electronic element in a plan projection and are preferably arranged along an outer rim of the plan projection of the electronic element.
摘要翻译：电子设备包括电子元件，插入器基板，其一个表面上安装有电子元件，以及互连基板，其一个表面上安装有插入器基板。连接部分的一部分是将插入器基板和互连基板电连接的电连接部分。剩余部分是虚拟连接部分，即使虚拟连接部分不将互连基板与互连基板电气互连，也不产生功能缺陷。虚拟连接部分包括在平面突起中至少部分地与电子元件重叠的连接部分中的至少一个，并且优选地沿着电子元件的平面突起的外边缘布置。

4. 发明授权

US07820917B2 Circuit board 有权
标题翻译：电路板
公开(公告)号：US07820917B2
公开(公告)日：2010-10-26
申请号：US10597306
申请日：2005-01-06
申请人： Yoshifumi Kanetaka , Naomi Ishizuka
发明人： Yoshifumi Kanetaka , Naomi Ishizuka
IPC分类号： H05K1/16
CPC分类号： H05K1/116 , H05K3/3447 , H05K2201/094 , H05K2201/09854 , H05K2201/10189 , Y10T29/49139
摘要： A circuit board includes a plurality of through holes into which a plurality of leads of one electronic devices are inserted and soldered with lead free solder. Among these through holes, the volume of through hole into which the outermost end lead of leads of the electronic device is inserted, is set greater than the volume of through hole, into which the lead at the position nearest to the center of the electronic device is inserted.
摘要翻译：电路板包括多个通孔，一个电子设备的多个引线插入并焊接到无铅焊料中。在这些通孔中，电子装置的引线的最外端引线插入其中的通孔的容积被设定为大于通孔的容积，最靠近电子装置的中心的位置处的引线被插入。

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