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    • 1. 发明申请
    • LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 发光装置及其制造方法
    • US20080128721A1
    • 2008-06-05
    • US11873763
    • 2007-10-17
    • Yoshiaki WatanabeTomonori HinoNobukata OkanoHisayoshi KuramochiYuichiro KikuchiTatsuo Ohashi
    • Yoshiaki WatanabeTomonori HinoNobukata OkanoHisayoshi KuramochiYuichiro KikuchiTatsuo Ohashi
    • H01L33/00
    • H01L33/44H01L33/38
    • Herein disclosed a method of manufacturing a light emitting device, including the steps of: (A) sequentially forming a first compound semiconductor layer of a first conduction type, an active layer, and a second compound semiconductor layer of a second conduction type different from said first conduction type, over a substrate; and (B) exposing a part of said first compound semiconductor layer, forming a first electrode over said exposed part of said first compound semiconductor layer and forming a second electrode over said second compound semiconductor layer, wherein said method further includes, subsequent to said step (B), the step of: (C) covering at least said exposed part of said first compound semiconductor layer, an exposed part of said active layer, an exposed part of said second compound semiconductor layer, and a part of said second electrode with an SOG layer.
    • 本文公开了一种制造发光器件的方法,包括以下步骤:(A)顺序地形成第一导电类型的第一化合物半导体层,有源层和与所述第二导电类型不同的第二化合物半导体层 第一导电类型,在基板上; 和(B)暴露所述第一化合物半导体层的一部分,在所述第一化合物半导体层的所述暴露部分上形成第一电极,并在所述第二化合物半导体层上形成第二电极,其中所述方法还包括,在所述步骤 (B)中,步骤:(C)至少覆盖所述第一化合物半导体层的所述暴露部分,所述有源层的暴露部分,所述第二化合物半导体层的暴露部分和所述第二电极的一部分, SOG层。
    • 2. 发明授权
    • Light emitting device and method of manufacturing the same
    • 发光元件及其制造方法
    • US08217407B2
    • 2012-07-10
    • US12957908
    • 2010-12-01
    • Yoshiaki WatanabeTomonori HinoNobukata OkanoHisayoshi KuramochiYuichiro KikuchiTatsuo Ohashi
    • Yoshiaki WatanabeTomonori HinoNobukata OkanoHisayoshi KuramochiYuichiro KikuchiTatsuo Ohashi
    • H01L21/00
    • H01L33/44H01L33/38
    • A method of manufacturing a light emitting device, including the steps of: (A) sequentially forming a first compound semiconductor layer of a first conduction type, an active layer, and a second compound semiconductor layer of a second conduction type different from said first conduction type, over a substrate; and (B) exposing a part of said first compound semiconductor layer, forming a first electrode over said exposed part of said first compound semiconductor layer and forming a second electrode over said second compound semiconductor layer, wherein said method further includes, subsequent to said step (B), the step of: (C) covering at least said exposed part of said first compound semiconductor layer, an exposed part of said active layer, an exposed part of said second compound semiconductor layer, and a part of said second electrode with an SOG layer.
    • 一种制造发光器件的方法,包括以下步骤:(A)顺序地形成第一导电类型的第一化合物半导体层,有源层和与所述第一导电不同的第二导电类型的第二化合物半导体层 类型,在基底上; 和(B)暴露所述第一化合物半导体层的一部分,在所述第一化合物半导体层的所述暴露部分上形成第一电极,并在所述第二化合物半导体层上形成第二电极,其中所述方法还包括,在所述步骤 (B)中,步骤:(C)至少覆盖所述第一化合物半导体层的所述暴露部分,所述有源层的暴露部分,所述第二化合物半导体层的暴露部分和所述第二电极的一部分, SOG层。
    • 3. 发明授权
    • Light emitting device and method of manufacturing the same
    • 发光元件及其制造方法
    • US07858418B2
    • 2010-12-28
    • US11873763
    • 2007-10-17
    • Yoshiaki WatanabeTomonori HinoNobukata OkanoHisayoshi KuramochiYuichiro KikuchiTatsuo Ohashi
    • Yoshiaki WatanabeTomonori HinoNobukata OkanoHisayoshi KuramochiYuichiro KikuchiTatsuo Ohashi
    • H01L21/00
    • H01L33/44H01L33/38
    • Herein disclosed a method of manufacturing a light emitting device, including the steps of: (A) sequentially forming a first compound semiconductor layer of a first conduction type, an active layer, and a second compound semiconductor layer of a second conduction type different from said first conduction type, over a substrate; and (B) exposing a part of said first compound semiconductor layer, forming a first electrode over said exposed part of said first compound semiconductor layer and forming a second electrode over said second compound semiconductor layer, wherein said method further includes, subsequent to said step (B), the step of: (C) covering at least said exposed part of said first compound semiconductor layer, an exposed part of said active layer, an exposed part of said second compound semiconductor layer, and a part of said second electrode with an SOG layer.
    • 本文公开了一种制造发光器件的方法,包括以下步骤:(A)顺序地形成第一导电类型的第一化合物半导体层,有源层和与所述第二导电类型不同的第二化合物半导体层 第一导电类型,在基板上; 和(B)暴露所述第一化合物半导体层的一部分,在所述第一化合物半导体层的所述暴露部分上形成第一电极,并在所述第二化合物半导体层上形成第二电极,其中所述方法还包括,在所述步骤 (B)中,步骤:(C)至少覆盖所述第一化合物半导体层的所述暴露部分,所述有源层的暴露部分,所述第二化合物半导体层的暴露部分和所述第二电极的一部分, SOG层。
    • 10. 发明授权
    • Optical semiconductor apparatus
    • 光半导体装置
    • US07196357B2
    • 2007-03-27
    • US11192727
    • 2005-07-29
    • Hironobu NaruiTomonori HinoNobukata OkanoJugo Mitomo
    • Hironobu NaruiTomonori HinoNobukata OkanoJugo Mitomo
    • H01L27/15H01L29/16H01L31/12H01L33/00
    • H01L31/16B82Y20/00G02B6/4214G02B6/4246H01L31/173H01S5/02284H01S5/0262H01S5/0425H01S5/183H01S5/3432H01S2301/176
    • The optical semiconductor apparatus includes, on an n-GaAs substrate, a surface-emitting semiconductor laser device and a photodiode integrated on the periphery of the laser device with an isolation region interposed there between. The laser device is composed of an n-DBR mirror, an active region, and a p-DBR mirror and includes a columnar layered structure with its sidewall covered with an insulating film. The photodiode is formed on the substrate and has a circular layered structure wherein an i-GaAs layer and a p-GaAs layer surrounds the laser device with an isolating region interposed between the i-GaAs and p-GaAs layers and the laser device. The diameter of the photodiode is smaller than the diameter of the optical fiber core optically coupled with the optical semiconductor apparatus. Since the laser device and the photodiode are monolithically integrated, the devices do not require optical alignment, and thus, facilitate optical coupling with an optical fiber.
    • 光学半导体装置在n-GaAs衬底上包括表面发射半导体激光器件和集成在激光器周围的光电二极管,其间隔着隔离区域。 激光装置由n-DBR反射镜,有源区和p-DBR反射镜组成,并且包括柱状分层结构,其侧壁被绝缘膜覆盖。 光电二极管形成在基板上,并且具有圆形层状结构,其中i-GaAs层和p-GaAs层围绕激光器件,其间插入在i-GaAs和p-GaAs层之间的隔离区域和激光器件。 光电二极管的直径小于与光半导体装置光耦合的光纤芯的直径。 由于激光器件和光电二极管是单片集成的,所以器件不需要光学对准,因此便于与光纤的光耦合。