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    • 1. 发明授权
    • T-gate forming method for high electron mobility transistor and gate structure thereof
    • 用于高电子迁移率晶体管的T型栅极形成方法及其栅极结构
    • US07932540B2
    • 2011-04-26
    • US11700946
    • 2007-02-01
    • Yoon-Ha JeongKang-Sung LeeYoung-Su KimYun-Ki HongSung-Woo Jung
    • Yoon-Ha JeongKang-Sung LeeYoung-Su KimYun-Ki HongSung-Woo Jung
    • H01L29/66
    • H01L29/7787H01L29/42316H01L29/66462
    • A T-gate forming method for a high electron mobility transistor includes the steps of: coating a first, a second and a third resist, each having an electron beam sensitivity different from each other, on a semiconductor substrate; performing a first exposure process by using an electron beam on the semiconductor substrate and then selectively developing the third resist; defining a gate head area by selectively developing the second resist to have a developed width wider than that of the third resist; performing a second exposure process by using an electron beam on the semiconductor substrate and then selectively developing the first resist in a bent shape at a temperature lower than in the development of the second and the third steps; and depositing metallic materials on the resists and then removing them to form a T-gate.
    • 一种用于高电子迁移率晶体管的T形栅形成方法包括以下步骤:在半导体衬底上涂覆各自具有彼此不同的电子束灵敏度的第一,第二和第三抗蚀剂; 通过在半导体衬底上使用电子束然后选择性地显影第三抗蚀剂来执行第一曝光处理; 通过选择性地显影所述第二抗蚀剂来限定栅极头区域,以具有比所述第三抗蚀剂宽的显影宽度; 通过在半导体衬底上使用电子束进行第二曝光处理,然后在低于第二和第三步骤的显影的温度下,以弯曲形状选择性地显影第一抗蚀剂; 并将金属材料沉积在抗蚀剂上,然后去除它们以形成T形栅极。
    • 2. 发明申请
    • T-gate forming method for high electron mobility transistor and gate structure thereof
    • 用于高电子迁移率晶体管的T型栅极形成方法及其栅极结构
    • US20080108188A1
    • 2008-05-08
    • US11700946
    • 2007-02-01
    • Yoon-Ha JeongKang-Sung LeeYoung-Su KimYun-Ki HongSung-Woo Jung
    • Yoon-Ha JeongKang-Sung LeeYoung-Su KimYun-Ki HongSung-Woo Jung
    • H01L21/338
    • H01L29/7787H01L29/42316H01L29/66462
    • A T-gate forming method for a high electron mobility transistor includes the steps of: coating a first, a second and a third resist, each having an electron beam sensitivity different from each other, on a semiconductor substrate; performing a first exposure process by using an electron beam on the semiconductor substrate and then selectively developing the third resist; defining a gate head area by selectively developing the second resist to have a developed width wider than that of the third resist; performing a second exposure process by using an electron beam on the semiconductor substrate and then selectively developing the first resist in a bent shape at a temperature lower than in the development of the second and the third steps; and depositing metallic materials on the resists and then removing them to form a T-gate.
    • 一种用于高电子迁移率晶体管的T形栅形成方法包括以下步骤:在半导体衬底上涂覆各自具有彼此不同的电子束灵敏度的第一,第二和第三抗蚀剂; 通过在半导体衬底上使用电子束然后选择性地显影第三抗蚀剂来执行第一曝光处理; 通过选择性地显影所述第二抗蚀剂来限定栅极头区域,以具有比所述第三抗蚀剂宽的显影宽度; 通过在半导体衬底上使用电子束进行第二曝光处理,然后在低于第二和第三步骤的显影的温度下,以弯曲形状选择性地显影第一抗蚀剂; 并将金属材料沉积在抗蚀剂上,然后去除它们以形成T形栅极。