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1. 发明授权

US08894477B2 Display device 有权
标题翻译：显示设备
公开(公告)号：US08894477B2
公开(公告)日：2014-11-25
申请号：US12956185
申请日：2010-11-30
申请人： Yong-soo Lee , Min-soo Kim , Seung-won Shin , Ha-seung Chung , Moon-chul Lee
发明人： Yong-soo Lee , Min-soo Kim , Seung-won Shin , Ha-seung Chung , Moon-chul Lee
IPC分类号： H05K5/00 , H05K7/20
CPC分类号： H05K7/20972
摘要： A display device including a case having a transparent window that forms one side of a first air flow path, a display unit including a display surface that faces the transparent window to form the other side of the first air flow path, a ventilator to supply air to the first air flow path, and a diffuser disposed at an exit of the first air flow path and having a cross-sectional area that is gradually increased.
摘要翻译：一种显示装置，包括具有形成第一空气流路的一侧的透明窗口的壳体，包括面向透明窗口以形成第一空气流路的另一侧的显示面的显示单元，供给空气的通风机以及设置在第一空气流路的出口处并具有逐渐增加的横截面积的扩散器。

2. 发明授权

US08254121B2 Cooler and display device having the same 有权
标题翻译：具有相同的冷却器和显示装置
公开(公告)号：US08254121B2
公开(公告)日：2012-08-28
申请号：US12868061
申请日：2010-08-25
申请人： Moon-chul Lee , Min-soo Kim , Yong-soo Lee , Sru Kim
发明人： Moon-chul Lee , Min-soo Kim , Yong-soo Lee , Sru Kim
IPC分类号： H05K7/20 , F01D9/00
CPC分类号： H05K7/20972 , F04D25/166 , F04D29/441 , F04D29/444 , F05D2250/52 , H05K7/20172
摘要： A cooler and a display device including the cooler. The cooler includes: a housing; an air blowing unit disposed inside the housing and sucking external air and blowing the external air in the housing, wherein the air blowing unit includes a plurality of groups each including two air blowers; a guide vane disposed above the air blowing unit and to guide air flowed out from the air blowing unit to flow in different directions; and a plurality of auxiliary guide vanes disposed between the air blowing unit and the guide vane, and each disposed in each of the groups each including two air blowers, so as to guide air flowing below the air blowing unit to flow toward the guide vane.
摘要翻译：一种冷却器和包括该冷却器的显示装置。冷却器包括：一个外壳; 吹风单元，其设置在所述壳体内部并吸入外部空气并吹送所述壳体中的外部空气，其中所述吹风单元包括多个组，每组包括两个鼓风机; 引导叶片，其设置在所述吹风单元的上方，并且引导从所述送风单元流出的空气沿不同方向流动; 以及设置在送风单元和导向叶片之间的多个辅助导向叶片，并且每个辅助导向叶片各自设置在每个组中，每个组包括两个鼓风机，以便引导在吹风单元下方流动的空气流向导向叶片。

3. 发明申请

US20090047605A1 METHOD OF MANUFACTURING PHOTOSENSITIVE EPOXY STRUCTURE USING PHOTOLITHOGRAPHY PROCESS AND METHOD OF MANUFACTURING INKJET PRINTHEAD USING THE METHOD OF MANUFACTURING PHOTOSENSITIVE EPOXY STRUCTURE 有权
标题翻译：使用光刻方法制造感光环氧结构的方法和使用制造光敏环氧结构的方法制造喷墨印刷方法
公开(公告)号：US20090047605A1
公开(公告)日：2009-02-19
申请号：US11968809
申请日：2008-01-03
申请人： Moon-chul Lee , Yong-seop Yoon , Min-soo Kim , Yong-won Jeong , Dong-sik Shim
发明人： Moon-chul Lee , Yong-seop Yoon , Min-soo Kim , Yong-won Jeong , Dong-sik Shim
IPC分类号： G03F7/22 , G03F7/26
CPC分类号： G03F7/203 , B41J2/1603 , B41J2/162 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2002/14475
摘要： Provided are a method of manufacturing a photosensitive epoxy structure using a photolithograph process, and a method of manufacturing an inkjet printhead using the method of manufacturing a photosensitive epoxy structure. The method of manufacturing the photosensitive epoxy structure includes forming an epoxy material layer formed of photosensitive epoxy; forming a first exposure pattern in the epoxy material layer by performing a first exposure operation; forming a second exposure pattern in the non-exposed portions of the epoxy material layer by performing a second exposure operation; and developing the epoxy material layer, wherein the amount of first UV energy used in the first exposure operation is different from the amount of second UV energy used in the second exposure operation.
摘要翻译：提供了使用光刻工艺制造光敏环氧树脂结构的方法，以及使用制造光敏环氧树脂结构的方法制造喷墨打印头的方法。制造感光环氧树脂结构的方法包括形成由光敏环氧树脂形成的环氧树脂材料层; 通过进行第一曝光操作在环氧树脂材料层中形成第一曝光图案; 通过进行第二曝光操作在所述环氧树脂材料层的未曝光部分中形成第二曝光图案; 以及显影环氧材料层，其中在第一曝光操作中使用的第一UV能量的量与在第二曝光操作中使用的第二UV能量的量不同。

4. 发明授权

US08114578B2 Method of manufacturing photosensitive epoxy structure using photolithography process and method of manufacturing inkjet printhead using the method of manufacturing photosensitive epoxy structure 有权
标题翻译：使用光刻工艺制造感光性环氧树脂结构的方法和使用制造感光性环氧树脂结构的方法制造喷墨打印头的方法
公开(公告)号：US08114578B2
公开(公告)日：2012-02-14
申请号：US11968809
申请日：2008-01-03
申请人： Moon-chul Lee , Yong-seop Yoon , Min-soo Kim , Yong-won Jeong , Dong-sik Shim
发明人： Moon-chul Lee , Yong-seop Yoon , Min-soo Kim , Yong-won Jeong , Dong-sik Shim
IPC分类号： B41J2/16
CPC分类号： G03F7/203 , B41J2/1603 , B41J2/162 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2002/14475
摘要： Provided are a method of manufacturing a photosensitive epoxy structure using a photolithograph process, and a method of manufacturing an inkjet printhead using the method of manufacturing a photosensitive epoxy structure. The method of manufacturing the photosensitive epoxy structure includes forming an epoxy material layer formed of photosensitive epoxy; forming a first exposure pattern in the epoxy material layer by performing a first exposure operation; forming a second exposure pattern in the non-exposed portions of the epoxy material layer by performing a second exposure operation; and developing the epoxy material layer, wherein the amount of first UV energy used in the first exposure operation is different from the amount of second UV energy used in the second exposure operation.
摘要翻译：提供了使用光刻工艺制造光敏环氧树脂结构的方法，以及使用制造光敏环氧树脂结构的方法制造喷墨打印头的方法。制造感光环氧树脂结构的方法包括形成由光敏环氧树脂形成的环氧树脂材料层; 通过进行第一曝光操作在环氧树脂材料层中形成第一曝光图案; 通过进行第二曝光操作在所述环氧树脂材料层的未曝光部分中形成第二曝光图案; 以及显影环氧材料层，其中在第一曝光操作中使用的第一UV能量的量与在第二曝光操作中使用的第二UV能量的量不同。

5. 发明授权

US08066356B2 Thermal inkjet print head 失效
标题翻译：热喷墨打印头
公开(公告)号：US08066356B2
公开(公告)日：2011-11-29
申请号：US12209775
申请日：2008-09-12
申请人： Moon-chul Lee , Yong-seop Yoon , Yong-won Jeong , Dong-sik Shim , Sung-joon Park , Jong-seok Kim
发明人： Moon-chul Lee , Yong-seop Yoon , Yong-won Jeong , Dong-sik Shim , Sung-joon Park , Jong-seok Kim
IPC分类号： B41J2/05 , B41J2/04
CPC分类号： B41J2/1404 , B41J2/14129 , B41J2/17563 , B41J2002/14403
摘要： A thermal inkjet printhead is provided including a substrate, and a chamber layer, which is stacked on the substrate. The chamber layer includes an ink chamber that is filled with ink supplied from an ink feed hole. The printhead includes a heater inside the ink chamber that heats the ink, an island, which is formed on the substrate at an ink inlet port of the ink chamber, and a nozzle layer, which is stacked on the chamber layer, including a nozzle for ejecting the ink. The walls of the ink chamber and the island that face each other are symmetrical with respect to the center of the nozzle.
摘要翻译：提供一种热喷墨打印头，包括基板和层叠在基板上的室层。室层包括填充有从供墨孔供应的油墨的油墨室。打印头包括在油墨室内加热油墨的加热器，在油墨室的墨水入口处形成在基板上的岛和层叠在室层上的喷嘴层，其包括用于喷墨。相对于喷嘴的中心，墨水室和彼此面对的岛的壁是对称的。

6. 发明授权

US07926165B2 Micro antenna and method of manufacturing the same 失效
标题翻译：微天线及其制造方法
公开(公告)号：US07926165B2
公开(公告)日：2011-04-19
申请号：US11712526
申请日：2007-03-01
申请人： Young-tack Hong , Moon-chul Lee , In-sang Song , Sang-wook Kwon , Chang-won Jung , Eun-seok Park
发明人： Young-tack Hong , Moon-chul Lee , In-sang Song , Sang-wook Kwon , Chang-won Jung , Eun-seok Park
IPC分类号： H01P11/00 , H01Q13/00 , H01Q17/00 , H01Q1/36 , H05K3/36 , H01K3/10
CPC分类号： H01Q1/2283 , H01F17/0033 , H01F41/041 , H01Q1/362 , Y10T29/49016 , Y10T29/49018 , Y10T29/49126 , Y10T29/49165
摘要： A method of manufacturing a micro antenna is provided. The method includes forming a plurality of holes penetrating a first substrate, filling each of the plurality of holes with a conductive material to form a plurality of vertical conducting parts, forming a plurality of horizontal conducting parts on each of two different surfaces of the first substrate, wherein the each of the horizontal conducting parts is electrically connected to the corresponding vertical conducting parts, bonding the first substrate, on which the vertical conducting parts and the horizontal conducting parts have been formed, to a second substrate, and removing the first substrate to expose a whole structure of a 3D micro antenna which is formed on the second substrate and includes the vertical conducting parts and the horizontal conducting parts connected to each other.
摘要翻译：提供一种制造微型天线的方法。该方法包括：形成穿过第一基板的多个孔，用导电材料填充多个孔中的每个孔，以形成多个垂直导电部分，在第一基板的两个不同表面的每一个上形成多个水平导电部件其中，每个水平导电部分电连接到相应的垂直导电部分，将其上形成有垂直导电部分和水平导电部分的第一基板接合到第二基板，并且将第一基板去除露出形成在第二基板上的3D微型天线的整体结构，并且包括彼此连接的垂直导电部分和水平导电部件。

7. 发明申请

US20110020140A1 MICRO PUMP 有权
标题翻译：微型泵
公开(公告)号：US20110020140A1
公开(公告)日：2011-01-27
申请号：US11266903
申请日：2005-11-04
申请人： Tae-sik Park , Young-il Kim , Jung-ho Kang , Moon-chul Lee
发明人： Tae-sik Park , Young-il Kim , Jung-ho Kang , Moon-chul Lee
IPC分类号： F04B37/02
CPC分类号： F04B19/006 , F04B43/043
摘要： Provided is a micro pump having a simple structure. The micro pump includes a pump chamber including inflow and outflow passages through which a drive fluid flows, a first valve configured to open or close the inflow passage, a second valve configured to open or close the outflow passage, and a pump chamber heating and cooling unit configured to heat or cool the pump chamber.
摘要翻译：提供一种结构简单的微型泵。微型泵包括泵室，其包括驱动流体流过的流入和流出通道，构造成打开或关闭流入通道的第一阀，构造成打开或关闭流出通道的第二阀，以及泵室加热和冷却单元被配置为加热或冷却泵室。

8. 发明授权

US07862150B2 Inkhead printhead configured to overcome impaired print quality due to nozzle blockage, printing method using the same, and method of manufacturing the inkjet printhead 有权
标题翻译：喷墨头打印头被配置为克服由于喷嘴堵塞而导致的打印质量受损，使用其的打印方法以及制造喷墨打印头的方法
公开(公告)号：US07862150B2
公开(公告)日：2011-01-04
申请号：US11859885
申请日：2007-09-24
申请人： Moon-chul Lee , Myong-jong Kwon , Yong-seop Yoon , Jin-wook Lee , Yong-won Jeong , Donk-sik Shim
发明人： Moon-chul Lee , Myong-jong Kwon , Yong-seop Yoon , Jin-wook Lee , Yong-won Jeong , Donk-sik Shim
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： B41J2/1404 , B41J2/14129 , B41J2/1603 , B41J2/1626 , B41J2/1632 , B41J2/1639 , B41J2/2139 , B41J2/515
摘要： The inkjet printhead includes substrate having an ink feed hole formed to supply ink, a chamber layer stacked on the substrate, and including a plurality of main ink chambers formed therein with the ink feed hole therebetween and a plurality of compensation ink chambers formed therein between the main ink chambers that face each other; and a nozzle layer stacked on the chamber layer, and including a plurality of main nozzles corresponding to the main ink chambers and a plurality of compensation nozzles corresponding to the compensation ink chambers.
摘要翻译：喷墨打印头包括具有形成为供墨的供墨孔的基板，层叠在基板上的室层，并且在其间形成有供墨孔的多个主墨室和在其间形成的多个补偿墨室，相互面对的主墨室; 以及层叠在所述室层上的喷嘴层，并且包括对应于所述主油墨室的多个主喷嘴和对应于所述补偿油墨室的多个补偿喷嘴。

9. 发明授权

US07545017B2 Wafer level package for surface acoustic wave device and fabrication method thereof 有权
标题翻译：用于表面声波器件的晶片级封装及其制造方法
公开(公告)号：US07545017B2
公开(公告)日：2009-06-09
申请号：US11447969
申请日：2006-06-07
申请人： Moon-chul Lee , Jun-sik Hwang , Ji-hyuk Lim , Woon-bae Kim
发明人： Moon-chul Lee , Jun-sik Hwang , Ji-hyuk Lim , Woon-bae Kim
IPC分类号： H01L29/84
CPC分类号： H03H9/1092 , H01L2224/48091 , H01L2224/48227 , H01L2924/16195 , H01L2924/00014
摘要： A wafer level package for a surface acoustic wave (SAW) device and a fabrication method thereof. The SAW device wafer level package includes a SAW device in which a SAW element is formed on a top surface of a device wafer, a cap wafer which is bonded with a top surface of the SAW device and has a viahole penetrating the cap wafer, and a conductive member to fill a part of the viahole. The viahole has a first via portion and a second via portion, the first via portion has a gradually smaller diameter from a bottom surface of the cap wafer until a certain depth, and the second via portion has a gradually greater diameter from the first via portion until a top surface of the cap wafer.
摘要翻译：一种用于表面声波（SAW）器件的晶片级封装及其制造方法。 SAW器件晶片级封装包括SAW器件，其中SAW元件形成在器件晶片的顶表面上，盖晶片与SAW器件的顶表面结合并具有穿透盖晶片的通孔，以及用于填充通孔的一部分的导电构件。通孔具有第一通孔部分和第二通孔部分，第一通孔部分具有从盖子晶片的底表面到一定深度的逐渐变小的直径，并且第二通孔部分具有从第一通孔部分直到盖晶片的顶表面。

10. 发明授权

US07408434B2 Inductor embedded in substrate, manufacturing method thereof, micro device package, and manufacturing method of cap for micro device package 有权
标题翻译：嵌入基板的电感器，其制造方法，微器件封装以及用于微器件封装的帽的制造方法
公开(公告)号：US07408434B2
公开(公告)日：2008-08-05
申请号：US11400637
申请日：2006-04-10
申请人： Moon-chul Lee , Jong-oh Kwon , Woon-bae Kim , Jea-shik Shin , Jun-sik Hwang , Eun-sung Lee
发明人： Moon-chul Lee , Jong-oh Kwon , Woon-bae Kim , Jea-shik Shin , Jun-sik Hwang , Eun-sung Lee
IPC分类号： H01F5/00 , H01L23/02
CPC分类号： H01F17/0006 , H01F41/041 , H01F2017/0046 , H01L27/08 , Y10T29/4902 , Y10T29/4906 , Y10T29/49064 , Y10T29/49073 , Y10T29/49155 , Y10T29/49165
摘要： An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil electrode. The inductor-embedded substrate can be used as a cap for a micro device package by forming a cavity on its bottom surface.
摘要翻译：嵌入基板的电感器，包括基板，通过在形成在基板上的螺旋孔中填充金属而形成的线圈电极，形成在基板上的绝缘层，以及形成在绝缘层上的外部连接焊盘，以连接到线圈电极。电感器嵌入式基板可以通过在其底表面上形成空腔而用作微器件封装的帽。

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