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1. 发明申请

US20060030134A1 Ion sources and ion implanters and methods including the same 审中-公开
标题翻译：离子源和离子注入机及包括其的方法
公开(公告)号：US20060030134A1
公开(公告)日：2006-02-09
申请号：US11178579
申请日：2005-07-11
申请人： Yong-Kwon Kim , Jae-Chul Lee , Sung-Ho Kang , Sang-Chul Lee , Ui-Yong Jeoung
发明人： Yong-Kwon Kim , Jae-Chul Lee , Sung-Ho Kang , Sang-Chul Lee , Ui-Yong Jeoung
IPC分类号： H01L21/425 , C23C14/00
CPC分类号： H01J27/08 , H01J37/08 , H01J37/3171 , H01J37/3233 , H01J37/3244 , H01J2237/082
摘要： An ion source for ionizing a source gas includes an arc chamber housing defining an arc chamber to receive the source gas. The arc chamber has a first region and a second region. An electron emitting device is disposed in the arc chamber adjacent the first region and is adapted to emit electrons into the first and the second regions to ionize the source gas. An electron returning device is disposed in the arc chamber adjacent the second region and is adapted to return at least some of the electrons emitted from the electron emitting device into the second region. A gas supply system is adapted to direct the source gas into the first region and into the second region. According to some embodiments, the gas supply system is adapted to provide a greater mass flow rate of the source gas into the first and second regions than is provided into other regions of the arc chamber.
摘要翻译：用于电离源气体的离子源包括限定用于接收源气体的电弧室的电弧室壳体。电弧室具有第一区域和第二区域。电弧发射装置设置在与第一区域相邻的电弧室中，并且适于将电子发射到第一和第二区域以离子化源气体。电子返回装置设置在与第二区域相邻的电弧室中，并且适于将从电子发射器件发射的至少一些电子返回到第二区域。气体供应系统适于将源气体引导到第一区域并进入第二区域。根据一些实施例，气体供应系统适于提供比提供到电弧室的其它区域更大的源气体到第一和第二区域的质量流量。

2. 发明授权

US6064119A Wiring structure and formation method thereof for semiconductor device 失效
标题翻译：半导体器件的布线结构及其形成方法
公开(公告)号：US6064119A
公开(公告)日：2000-05-16
申请号：US79264
申请日：1998-05-15
申请人： Young-Kwon Jun , Yong-Kwon Kim
发明人： Young-Kwon Jun , Yong-Kwon Kim
IPC分类号： H01L21/28 , H01L21/311 , H01L21/768 , H01L23/522 , H01L23/48
CPC分类号： H01L23/5226 , H01L21/31116 , H01L21/76804 , H01L2924/0002
摘要： A wiring structure of a semiconductor device includes a substrate; a first conductive layer formed in the substrate; an insulation film formed on the substrate including the first conductive layer and having a contact hole therein through which the upper surface of the first conductive layer is exposed, wherein the contact hole includes an upper contact hole and a lower contact hole having a shape undercut into the insulation film and thus being wider than the upper contact hole; and a second conductive layer formed on the insulation film so as to thoroughly fill the contact hole and electrically connected to the first conductive layer.
摘要翻译：半导体器件的布线结构包括：衬底; 形成在所述基板中的第一导电层; 形成在所述基板上的绝缘膜，所述绝缘膜包括所述第一导电层，并且在其中暴露所述第一导电层的上表面的接触孔，所述接触孔包括上接触孔和下接触孔，绝缘膜，因此比上接触孔宽; 以及形成在所述绝缘膜上的第二导电层，以充分填充所述接触孔并电连接到所述第一导电层。

3. 发明授权

US5944580A Sensing device and method of leveling a semiconductor wafer 失效
标题翻译：半导体晶片调平装置及方法
公开(公告)号：US5944580A
公开(公告)日：1999-08-31
申请号：US889476
申请日：1997-07-08
申请人： Yong-Kwon Kim , Jun-Yong Kim
发明人： Yong-Kwon Kim , Jun-Yong Kim
IPC分类号： B24B37/07 , B24B49/16 , H01L21/304 , H01L21/306 , B24B29/02
CPC分类号： H01L21/02024 , B24B37/04 , B24B49/16
摘要： An improved sensing device and method for leveling a semiconductor wafer in a chemical mechanical polishing apparatus, which easily detects the change of pressure from a semiconductor wafer contacting with the polishing surface. The present invention includes a polishing platen having a polishing pad on the upper leveled surface thereof, and fixed to a rotatable platen driving shaft. A carrier is rotatably provided on the upper surface of the polishing platen and holding the semiconductor wafer such that the lower surface of the semiconductor wafer is uniformly contacted with the polishing pad. A pressure detecting sensor senses the pressure applied from the semiconductor wafer on the polishing pad and outputs a corresponding signal.
摘要翻译：一种用于在化学机械抛光装置中调平半导体晶片的改进的感测装置和方法，其容易地检测来自与抛光表面接触的半导体晶片的压力变化。本发明包括具有在其上平面上的抛光垫并且固定到可旋转的压板驱动轴的抛光台板。载体可旋转地设置在研磨台板的上表面上并保持半导体晶片，使得半导体晶片的下表面与抛光垫均匀地接触。压力检测传感器感测从抛光垫上的半导体晶片施加的压力，并输出相应的信号。

4. 发明授权

US5874357A Method of forming wiring structure of semiconductor device 失效
标题翻译：形成半导体器件布线结构的方法
公开(公告)号：US5874357A
公开(公告)日：1999-02-23
申请号：US770158
申请日：1996-12-19
申请人： Young-Kwon Jun , Yong-Kwon Kim
发明人： Young-Kwon Jun , Yong-Kwon Kim
IPC分类号： H01L21/28 , H01L21/311 , H01L21/768 , H01L23/522 , H01L21/4763
CPC分类号： H01L23/5226 , H01L21/31116 , H01L21/76804 , H01L2924/0002
摘要： A wiring structure of a semiconductor device includes a substrate; a first conductive layer formed in the substrate; an insulation film formed on the substrate including the first conductive layer and having a contact hole therein through which the upper surface of the first conductive layer is exposed, wherein the contact hole includes an upper contact hole and a lower contact hole having a shape undercut into the insulation film and thus being wider than the upper contact hole; and a second conductive layer formed on the insulation film so as to thoroughly fill the contact hole and electrically connected to the first conductive layer.
摘要翻译：半导体器件的布线结构包括：衬底; 形成在所述基板中的第一导电层; 形成在所述基板上的绝缘膜，所述绝缘膜包括所述第一导电层，并且在其中暴露所述第一导电层的上表面的接触孔，所述接触孔包括上接触孔和下接触孔，绝缘膜，因此比上接触孔宽; 以及形成在所述绝缘膜上的第二导电层，以充分填充所述接触孔并电连接到所述第一导电层。

5. 发明授权

US5707274A Chemical mechanical polishing apparatus for semiconductor wafer 失效
标题翻译：半导体晶圆化学机械抛光装置
公开(公告)号：US5707274A
公开(公告)日：1998-01-13
申请号：US756559
申请日：1996-11-26
申请人： Yong-Kwon Kim , Young-Kwon Jun
发明人： Yong-Kwon Kim , Young-Kwon Jun
IPC分类号： B24B37/00 , B24B37/10 , B24B37/20 , B24B37/24 , B24B41/04 , H01L21/304 , B24B5/00
CPC分类号： H01L21/02024 , B24B37/04 , B24B41/04
摘要： A chemical mechanical polishing apparatus for a semiconductor wafer which is capable of polishing uniformly the surface of the semiconductor wafer and of controlling the polishing amount by providing plurality of rotary drums each wrapped in a polishing cloth on the upper surface of a polishing pad and connecting supporters capable of vertical movement to both ends each rotary drum, and includes a rotatable polishing pad in the planar upper surface of which a plurality of recesses are formed for receiving a semiconductor wafer, a plurality of rotatable polishing units located on the polishing pad for planarizing the surface of the semiconductor wafers, a supporter connected at the endpoints of the rotational polishing units which can make a vertical movement, and a slurry applicator located above the rotational polishing units for putting a slurry thereon.
摘要翻译：一种用于半导体晶片的化学机械抛光装置，其能够均匀地研磨半导体晶片的表面，并且通过在抛光垫的上表面上设置多个旋转滚筒并将其包裹在研磨布上并连接支撑件能够垂直移动到每个旋转鼓的两端，并且在其平面上表面中包括可旋转的抛光垫，其中形成有多个凹部用于接纳半导体晶片;多个可旋转的抛光单元，位于抛光垫上，用于将半导体晶片的表面，连接在可以进行垂直运动的旋转抛光单元的端点处的支撑件，以及位于旋转抛光单元上方以在其上放置浆料的浆料施加器。

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