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    • 1. 发明申请
    • Method for manufacturing transistor in semiconductor device
    • 在半导体器件中制造晶体管的方法
    • US20060211185A1
    • 2006-09-21
    • US11154458
    • 2005-06-16
    • Yong KimSe JangJae Oh
    • Yong KimSe JangJae Oh
    • H01L21/84H01L21/00
    • H01L21/823437H01L21/823412H01L21/823425H01L29/66537H01L29/6659H01L29/66621H01L29/7834
    • Disclosed herein is a method for manufacturing a transistor in a semiconductor device, which can improve the refresh characteristics of the device. The method comprises the steps of: providing a silicon substrate having active and field regions defined thereon; performing a first channel ion implantation process into the silicon substrate; sequentially forming a hard mask film and a photoresist pattern exposing a gate formation region on the substrate into which the first channel ion implantation process has been performed; performing a second channel ion implantation process into the substrate at a higher concentration than that of the first ion implantation process using the photoresist pattern as an ion implantation mask, so as to form doped regions in the substrate at the gate formation region and both sides adjacent thereto; etching a hard mask film using the photoresist pattern as an etch barrier; removing the photoresist pattern; etching the substrate using a portion of the hard mask film remaining after the etching as an etch barrier, so as to form a groove; removing the hard mask film remaining after the etching; forming a gate in the groove of the substrate from which the hard mask film has been removed; and forming source and drain regions on the substrate at both sides of the gate.
    • 这里公开了一种用于制造半导体器件中的晶体管的方法,其可以提高器件的刷新特性。 该方法包括以下步骤:提供其上限定有活性和场区的硅衬底; 对硅衬底进行第一沟道离子注入工艺; 顺序地形成硬掩模膜和曝光已经进行了第一沟道离子注入工艺的衬底上的栅极形成区的光致抗蚀剂图案; 以比使用光致抗蚀剂图案作为离子注入掩模的第一离子注入工艺更高的浓度进行衬底中的第二沟道离子注入工艺,以便在栅极形成区域和两侧相邻的衬底中形成掺杂区域 到; 使用光致抗蚀剂图案蚀刻硬掩模膜作为蚀刻阻挡层; 去除光致抗蚀剂图案; 使用蚀刻后残留的硬掩模膜的一部分作为蚀刻阻挡层蚀刻基板,以形成凹槽; 去除蚀刻后残留的硬掩模膜; 在已经去除了硬掩模膜的基板的凹槽中形成栅极; 以及在栅极两侧的衬底上形成源区和漏区。
    • 2. 发明申请
    • Method of fabricating a transistor having a triple channel in a memory device
    • 在存储器件中制造具有三通道的晶体管的方法
    • US20060246671A1
    • 2006-11-02
    • US11155833
    • 2005-06-17
    • Se JangYong KimJae Oh
    • Se JangYong KimJae Oh
    • H01L21/336H01L21/76
    • H01L29/7851H01L27/105H01L27/1052H01L27/10876H01L27/10879H01L29/66621H01L29/66795
    • Disclosed is a method for fabricating a transistor of a memory device capable of preventing voids from being created when forming a low-resistant gate electrode. The method includes the steps of forming an active area by etching a semiconductor substrate, forming a field oxide layer in the semiconductor substrate and forming a recess by etching the field oxide layer. A gate insulation layer is formed along an upper surface of the active area and an exposed portion of the active area. A gate electrode is formed on the field oxide layer such that the gate electrode extends across an upper portion of the active area while being overlapped with a channel area and the recess. The first conductive layer to be patterned has the same thickness, so the low-resistant gate electrode is easily fabricated without forming the voids.
    • 公开了一种制造存储器件的晶体管的方法,该方法能够防止在形成低电阻栅电极时产生空隙。 该方法包括以下步骤:通过蚀刻半导体衬底形成有源区,在半导体衬底中形成场氧化物层,并通过蚀刻场氧化物层形成凹陷。 栅极绝缘层沿有源区的上表面和有源区的暴露部分形成。 栅极电极形成在场氧化物层上,使得栅极电极延伸跨过有源区域的上部,同时与沟道区域和凹部重叠。 待图案化的第一导电层具有相同的厚度,因此在不形成空隙的情况下容易地制造低电阻栅电极。
    • 4. 发明申请
    • Method for forming pattern and method for fabricating LCD device using the same
    • 用于形成图案的方法和使用其制造LCD装置的方法
    • US20070148603A1
    • 2007-06-28
    • US11640985
    • 2006-12-19
    • Hye LeeJae Oh
    • Hye LeeJae Oh
    • G03F7/26
    • G03F7/0007G02F1/133512G02F1/133516G03F7/11G03F7/42
    • A method for forming a pattern and a method for fabricating an LCD device using the same is disclosed, wherein a photoresist layer is removed from a substrate without using a photoresist stripper, so that the pattern is formed with a low fabrication costs. The method comprising sequentially forming a pattern material layer, a transformed material layer and a photoresist layer on a substrate; patterning the photoresist layer by exposure and development using a mask; selectively etching the transformed material layer and the pattern material layer by using the patterned photoresist layer as a mask; and removing the transformed material layer and the patterned photoresist layer in a lift-off method by applying light.
    • 公开了一种用于形成图案的方法和使用该图案的LCD器件的制造方法,其中在不使用光致抗蚀剂剥离器的情况下从衬底去除光致抗蚀剂层,从而以低制造成本形成图案。 该方法包括在衬底上依次形成图案材料层,变形材料层和光致抗蚀剂层; 通过使用掩模的曝光和显影来图案化光致抗蚀剂层; 通过使用图案化的光致抗蚀剂层作为掩模来选择性地蚀刻变形材料层和图案材料层; 以及通过施加光而以剥离方法去除转化的材料层和图案化的光致抗蚀剂层。