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1. 发明申请

US20100115433A1 METHOD FOR DISPLAYING DEVICE CONNECTED MEDIA SIGNAL SINK AND MEDIA SIGNAL SINK THEREOF 有权
标题翻译：用于显示设备连接的媒体信号的方法和与其相关的媒体信号
公开(公告)号：US20100115433A1
公开(公告)日：2010-05-06
申请号：US12523269
申请日：2008-01-25
申请人： Yong Dong Lee , Jae Min Choi , Ja Min Ha , Jae Kyung Lee
发明人： Yong Dong Lee , Jae Min Choi , Ja Min Ha , Jae Kyung Lee
IPC分类号： G06F3/048
CPC分类号： H04N5/765 , H04L12/2809 , H04L12/2814 , H04N5/4403 , H04N5/44543 , H04N5/782 , H04N5/85 , H04N21/4108 , H04N21/43615 , H04N21/43635 , H04N21/4622
摘要： Disclosed herein are a media signal sink (100) having a graphic user interface (GUI) function and a method for displaying devices connected thereto. In a method for operating a media signal sink (100) connected with one or more signal sources (200,202,204,206,208) each having one or more devices, the display method includes checking connection states of the signal sources (200,202,204,206,208) to the signal sink (100), and displaying menu items of the devices of the signal sources (200,202,204,206,208) connected to the signal sink (100) in a GUI screen, based on a result of the connection state check. In the GUI screen, menu items of the same type of devices, among the devices of the signal sources (200,202,204,206,208), are displayed under the condition that they are grouped into one group. Also, in the GUI screen, menu items of devices corresponding to the same type of signal sources are displayed under the condition that they are grouped into one group.
摘要翻译：这里公开了具有图形用户界面（GUI）功能的媒体信号接收器（100）和用于显示与其连接的装置的方法。在一种用于操作与每个具有一个或多个设备的一个或多个信号源（200,202,204,206,208）连接的媒体信号宿（100）的方法中，所述显示方法包括检查信号宿（100）的信号源（200,202,206,208）的连接状态，并且基于连接状态检查的结果，在GUI屏幕中显示连接到信号宿（100）的信号源（200,202,204,206,208）的设备的菜单项。在GUI屏幕中，信号源（200,202,204,206,208）的设备中相同类型的设备的菜单项被显示在它们被分组成一组的条件下。此外，在GUI画面中，在将它们分组成一组的条件下，显示对应于相同类型的信号源的设备的菜单项。

2. 发明授权

US07387917B2 BGA package substrate and method of fabricating same 失效
标题翻译： BGA封装基板及其制造方法
公开(公告)号：US07387917B2
公开(公告)日：2008-06-17
申请号：US11086625
申请日：2005-03-22
申请人： Jae Min Choi , Young Hwan Shin
发明人： Jae Min Choi , Young Hwan Shin
IPC分类号： H01L21/00
CPC分类号： H01L23/49827 , H01L21/4857 , H01L21/486 , H01L23/49816 , H01L23/49822 , H01L23/49833 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05644 , H01L2224/05647 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/15311 , H01L2924/19043 , H05K1/113 , H05K3/4614 , H05K3/4623 , H05K2201/0394 , H05K2201/09509 , H05K2201/09527 , H05K2201/10378 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： Disclosed is a ball grid array (BGA) package substrate, in which a wire bonding pad and a solder ball pad are formed on a via hole, making high freedom in design of a circuit pattern and a high density circuit pattern possible, and a method of fabricating the same.
摘要翻译：公开了一种球栅阵列（BGA）封装基板，其中引线接合焊盘和焊球焊盘形成在通孔上，使电路图案的设计和高密度电路图案具有高自由度，以及方法的制造。

3. 发明申请

US20080223610A1 BGA PACKAGE SUBSTRATE AND METHOD OF FABRICATING SAME 审中-公开
标题翻译： BGA封装基板及其制造方法
公开(公告)号：US20080223610A1
公开(公告)日：2008-09-18
申请号：US12116679
申请日：2008-05-07
申请人： Jae Min Choi , Young Hwan Shin
发明人： Jae Min Choi , Young Hwan Shin
IPC分类号： H01R12/04
CPC分类号： H01L23/49827 , H01L21/4857 , H01L21/486 , H01L23/49816 , H01L23/49822 , H01L23/49833 , H01L24/48 , H01L24/73 , H01L2224/0401 , H01L2224/05644 , H01L2224/05647 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/484 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/15311 , H01L2924/19043 , H05K1/113 , H05K3/4614 , H05K3/4623 , H05K2201/0394 , H05K2201/09509 , H05K2201/09527 , H05K2201/10378 , H01L2224/45099 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： Disclosed is a ball grid array (BGA) package substrate, in which a wire bonding pad and a solder ball pad are formed on a via hole, making high freedom in design of a circuit pattern and a high density circuit pattern possible, and a method of fabricating the same.
摘要翻译：公开了一种球栅阵列（BGA）封装基板，其中引线接合焊盘和焊球焊盘形成在通孔上，使电路图案的设计和高密度电路图案具有高自由度，以及方法的制造。

4. 发明申请

US20080073025A1 Method of manufacturing copper-clad laminate for VOP application 有权
标题翻译：制造用于VOP应用的覆铜层压板的方法
公开(公告)号：US20080073025A1
公开(公告)日：2008-03-27
申请号：US11524401
申请日：2006-09-21
申请人： Jong Jin Lee , Young Hwan Shin , Jae Min Choi , Chang Yul Oh
发明人： Jong Jin Lee , Young Hwan Shin , Jae Min Choi , Chang Yul Oh
IPC分类号： B32B37/00
CPC分类号： B32B38/04 , B32B37/12 , B32B2038/047 , B32B2311/12 , B32B2457/08 , H05K3/0035 , H05K3/0097 , H05K3/025 , H05K3/421 , H05K2203/0152 , H05K2203/1388 , H05K2203/1536 , Y10T156/1052 , Y10T156/1082
摘要： Disclosed herein is a method of manufacturing a copper-clad laminate for Via-On-Pad application. The pad includes the steps of providing a first copper foil layer and a second copper foil layer, on the first surfaces of which protective layers are formed; placing two sets of a first copper foil layer, an insulating layer and a second copper foil layer above and below an adhesive layer, respectively; removing the protective layers, which have been respectively formed on the second copper foil layers, and parts of the second copper foil layers; forming via holes by removing parts of the insulating layers through the regions from which the parts of the second copper foil layers have been removed, using laser processing; and forming two copper-clad laminates by removing the protective layers, which have been respectively formed on one surface of one first copper foil layer and one surface of the other first copper foil layer, and the adhesive layer.
摘要翻译：本文公开了一种制造用于Via-On-Pad应用的覆铜层压板的方法。该垫包括在形成有保护层的第一表面上提供第一铜箔层和第二铜箔层的步骤; 在粘合剂层上分别放置两组第一铜箔层，绝缘层和第二铜箔层; 去除分别形成在第二铜箔层上的保护层和第二铜箔层的部分; 通过使用激光加工从已除去了第二铜箔层的部分的区域去除绝缘层的一部分来形成通孔; 并且通过去除分别形成在一个第一铜箔层的一个表面和另一个第一铜箔层的一个表面上的保护层和粘合剂层来形成两个覆铜层压板。

5. 发明授权

US07807215B2 Method of manufacturing copper-clad laminate for VOP application 有权
标题翻译：制造用于VOP应用的覆铜层压板的方法
公开(公告)号：US07807215B2
公开(公告)日：2010-10-05
申请号：US11524401
申请日：2006-09-21
申请人： Jong Jin Lee , Young Hwan Shin , Jae Min Choi , Chang Yul Oh
发明人： Jong Jin Lee , Young Hwan Shin , Jae Min Choi , Chang Yul Oh
IPC分类号： B05D5/12 , B65B33/00
CPC分类号： B32B38/04 , B32B37/12 , B32B2038/047 , B32B2311/12 , B32B2457/08 , H05K3/0035 , H05K3/0097 , H05K3/025 , H05K3/421 , H05K2203/0152 , H05K2203/1388 , H05K2203/1536 , Y10T156/1052 , Y10T156/1082
摘要： Disclosed herein is a method of manufacturing a copper-clad laminate for Via-On-Pad application. The pad includes the steps of providing a first copper foil layer and a second copper foil layer, on the first surfaces of which protective layers are formed; placing two sets of a first copper foil layer, an insulating layer and a second copper foil layer above and below an adhesive layer, respectively; removing the protective layers, which have been respectively formed on the second copper foil layers, and parts of the second copper foil layers; forming via holes by removing parts of the insulating layers through the regions from which the parts of the second copper foil layers have been removed, using laser processing; and forming two copper-clad laminates by removing the protective layers, which have been respectively formed on one surface of one first copper foil layer and one surface of the other first copper foil layer, and the adhesive layer.
摘要翻译：本文公开了一种制造用于Via-On-Pad应用的覆铜层压板的方法。该垫包括在形成有保护层的第一表面上提供第一铜箔层和第二铜箔层的步骤; 在粘合剂层上分别放置两组第一铜箔层，绝缘层和第二铜箔层; 去除分别形成在第二铜箔层上的保护层和第二铜箔层的部分; 通过使用激光加工从已除去了第二铜箔层的部分的区域去除绝缘层的一部分来形成通孔; 并且通过去除分别形成在一个第一铜箔层的一个表面和另一个第一铜箔层的一个表面上的保护层和粘合剂层来形成两个覆铜层压板。

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