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    • 3. 发明授权
    • Configurable nanoscale crossbar electronic circuits made by electrochemical reaction
    • 通过电化学反应制造的可配置的纳米级横梁电子电路
    • US06891744B2
    • 2005-05-10
    • US10289703
    • 2002-11-06
    • Yong ChenR. Stanley Williams
    • Yong ChenR. Stanley Williams
    • G11C13/02G11C13/00H01L21/31H01L21/44
    • G11C13/0009B82Y10/00G11C13/025G11C2213/34G11C2213/77G11C2213/81Y10S438/957Y10S977/936
    • Configurable electronic circuits comprise arrays of cross-points of one layer of metal/semiconductive nanoscale lines crossed by a second layer of metal/semiconductive nanoscale lines, with a configurable layer between the lines. Methods are provided for altering the thickness and/or resistance of the configurable layer by oxidation or reduction methods, employing a solid material as the configurable layer. Specifically a method is provided for configuring nanoscale devices in a crossbar array of configurable devices comprising arrays of cross-points of a first layer of nanoscale lines comprising a first metal or a first semiconductor material crossed by a second layer of nanoscale lines comprising a second metal or a second semiconductor material. The method comprises: (a) forming the first layer on a substrate; (b) forming a solid phase of a configurable material on the first layer at least in areas where the second layer is to cross the first layer; (c) forming the second layer on the configurable material, over the first layer; and (d) changing a property of the configurable material to thereby configure the nanoscale devices.
    • 可配置电子电路包括由第二层金属/半导体纳米级线交叉的一层金属/半导体纳米级线的交叉点阵列,其中线之间具有可配置层。 提供了通过使用固体材料作为可配置层的氧化或还原方法来改变可配置层的厚度和/或电阻的方法。 具体地,提供一种用于在可配置设备的交叉开关阵列中配置纳米级器件的方法,其包括第一纳米级线层的交点的阵列,其包括第一金属或第一半导体材料,所述第一金属或第一半导体材料由第二纳米级线交叉,所述第二金属或第二半导体材料包括第二金属 或第二半导体材料。 该方法包括:(a)在衬底上形成第一层; (b)至少在所述第二层与所述第一层交叉的区域中,在所述第一层上形成可配置材料的固相; (c)在所述可配置材料上形成在所述第一层上的所述第二层; 和(d)改变可配置材料的特性,从而配置纳米级器件。
    • 5. 发明授权
    • Method for fabricating a nano-imprinting mold
    • 用于压印光刻及其制造的装置
    • US07368395B2
    • 2008-05-06
    • US11601084
    • 2006-11-16
    • M. Saif IslamGun Young JungYong ChenR. Stanley Williams
    • M. Saif IslamGun Young JungYong ChenR. Stanley Williams
    • H01L21/461
    • H01L21/76838H01L21/0337
    • An imprinting apparatus and method of fabrication provide a mold having a pattern for imprinting. The apparatus includes a semiconductor substrate polished in a [110] direction. The semiconductor substrate has a (110) horizontal planar surface and vertical sidewalls of a wet chemical etched trench. The sidewalls are aligned with and therefore are (111) vertical lattice planes of the semiconductor substrate. The semiconductor substrate includes a plurality of vertical structures between the sidewalls, wherein the vertical structures may be nano-scale spaced apart. The method includes wet etching a trench with spaced apart (111) vertical sidewalls in an exposed portion of the (110) horizontal surface of the semiconductor substrate along (111) vertical lattice planes. A chemical etching solution is used that etches the (111) vertical lattice planes slower than the (110) horizontal lattice plane. The method further includes forming the imprinting mold.
    • 压印装置和制造方法提供具有用于压印的图案的模具。 该装置包括沿[110]方向抛光的半导体衬底。 半导体衬底具有(110)水平平面和湿化学蚀刻沟槽的垂直侧壁。 侧壁与半导体衬底对准并且因此是(111)垂直的晶格面。 半导体衬底包括在侧壁之间的多个垂直结构,其中垂直结构可以是纳米级隔开的。 该方法包括在(111)垂直晶格面的半导体衬底的(110)水平表面的暴露部分中湿式蚀刻具有间隔开(111)垂直侧壁的沟槽。 使用蚀刻比(110)水平晶格面慢的(111)垂直晶格面的化学蚀刻溶液。 该方法还包括形成压印模具。
    • 8. 发明授权
    • Printing electronic and opto-electronic circuits
    • 印刷电子和光电子电路
    • US07404981B2
    • 2008-07-29
    • US10420565
    • 2003-04-21
    • Xiao-An ZhangR. Stanley WilliamsYong Chen
    • Xiao-An ZhangR. Stanley WilliamsYong Chen
    • B05D5/12C23C14/00
    • H05K3/105H01L51/0004H01L51/0021H01L51/0037H05K3/02H05K2201/0329H05K2203/0108H05K2203/1142
    • A method is provided for printing electronic and opto-electronic circuits. The method comprises: (a) providing a substrate; (b) providing a film-forming precursor species; (c) forming a substantially uniform and continuous film of the film-forming precursor species on at least one side of the substrate, the film having a first electrical conductivity; and (d) altering portions of the film with at least one conductivity-altering species to form regions having a second electrical conductivity that is different than the first electrical conductivity, the regions thereby providing circuit elements. The method employs very simple and continuous processes, which make the time to produce a batch of circuits very short and leads to very inexpensive products, such as electronic memories (write once or rewriteable), electronically addressable displays, and generally any circuit for which organic electronics or opto-electronics are acceptable.
    • 提供了一种印刷电子和光电子电路的方法。 该方法包括:(a)提供衬底; (b)提供成膜前体物质; (c)在所述基材的至少一侧上形成所述成膜前体物质的基本上均匀且连续的膜,所述膜具有第一导电性; 和(d)用至少一个导电性改变物质改变膜的部分,以形成具有不同于第一导电性的第二导电性的区域,由此提供电路元件。 该方法采用非常简单和连续的过程,这使得生产一批电路非常短并且导致非常便宜的产品的时间,例如电子存储器(一次写入或可重写),电子寻址显示器,以及通常用于有机 电子或光电子是可以接受的。
    • 9. 发明授权
    • Apparatus for imprinting lithography and fabrication thereof
    • 用于压印光刻及其制造的装置
    • US07141866B1
    • 2006-11-28
    • US10826056
    • 2004-04-16
    • M. Saif IslamGun Young JungYong ChenR. Stanley Williams
    • M. Saif IslamGun Young JungYong ChenR. Stanley Williams
    • H01L29/04H01L31/036
    • H01L21/76838H01L21/0337
    • An imprinting apparatus and method of fabrication provide a mold having a pattern for imprinting. The apparatus includes a semiconductor substrate polished in a [110] direction. The semiconductor substrate has a (110) horizontal planar surface and vertical sidewalls of a wet chemical etched trench. The sidewalls are aligned with and therefore are (111) vertical lattice planes of the semiconductor substrate. The semiconductor substrate includes a plurality of vertical structures between the sidewalls, wherein the vertical structures may be nano-scale spaced apart. The method includes wet etching a trench with spaced apart (111) vertical sidewalls in an exposed portion of the (110) horizontal surface of the semiconductor substrate along (111) vertical lattice planes. A chemical etching solution is used that etches the (111) vertical lattice planes slower than the (110) horizontal lattice plane. The method further includes forming the imprinting mold.
    • 压印装置和制造方法提供具有用于压印的图案的模具。 该装置包括沿[110]方向抛光的半导体衬底。 半导体衬底具有(110)水平平面和湿化学蚀刻沟槽的垂直侧壁。 侧壁与半导体衬底对准并且因此是(111)垂直的晶格面。 半导体衬底包括在侧壁之间的多个垂直结构,其中垂直结构可以是纳米级隔开的。 该方法包括在(111)垂直晶格面的半导体衬底的(110)水平表面的暴露部分中湿式蚀刻具有间隔开(111)垂直侧壁的沟槽。 使用蚀刻比(110)水平晶格面慢的(111)垂直晶格面的化学蚀刻溶液。 该方法还包括形成压印模具。
    • 10. 发明授权
    • Formation of nanoscale wires
    • 纳米线的形成
    • US06773616B1
    • 2004-08-10
    • US10033408
    • 2001-12-26
    • Yong ChenDouglas A. A. OhlbergTheodore I. KaminsR. Stanley Williams
    • Yong ChenDouglas A. A. OhlbergTheodore I. KaminsR. Stanley Williams
    • B44C122
    • C30B23/02C30B25/02C30B29/605Y10S977/888
    • Self-organized, or self-assembled, nanowires of a first composition may be used as an etching mask for fabrication of nanowires of a second composition. The method for forming such nanowires comprises: (a) providing an etchable layer of the second composition and having a buried insulating layer beneath a major surface thereof; (b) growing self-assembled nanowires on the surface of the etchable layer; and (c) etching the etchable layer anisotropically down to the insulating layer, using the self-assembled nanowires as a mask. The self-assembled nanowires may be removed or left. In either event, nanowires of the second composition are formed. The method enables the formation of one-dimensional crystalline nanowires with widths and heights at the nanometer scale, and lengths at the micrometer scale, which are aligned along certain crystallographic directions with high crystal quality. Further, the method of the present invention avoids traditional lithography methods, minimizes environmental toxic chemicals usage, simplifies the manufacturing processes, and allows the formation of high-quality one-dimensional nanowires over large areas.
    • 可以将第一组合物的自组织或自组装的纳米线用作用于制造第二组合物的纳米线的蚀刻掩模。 形成这种纳米线的方法包括:(a)提供第二组合物的可蚀刻层,并在其主表面下方具有掩埋绝缘层; (b)在可蚀刻层的表面上生长自组装纳米线; 和(c)使用自组装纳米线作为掩模,各向异性地将可蚀刻层蚀刻到绝缘层。 自组装纳米线可以被去除或留下。 在任一情况下,形成第二组合物的纳米线。 该方法能够形成具有纳米尺度的宽度和高度的一维结晶纳米线,以及在具有高晶体质量的某些晶体方向上对准的微米尺度的长度。 此外,本发明的方法避免了传统的光刻方法,使环境有毒化学品的使用最小化,简化了制造工艺,并且允许在大面积上形成高质量的一维纳米线。