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    • 2. 发明申请
    • Magnetic disk, manufacturing method therefor and magnetic recording device
    • 磁盘及其制造方法及磁记录装置
    • US20070015010A1
    • 2007-01-18
    • US11481249
    • 2006-07-06
    • Shigeru HorigomeTakashi Arai
    • Shigeru HorigomeTakashi Arai
    • G11B5/64C23C14/00
    • G11B5/7325C23C14/50C23C14/568G11B5/84G11B5/8408G11B5/851
    • In a step of forming the under layer, the under layer is formed while an insulating substrate is supported by support members made of a conductive material. In a step of forming a recording layer, the insulating substrate remains supported. A movable electrode is urged into contact with an end face of the insulating substrate. The recording layer is formed by a sputtering process while a negative bias voltage is applied. Since the under layer is formed on the end face of the substrate, the electric conduction between the movable electrode and the under layer is good. Moreover, the under layer formed on the surface of the substrate is bridged to a part of a contact section of the support springs. Therefore, the support springs and the under layer is electrically connected. A bias voltage is applied to the under layer through the movable electrode and the support springs.
    • 在形成底层的步骤中,形成底层,同时绝缘基板由由导电材料制成的支撑构件支撑。 在形成记录层的步骤中,绝缘衬底保持支撑。 可动电极被迫与绝缘基板的端面接触。 记录层通过溅射工艺形成,同时施加负偏置电压。 由于底层形成在基板的端面上,所以可动电极和下层之间的导电性良好。 此外,形成在基板的表面上的下层桥接到支撑弹簧的接触部分的一部分。 因此,支撑弹簧和下层电连接。 偏压通过可动电极和支撑弹簧施加到下层。
    • 3. 发明申请
    • Magnetic disk, manufacturing method therefor and magnetic recording device
    • 磁盘及其制造方法及磁记录装置
    • US20060154111A1
    • 2006-07-13
    • US11126337
    • 2005-05-11
    • Shigeru HorigomeTakashi Arai
    • Shigeru HorigomeTakashi Arai
    • G11B5/64C23C14/00
    • C23C14/345C23C14/025C23C14/14C23C14/50G11B5/8404G11B5/851
    • In a step of forming the under layer, the under layer is formed while an insulating substrate is supported by support members made of a conductive material. In a step of forming a recording layer, the insulating substrate remains supported. A movable electrode is urged into contact with an end face of the insulating substrate. The recording layer is formed by a sputtering process while a negative bias voltage is applied. Since the under layer is formed on the end face of the substrate, the electric conduction between the movable electrode and the under layer is good. Moreover, the under layer formed on the surface of the substrate is bridged to a part of a contact section of the support springs. Therefore, the support springs and the under layer is electrically connected. A bias voltage is applied to the under layer through the movable electrode and the support springs.
    • 在形成底层的步骤中,形成底层,同时绝缘基板由由导电材料制成的支撑构件支撑。 在形成记录层的步骤中,绝缘衬底保持支撑。 可动电极被迫与绝缘基板的端面接触。 记录层通过溅射工艺形成,同时施加负偏置电压。 由于底层形成在基板的端面上,所以可动电极和下层之间的导电性良好。 此外,形成在基板的表面上的下层桥接到支撑弹簧的接触部分的一部分。 因此,支撑弹簧和下层电连接。 偏压通过可动电极和支撑弹簧施加到下层。