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1. 发明授权

US5270674A Electromagnetic relay 失效
公开(公告)号：US5270674A
公开(公告)日：1993-12-14
申请号：US794194
申请日：1991-11-19
申请人： Yoichi Nakanishi , Ryuichi Sato , Hiroyuki Sagawa , Masayuki Noda , Mitsuhiro Kawai , Kazumi Sako
发明人： Yoichi Nakanishi , Ryuichi Sato , Hiroyuki Sagawa , Masayuki Noda , Mitsuhiro Kawai , Kazumi Sako
IPC分类号： H01H50/02 , H01H50/04 , H01H51/22
CPC分类号： H01H50/026 , H01H50/34 , H01H51/229 , H01H2050/446 , H01H50/042 , H01H50/443
摘要： An electromagnetic relay of the present invention has a large dielectric strength between a coil and each contact because of an insulative member interposed therebetween. Even if the straight distance between the coil and each contact is small, it is possible to obtain a sufficient dielectric strength without an extra process. Moreover, since a leg part of the coil terminal is coated with an insulative resin, the dielectric strength between the coil terminal and a movable iron element or a movable contact piece is enhanced. An insertion window formed in an insulating plate of the coil helps to insert a thickness gauge with high positioning accuracy.

2. 发明授权

US4814944A Mounting structure for surface mounted type component with projection extending down from lower surface thereof and method of mounting a surface mounted type component on a printed circuit board 失效
标题翻译：具有从其下表面向下延伸的突起的表面安装型部件的安装结构和将表面安装型部件安装在印刷电路板上的方法
公开(公告)号：US4814944A
公开(公告)日：1989-03-21
申请号：US220433
申请日：1988-07-13
申请人： Hiroyuki Sagawa , Hirofumi Koga , Shunichi Agatahama , Hideyuki Okumura , Kazushige Matsuoka , Ryuichi Sato
发明人： Hiroyuki Sagawa , Hirofumi Koga , Shunichi Agatahama , Hideyuki Okumura , Kazushige Matsuoka , Ryuichi Sato
IPC分类号： H01H50/14 , H05K3/30 , H05K3/34 , H05K3/38 , H05K7/10
CPC分类号： H05K3/305 , H05K3/3426 , H01H2001/5888 , H01H2050/044 , H01H50/14 , H05K2201/10053 , H05K2201/10568 , H05K2201/10628 , H05K2201/10689 , H05K2201/10969 , H05K2201/2036 , H05K3/381 , Y02P70/613
摘要： In this mounting structure and method for a surface mounted type electronic component, the component has at least one terminal which protrudes from its bottom surface and which terminates in a foot portion for being soldered to a printed circuit board. Also, a projection extends from this bottom surface of the electronic component for a distance somewhat less than the amounty by which the terminal projects from it. This projection is provisionally secured by adhesive to the printed circuit board with the foot portion of the terminal overlaying that circuit portion to which it is to be soldered, and then subsequently this terminal foot portion is soldered to this circuit portion. Thereby, during the soldering process, there is no risk of the terminal foot portion becoming displaced from the circuit portion and thus badly soldered thereto, because of the locating action of the adhered projection. The projection may extend from a central portion of the bottom surface of the component, or may be provided in plurality as extending from central portions of edges of said bottom surface. And the end of the projection may be roughened.
摘要翻译：在这种用于表面安装型电子部件的安装结构和方法中，该部件具有至少一个从其底表面突出并终止于脚部以用于焊接到印刷电路板的端子。此外，突起从电子部件的该底面延伸一段距离稍微小于端子从其突出的量的距离。该突起通过粘合剂临时固定到印刷电路板上，其中端子的底部部分覆盖要被焊接到该电路部分的电路部分，然后将该端子脚部焊接到该电路部分。因此，在焊接过程中，由于附着的突起的定位动作，终端脚部不会从电路部分移位，从而严重焊接在其上。突起可以从部件的底表面的中心部分延伸，或者可以以从底表面的边缘的中心部分延伸的方式多个地设置。投影的结束可能会变得粗糙。

3. 发明授权

US4831348A Low profile electromagnetic relay to printed circuit board 失效
标题翻译：薄型电磁继电器到印刷电路板
公开(公告)号：US4831348A
公开(公告)日：1989-05-16
申请号：US196864
申请日：1988-05-23
申请人： Shunichi Agatahama , Hirofumi Koga , Ryuichi Sato , Hiroyuki Sagawa , Kazushige Matsuoka
发明人： Shunichi Agatahama , Hirofumi Koga , Ryuichi Sato , Hiroyuki Sagawa , Kazushige Matsuoka
IPC分类号： H01H1/58 , H01H51/22
CPC分类号： H01H51/2227 , H01H1/5805 , H01H2001/5888 , H01H2050/044
摘要： This low profile electromagnetic relay includes a base and a support post protruding at one end of the base. An electromagnet assembly is mounted in a generally central position on the base, and has a pair of magnetic pole surfaces on opposite sides of its one end. An armature assembly includes an insulating armature member, shaped generally as a hollow rectangular member with an open space being defined within it and formed with a hole by which it is rotatably fitted over the support post with the electromagnet assembly fitting inside the open space defined within it. A drive portion is connected to the insulating armature member. A pair of mutually opposed armature pieces are mounted on the insulating armature member, and, when the insulating armature member is rotatably fitted over the support post, lie on opposite sides of the one end of the electromagnet assembly and each oppose one of the magnetic pole surfaces of the electromagnet assembly. A permanent magnet member is mounted so as to bridge between the pair of mutually opposed armature pieces. And a contact mechanism is fitted to the base and is driven by the drive portion of the insulating armature member. Thereby the height of the relay is minimized, and the stability of its action is assured.
摘要翻译：该低剖面电磁继电器包括基座和在基座一端突出的支撑柱。电磁铁组件安装在基座上的大致中心位置，并且在其一端的相对侧上具有一对磁极表面。电枢组件包括绝缘电枢构件，绝缘电枢构件通常形成为中空矩形构件，其中限定有开放空间并形成有孔，通过该孔可旋转地装配在支撑柱上，电磁体组件装配在内部限定的开放空间内它。驱动部分连接到绝缘电枢部件。一对相互对置的衔铁片安装在绝缘电枢件上，并且当绝缘电枢件可旋转地装配在支撑柱上时，位于电磁铁组件的一端的相对两侧，并且每个相对于磁极之一电磁铁组件的表面。安装永磁体构件以便桥接在所述一对相互对置的电枢片之间。并且接触机构装配到基座并由绝缘电枢构件的驱动部分驱动。从而使继电器的高度最小化，确保其动作的稳定性。

4. 发明授权

US5759668A Heat seal structure 失效
标题翻译：热封结构
公开(公告)号：US5759668A
公开(公告)日：1998-06-02
申请号：US824437
申请日：1997-03-26
申请人： Tatsuro Ishikawa , Hiroyuki Sagawa , Kiyoji Inoue , Tetsuo Shinkai , Atsushi Kamizasa
发明人： Tatsuro Ishikawa , Hiroyuki Sagawa , Kiyoji Inoue , Tetsuo Shinkai , Atsushi Kamizasa
IPC分类号： H01H50/02 , H05K5/00 , H05K5/06 , B32B3/24
CPC分类号： H01H50/023 , H05K5/0095 , Y10S428/913 , Y10T428/24174 , Y10T428/24273 , Y10T428/24322 , Y10T428/24339 , Y10T428/24479
摘要： The invention provides an improved heat seal structure for electronic devices. A heat seal structure comprises a base of synthetic resin formed integrally with an outwardly extending projection, with a gas vent running through the base and projection, the gas vent being sealed off by melting the projection, the improvement that the gas vent is configured generally in the shape of the letter V or Y bifurcating in the outward direction. In another embodiment, the projection has an annular extension disposed on the outward side of the base and adapted to be melted for a double seal effect. In another version of the structure, heat-sealing is performed with a sealing member or composition interposed in the gas vent. In still further embodiments, heat sealing is performed using a sealing member melting at a temperature below the melting point of the resin forming the base.
摘要翻译：本发明提供了一种用于电子设备的改进的热密封结构。热封结构包括与向外延伸的突起一体地形成的合成树脂基部，气体通过基部和突起延伸，气体通过熔化突起而被密封，气体排气口通常配置在字母V或Y的形状向外分叉。在另一个实施例中，突起具有设置在基座的外侧上的环形延伸部，并且适于熔化以实现双重密封效果。在该结构的另一种形式中，通过密封构件或组合物插入在排气口中进行热封。在另外的实施例中，使用在低于形成基底的树脂的熔点的温度下熔化的密封构件进行热封。

5. 外观设计

USD654338S1 Grabber 有权
标题翻译：抓住
公开(公告)号：USD654338S1
公开(公告)日：2012-02-21
申请号：US29380083
申请日：2010-11-30
申请人： Hiroyuki Sagawa
设计人： Hiroyuki Sagawa

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