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1. 发明授权

US5742173A Method and apparatus for probe testing substrate 失效
标题翻译：探针测试底物的方法和装置
公开(公告)号：US5742173A
公开(公告)日：1998-04-21
申请号：US737338
申请日：1996-11-18
申请人： Yoichi Nakagomi , Hidehito Yokomori , Shinji Iino , Satoshi Sano
发明人： Yoichi Nakagomi , Hidehito Yokomori , Shinji Iino , Satoshi Sano
IPC分类号： G01R1/067 , G01R1/04
CPC分类号： G01R1/06705
摘要： A substrate inspecting method has a step of previously storing as initial setting data the positional information of a mounting table on which the substrate is placed and the positional information of the probe, a calibration step of moving a first alignment member provided at a position away by a specified distance from the mounting table together with the mounting table, and aligning the first alignment member with a second alignment member fixed to a position away by a specified distance from the probe, a step of calculating a distance between the calibrated position and the mutual probe/pad contact position on the basis of the previously stored initial setting data, and moving the mounting table on the basis of the calculated results to position the pad at the probe, and a step of contacting the pad of the substrate on the mounting table with the probe, and sending a test signal to a pattern circuit on the substrate to inspect.
摘要翻译： PCT No.PCT / JP96 / 00699 Sec。 371日期：1996年11月18日 102（e）1996年11月18日日期PCT 1996年3月18日PCT公布。公开号WO96 / 29607 日期1996年9月26日基板检查方法具有以下步骤：预先存储作为初始设置数据的放置基板的安装台的位置信息和探针的位置信息，移动第一对准构件的校准步骤在与安装台一起离开安装台一定距离的位置处，并且将第一对准构件与固定到远离探测器一定距离的位置的第二对准构件对准;计算第二对准构件之间的距离的步骤; 基于先前存储的初始设定数据，根据计算结果移动安装台，将垫定位在探头上，并将接触垫的接触位置与步骤用探头安装在安装台上的基板，并将测试信号发送到基板上的图案电路进行检查。

2. 发明授权

US06239602B1 Temperature managing apparatus for multi-stage container 有权
标题翻译：多级容器温度管理装置
公开(公告)号：US06239602B1
公开(公告)日：2001-05-29
申请号：US09324427
申请日：1999-06-01
申请人： Yoichi Nakagomi , Kunihiro Furuya , Hiroshi Tsukada
发明人： Yoichi Nakagomi , Kunihiro Furuya , Hiroshi Tsukada
IPC分类号： G01R3102
CPC分类号： G01R31/2874 , G01R31/2831 , G05D23/1919
摘要： A temperature managing apparatus according to the invention comprises cooling jackets provided in each of a plurality of test containers, a tank for storing a cooling medium for the cooling jackets, first pumps, second pump, constant pressure valves for making constant the amount of the transferred cooling medium, and a heat exchanger. The tank has partitions that are horizontally and vertically movable. The partitions partition the interior of the tank into a first storage area, a second storage area, and a third area interposed therebetween.
摘要翻译：根据本发明的温度管理装置包括设置在多个测试容器中的每一个中的冷却夹套，用于存储用于冷却夹套的冷却介质的罐，第一泵，第二泵，用于使转移量恒定的恒压阀冷却介质和热交换器。水箱具有水平和垂直移动的隔板。隔板将罐的内部分隔成第一存储区域，第二存储区域和介于其间的第三区域。

3. 发明授权

US6084215A Semiconductor wafer holder with spring-mounted temperature measurement apparatus disposed therein 有权
标题翻译：具有弹簧安装温度测量装置的半导体晶片保持架
公开(公告)号：US6084215A
公开(公告)日：2000-07-04
申请号：US179192
申请日：1998-10-27
申请人： Kunihiro Furuya , Toshihiro Yonezawa , Ken Inoue , Yoichi Nakagomi
发明人： Kunihiro Furuya , Toshihiro Yonezawa , Ken Inoue , Yoichi Nakagomi
IPC分类号： H01L21/00 , H01L21/205 , H01L21/66
CPC分类号： H01L21/67248
摘要： A temperature measuring unit of a wafer chuck measures the temperature of a wafer chuck when the wafer chuck holding a wafer W making in-unison contact with a contactor is made to contact a bottom jacket and the bottom jacket controls the wafer W to a specific test temperature. At least three recessed sections are formed in the back of the wafer chuck in such a manner that they have a depth extending from the back of the chuck to the vicinity of its surface. Through holes corresponding to the recessed sections are made in the bottom jacket. Temperature sensors that can be inserted into the through holes and in the recessed sections are provided on the side opposite to the wafer chuck of the bottom jacket. The sensors are supported by springs. During a test, the tips of the temperature sensors are caused to make elastic contact with the recessed sections.
摘要翻译：当夹持与接触器不一致接触的晶片W的晶片卡盘与底部夹套接触时，晶片卡盘的温度测量单元测量晶片卡盘的温度，并且底部夹套将晶片W控制到特定测试温度。至少三个凹部形成在晶片卡盘的背面，使得它们具有从卡盘背面延伸到其表面附近的深度。在底部夹套中形成与凹部对应的通孔。可以插入通孔和凹部的温度传感器设置在与底部夹套的晶片卡盘相对的一侧。传感器由弹簧支撑。在测试期间，使温度传感器的尖端与凹陷部分弹性接触。

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