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1. 发明申请

US20080106666A1 LIQUID CRYSTAL DISPLAY 审中-公开
标题翻译：液晶显示器
公开(公告)号：US20080106666A1
公开(公告)日：2008-05-08
申请号：US11877888
申请日：2007-10-24
申请人： Yo-han Lee , Young-gil Kim , Seoung-bum Pyoun , Sung-hee Lee , Sang-iun Lee
发明人： Yo-han Lee , Young-gil Kim , Seoung-bum Pyoun , Sung-hee Lee , Sang-iun Lee
IPC分类号： G02F1/136
CPC分类号： G09G3/3677 , G09G2310/0245 , G09G2320/0257
摘要： A liquid crystal display capable of preventing a residual image phenomenon from occurring after power is cut off. The liquid crystal display includes: a voltage generating unit outputting a gate-on voltage to a first output node, outputting a gate-off voltage to a second output node, and pulling up the voltage level of the second output node to a level of a positive discharge voltage after a power supply voltage is cut off; a gate driving unit sequentially supplying the gate-on voltage and the gate-off voltage; a data driving unit supplying an image data voltage; and a liquid crystal panel including a plurality of pixels that are turned on or off according to the gate-on voltage or the gate-off voltage, so as to display an image corresponding to the image data voltage.
摘要翻译：能够防止在断电后发生残留图像现象的液晶显示器。液晶显示器包括：电压产生单元，向第一输出节点输出栅极导通电压，向第二输出节点输出栅极截止电压，并将第二输出节点的电压电平提升到电源电压被切断后的正放电电压; 栅极驱动单元，顺序地提供栅极导通电压和栅极截止电压; 提供图像数据电压的数据驱动单元; 以及包括根据栅极导通电压或栅极截止电压导通或截止的多个像素的液晶面板，以便显示与图像数据电压相对应的图像。

2. 发明申请

US20050056918A1 Power module package having improved heat dissipating capability 有权
标题翻译：功率模块封装具有改善的散热能力
公开(公告)号：US20050056918A1
公开(公告)日：2005-03-17
申请号：US10974357
申请日：2004-10-26
申请人： Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
发明人： Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
IPC分类号： H01L21/56 , H01L23/433 , H01L23/495
CPC分类号： H01L21/565 , H01L23/4334 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01078 , H01L2924/01079 , H01L2924/12036 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/2076 , H01L2924/00015 , H01L2924/00012
摘要： A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.
摘要翻译：提供电源模块封装。功率模块封装包括电源电路元件，控制电路元件，引线框架，散热器和环氧树脂模塑料（EMC）。控制电路元件连接到电源电路并控制电源电路中的芯片。引线框架具有形成在其边缘处的外部连接装置和形成在外部连接装置之间的下降部分。引线框架具有安装电源电路和控制电路的第一表面，并且用作散热路径的第二表面，特别地，电源电路附接到下降部件。通过粘合剂紧密地附接到引线框架的第二表面的下降部分的散热器。 EMC围绕电源电路，控制电路，引线框架和散热器，并将引线框架的外部连接装置和散热片的一侧曝光。

3. 发明授权

US07061080B2 Power module package having improved heat dissipating capability 有权
公开(公告)号：US07061080B2
公开(公告)日：2006-06-13
申请号：US10167067
申请日：2002-06-10
申请人： Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
发明人： Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
IPC分类号： H01L23/495
CPC分类号： H01L21/565 , H01L23/4334 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01078 , H01L2924/01079 , H01L2924/12036 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/2076 , H01L2924/00015 , H01L2924/00012
摘要： A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.

4. 发明授权

US07208819B2 Power module package having improved heat dissipating capability 有权
标题翻译：功率模块封装具有改善的散热能力
公开(公告)号：US07208819B2
公开(公告)日：2007-04-24
申请号：US10974357
申请日：2004-10-26
申请人： Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
发明人： Gi-young Jeun , Sung-min Park , Joo-sang Lee , Sung-won Lim , O-seob Jeon , Byoung-ok Lee , Young-gil Kim , Gwi-gyeon Yang
IPC分类号： H01L23/495
CPC分类号： H01L21/565 , H01L23/4334 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2924/01078 , H01L2924/01079 , H01L2924/12036 , H01L2924/12042 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/2076 , H01L2924/00015 , H01L2924/00012
摘要： A power module package is provided. The power module package includes a power circuit element, a control circuit element, a lead frame, a heat sink, and an epoxy molding compound (EMC). The control circuit element is connected to the power circuit and controls chips in the power circuit. The lead frame has external connecting means formed at the edges thereof, and a down set part, namely, formed between the external connecting means. The lead frame has a first surface to which the power circuit and the control circuit are attached, and a second surface used as a heat dissipating path, in particular, the power circuit is attached to the down set part. The heat sink which is closely attached to the down set part of the second surface of the lead frame by an adhesive. The EMC surrounds the power circuit, the control circuit, the lead frame and the heat sink, and exposes the external connecting means of the lead frame and a side of the heat sink.
摘要翻译：提供电源模块封装。功率模块封装包括电源电路元件，控制电路元件，引线框架，散热器和环氧树脂模塑料（EMC）。控制电路元件连接到电源电路并控制电源电路中的芯片。引线框架具有形成在其边缘处的外部连接装置和形成在外部连接装置之间的下降部分。引线框架具有安装电源电路和控制电路的第一表面，并且用作散热路径的第二表面，特别地，电源电路附接到下降部件。通过粘合剂紧密地附接到引线框架的第二表面的下降部分的散热器。 EMC围绕电源电路，控制电路，引线框架和散热器，并将引线框架的外部连接装置和散热片的一侧曝光。

5. 发明授权

US5026441A High strengths copper base shape memory alloy and its manufacturing process 失效
标题翻译：高强度铜基形状记忆合金及其制造工艺
公开(公告)号：US5026441A
公开(公告)日：1991-06-25
申请号：US572119
申请日：1990-08-23
申请人： Young-gil Kim , Jin-woong Kim , Dong-wan Nho
发明人： Young-gil Kim , Jin-woong Kim , Dong-wan Nho
IPC分类号： C22C9/00 , C22C9/01 , C22F1/00
CPC分类号： C22F1/006 , C22C9/01
摘要： This invention is concerned with the development of a Cu-base shape memory alloy and it's manufacturing process. The alloy is a Cu-Al-Ni-Zr-Si shape memory alloy exhibiting high strength(830Mpa, 85kg/mml) and good ductility(7.5 - 8%) due to grain size refinement by the addition of microalloying elements (Zr, Si). Also, the invented alloy has good thermal stability and is useful for temperatures of up to about 300.degree. C.
摘要翻译：本发明涉及Cu基形状记忆合金的发展及其制造工艺。该合金是由于通过添加微合金元素（Zr，Si）的晶粒细化而显示高强度（830Mpa，85kg / mml）和良好延展性（7.5-8％）的Cu-Al-Ni-Zr-Si形状记忆合金）。此外，本发明的合金具有良好的热稳定性，对于高达约300℃的温度是有用的。

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