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1. 发明申请

US20050006083A1 Temperature-homogenizing device 有权
标题翻译：温度均化装置
公开(公告)号：US20050006083A1
公开(公告)日：2005-01-13
申请号：US10756064
申请日：2004-01-13
申请人： Yin-Yuan Chen , Wen-Ching Wu , Jui-Yuan Hsu
发明人： Yin-Yuan Chen , Wen-Ching Wu , Jui-Yuan Hsu
IPC分类号： H01L23/36 , H01L23/433 , H05K7/20
CPC分类号： H05K7/20436 , H01L23/36 , H01L23/433 , H01L2924/0002 , H05K7/20481 , H01L2924/00
摘要： A temperature-homogenizing device for uniformly dissipating heat generated from electronic components in an electronic device to a housing of the electronic device includes a first and a second higher thermally conductive layers and a first lower thermally conductive layer. The first lower thermally conductive layer is disposed between the first and the second higher thermally conductive layers, and made of a material or a medium having a lower thermal conductivity than each of the first and the second higher thermally conductive layers. By means of this temperature-homogenizing device, the heat is homogeneously distributed throughout the first and the second higher thermally conductive layers at a higher thermal conduction rate and transferred through the first lower thermally conductive layer at a lower thermal conduction rate so as to maintain homogeneous temperature distribution on the housing.
摘要翻译：用于将电子设备中的电子部件产生的热量均匀地散发到电子设备的壳体的温度均化装置包括第一和第二较高导热层和第一下部导热层。第一下部导热层设置在第一和第二较高导热层之间，并且由具有比每个第一和第二较高导热层的导热性低的材料或介质制成。通过该温度均化装置，热量以更高的热传导速率均匀地分布在第一和第二较高的导热层中，并以较低的热传导速率转移通过第一较低导热层，以保持均匀温度分布在房屋上。

2. 发明授权

US07066244B2 Temperature-homogenizing device 有权
标题翻译：温度均化装置
公开(公告)号：US07066244B2
公开(公告)日：2006-06-27
申请号：US10756064
申请日：2004-01-13
申请人： Yin-Yuan Chen , Wen-Ching Wu , Jui-Yuan Hsu
发明人： Yin-Yuan Chen , Wen-Ching Wu , Jui-Yuan Hsu
IPC分类号： F28F7/00
CPC分类号： H05K7/20436 , H01L23/36 , H01L23/433 , H01L2924/0002 , H05K7/20481 , H01L2924/00
摘要： A temperature-homogenizing device for uniformly dissipating heat generated from electronic components in an electronic device to a housing of the electronic device includes a first and a second higher thermally conductive layers and a first lower thermally conductive layer. The first lower thermally conductive layer is disposed between the first and the second higher thermally conductive layers, and made of a material or a medium having a lower thermal conductivity than each of the first and the second higher thermally conductive layers. By means of this temperature-homogenizing device, the heat is homogeneously distributed throughout the first and the second higher thermally conductive layers at a higher thermal conduction rate and transferred through the first lower thermally conductive layer at a lower thermal conduction rate so as to maintain homogeneous temperature distribution on the housing.
摘要翻译：用于将电子设备中的电子部件产生的热量均匀地散发到电子设备的壳体的温度均化装置包括第一和第二较高导热层和第一下部导热层。第一下部导热层设置在第一和第二较高导热层之间，并且由具有比每个第一和第二较高导热层的导热性低的材料或介质制成。通过该温度均化装置，热量以更高的热传导速率均匀地分布在第一和第二较高的导热层中，并以较低的热传导速率转移通过第一较低导热层，以保持均匀温度分布在房屋上。

3. 发明申请

US20080101039A1 PASSIVE HEAT-DISSIPATING TYPE POWER SUPPLY APPARATUS FOR INCREASING HEAT-DISSIPATING EFFICIENCY AND FABRICATING PROCESS THEREOF 审中-公开
标题翻译：被动式散热式电源设备，用于提高散热效率及其制造工艺
公开(公告)号：US20080101039A1
公开(公告)日：2008-05-01
申请号：US11764856
申请日：2007-06-19
申请人： Jui-Yuan Hsu , Chien-Chung Chang , Wen-Ching Wu
发明人： Jui-Yuan Hsu , Chien-Chung Chang , Wen-Ching Wu
IPC分类号： H05K7/20 , H01S4/00
CPC分类号： H05K7/209 , Y10T29/49002
摘要： The present invention relates to a power supply apparatus having a passive heat-dissipating mechanism. The power supply apparatus includes an insulating housing, a printed circuit board and at least an electronic component. The insulating housing has a closed receptacle therein and includes a first edge, a second edge and a third edge. The first edge is greater than the second edge and the second edge is greater than or equal to the third edge. An aspect ratio of the first edge to the second edge is greater than 2.5. The electronic component is mounted on the printed circuit board.
摘要翻译：本发明涉及具有被动散热机构的电源装置。电源装置包括绝缘壳体，印刷电路板和至少电子部件。绝缘壳体在其中具有封闭的容器，并且包括第一边缘，第二边缘和第三边缘。第一边缘大于第二边缘，第二边缘大于或等于第三边缘。第一边缘与第二边缘的纵横比大于2.5。电子部件安装在印刷电路板上。

4. 发明授权

US07324345B2 Electronic device with heat-dissipation structure 有权
标题翻译：具有散热结构的电子设备
公开(公告)号：US07324345B2
公开(公告)日：2008-01-29
申请号：US11287023
申请日：2005-11-23
申请人： Kuo-Liang Lee , Wen-Ching Wu , Jui-Yuan Hsu
发明人： Kuo-Liang Lee , Wen-Ching Wu , Jui-Yuan Hsu
IPC分类号： H05K7/20
CPC分类号： H05K7/20518
摘要： An electronic device with a heat-dissipation structure is disclosed. The electronic device comprises a housing, a printed circuit board assembly, and a heat sink. The printed circuit board assembly is disposed in an interior of the housing, and the printed circuit board assembly forms a high-temperatured heat flow area and a low-temperatured heat flow area in the electronic device. The heat sink is disposed between the printed circuit board assembly and the housing and in the low-temperatured heat flow area for balancing heat flow and homogenizing temperature of the electronic device to enhance heat-dissipation efficiency.
摘要翻译：公开了一种具有散热结构的电子设备。电子设备包括壳体，印刷电路板组件和散热器。印刷电路板组件设置在壳体的内部，并且印刷电路板组件在电子设备中形成高温热流区域和低温热流区域。散热器布置在印刷电路板组件和壳体之间以及在低温热流区域中，用于平衡电子设备的热流和均匀化温度，以增强散热效率。

5. 发明申请

US20060109634A1 Electronic device with heat-dissipation structure 有权
标题翻译：具有散热结构的电子设备
公开(公告)号：US20060109634A1
公开(公告)日：2006-05-25
申请号：US11287023
申请日：2005-11-23
申请人： Kuo-Liang Lee , Wen-Ching Wu , Jui-Yuan Hsu
发明人： Kuo-Liang Lee , Wen-Ching Wu , Jui-Yuan Hsu
IPC分类号： H05K7/20
CPC分类号： H05K7/20518
摘要： An electronic device with a heat-dissipation structure is disclosed. The electronic device comprises a housing, a printed circuit board assembly, and a heat sink. The printed circuit board assembly is disposed in an interior of the housing, and the printed circuit board assembly forms a high-temperatured heat flow area and a low-temperatured heat flow area in the electronic device. The heat sink is disposed between the printed circuit board assembly and the housing and in the low-temperatured heat flow area for balancing heat flow and homogenizing temperature of the electronic device to enhance heat-dissipation efficiency.
摘要翻译：公开了一种具有散热结构的电子设备。电子设备包括壳体，印刷电路板组件和散热器。印刷电路板组件设置在壳体的内部，并且印刷电路板组件在电子设备中形成高温热流区域和低温热流区域。散热器布置在印刷电路板组件和壳体之间以及在低温热流区域中，用于平衡电子设备的热流和均匀化温度，以增强散热效率。

6. 发明授权

US08051394B2 Yield evaluating apparatus and method thereof 有权
标题翻译：产量评价装置及其方法
公开(公告)号：US08051394B2
公开(公告)日：2011-11-01
申请号：US12264227
申请日：2008-11-03
申请人： Pei-Wen Luo , Jwu-E Chen , Chin-Long Wey , Liang-Chia Cheng , Ji-Jan Chen , Wen-Ching Wu
发明人： Pei-Wen Luo , Jwu-E Chen , Chin-Long Wey , Liang-Chia Cheng , Ji-Jan Chen , Wen-Ching Wu
IPC分类号： G06F17/50 , G06F9/455 , G06F11/22
CPC分类号： G06F17/5081 , G06F2217/10
摘要： A yield evaluating apparatus and a method thereof are provided. The yield evaluating apparatus includes a spatial correlation module. The spatial correlation module receives at least one process-related data and a plurality of circuit layouts and obtains a correlation coefficient between unit elements in the circuit layouts according to the process-related data. The spatial correlation module calculates a spatial correlation between elements in each of the circuit layouts according to the correlation coefficient and selects one of the circuit layouts according to the spatial correlations.
摘要翻译：提供了一种产量评估装置及其方法。产量评估装置包括空间相关模块。空间相关模块接收至少一个处理相关数据和多个电路布局，并且根据处理相关数据获得电路布局中单元元件之间的相关系数。空间相关模块根据相关系数计算每个电路布局中的元件之间的空间相关性，并根据空间相关性选择一个电路布局。

7. 发明申请

US20080076279A1 FOLDABLE ELECTRICAL CONNECTOR AND POWER SUPPLY APPARATUS HAVING SAME 有权
标题翻译：具有可折叠电气连接器和电源装置
公开(公告)号：US20080076279A1
公开(公告)日：2008-03-27
申请号：US11751767
申请日：2007-05-22
申请人： Wen-Ching Wu , Ya-Hui Chen
发明人： Wen-Ching Wu , Ya-Hui Chen
IPC分类号： H01R13/44
CPC分类号： H01R31/06
摘要： A power supply apparatus includes a main body, a first power connecting part and a foldable electrical connector. The main body includes a power converting circuit therein and has a first socket at a first side thereof. The first power connecting part has an end connected to the main body. The foldable electrical connector includes a housing and at least a conductive pin. The housing includes a connecting member and a receiving portion. The connecting member is electrically connected to the first socket of the main body. The conductive pin is disposed in the receiving portion and multi-angularly rotatable with respect to the housing so as to be selectively stored in the receiving portion or protruded from the housing.
摘要翻译：电源装置包括主体，第一电源连接部和可折叠的电连接器。主体在其中包括电力转换电路，并在其第一侧具有第一插座。第一电力连接部分的端部连接到主体。可折叠电连接器包括壳体和至少一个导电销。壳体包括连接构件和接收部分。连接构件电连接到主体的第一插座。导电销设置在接收部分中并相对于壳体多角度地旋转，以便选择性地存储在接收部分中或从壳体突出。

8. 发明授权

US06937106B2 Built-in jitter measurement circuit for voltage controlled oscillator and phase locked loop 有权
标题翻译：用于压控振荡器和锁相环的内置抖动测量电路
公开(公告)号：US06937106B2
公开(公告)日：2005-08-30
申请号：US10749560
申请日：2004-01-02
申请人： Yeong-Jar Chang , Shen-Tien Lin , Wen-Ching Wu , Kun-Lun Luo
发明人： Yeong-Jar Chang , Shen-Tien Lin , Wen-Ching Wu , Kun-Lun Luo
IPC分类号： G01R29/26 , H03L7/06 , G01R23/00
CPC分类号： G01R29/26 , H03L7/06
摘要： A built-in jitter measurement circuit for a VCO (voltage-controlled oscillator) and a PLL (phase-locked loop) is disclosed. The circuit includes a divider for dividing frequency of a signal, a time to digital converter (TDC) for converting the period of the divided signal into digital values, a variance calculator for calculating variance of the period of the divided signal, a mean calculator for calculating mean value of the period of the divided signal, a encoder and counter for encoding and calculating the period of the divided signal, and a state controller as a controller for all other components. The circuit disclosed utilizes output clock of an opened-loop circuit to be measured and a divider for increasing jitter of the original signal. By measuring the bandwidth of a closed-loop circuit, accordingly, jitter of output clock of an opened-loop or an closed-loop circuit is measured by correlating the measured bandwidth and the jitter values from extrapolation.
摘要翻译：公开了一种用于VCO（压控振荡器）和PLL（锁相环）的内置抖动测量电路。该电路包括用于分频信号的分频器，用于将分频信号的周期转换为数字值的时间数字转换器（TDC），用于计算分频信号周期的方差的方差计算器，用于计算分割信号的周期的平均值，用于编码和计算分频信号的周期的编码器和计数器，以及作为所有其他分量的控制器的状态控制器。所公开的电路利用要测量的开环电路的输出时钟和用于增加原始信号的抖动的分频器。通过测量闭环电路的带宽，相应地，通过将测量的带宽与来自外推的抖动值相关联来测量开环或闭环电路的输出时钟的抖动。

9. 发明申请

US20050116877A1 Antenna and fixed base rotary positioning structure 失效
标题翻译：天线和固定基座旋转定位结构
公开(公告)号：US20050116877A1
公开(公告)日：2005-06-02
申请号：US10724061
申请日：2003-12-01
申请人： Wen-Ching Wu
发明人： Wen-Ching Wu
IPC分类号： H01Q1/08 , H01Q3/02
CPC分类号： H01Q1/084
摘要： The present invention discloses an antenna with a fixed base rotary positioning structure, which can be placed on a table or hung on a wall, comprising: a fixed base; a protrusion disposed on the fixed base and having an open end on one side; a chamber enclosed by the rest of three sides; a pivotal axial hole and an arc groove being correspondingly disposed on both sides of the inner wall of the protrusion, such that the pivotal axial hole and the arc groove precisely and pivotally coupling the pivotal axis and the protruded fixing point to the two corresponding sides at one end of the antenna, and the antenna using such pivotal axis as the rotary axis to adjust the antenna to any angle by the open end of the protrusion.
摘要翻译：本发明公开了一种具有固定基座旋转定位结构的天线，其可以放置在桌子上或挂在墙上，包括：固定基座; 突出部，其设置在所述固定基座上并且在一侧具有开口端; 一个由三面其余三边围成的房间; 枢转轴孔和弧槽相应地设置在突起的内壁的两侧，使得枢转轴向孔和弧槽精确地并且枢转地将枢转轴线和突出的固定点联接到两个对应的侧面天线的一端和使用与旋转轴线相关的枢转轴线的天线，以通过突起的开口端将天线调整到任何角度。

10. 发明申请

US20050093511A1 Charger capable of providing illumination light 审中-公开
标题翻译：充电器能够提供照明灯
公开(公告)号：US20050093511A1
公开(公告)日：2005-05-05
申请号：US10840339
申请日：2004-05-06
申请人： Wen-Ching Wu
发明人： Wen-Ching Wu
IPC分类号： H02J7/00
CPC分类号： H05B37/02
摘要： A charger capable of providing illumination light is disclosed. The charger comprises a main body to be coupled with a power source for charging an electronic apparatus, an illumination device disposed on the main body for providing illumination light, and a control switch disposed on the main body and electrically coupled with the illumination device for controlling the illumination device to illuminate light.
摘要翻译：公开了一种能够提供照明光的充电器。充电器包括与电子设备充电的电源耦合的主体，设置在主体上用于提供照明光的照明装置，以及设置在主体上并与照明装置电连接以控制的照明装置照明装置照亮光。

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