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1. 发明申请

US20120016472A1 Color Tactile Vision System 有权
标题翻译：彩色触觉视觉系统
公开(公告)号：US20120016472A1
公开(公告)日：2012-01-19
申请号：US12836498
申请日：2010-07-14
申请人： Yi-Chou Chen , Shih Hung Chen , Yu-Yu Lin , Tung-Hua Chuang
发明人： Yi-Chou Chen , Shih Hung Chen , Yu-Yu Lin , Tung-Hua Chuang
IPC分类号： A61F9/08
CPC分类号： G09B21/003
摘要： A tactile display writer unit includes a probe having a contact tip, and at least a first actuator and a second actuator coupled to the probe, whereby activation of the actuators results in a displacement of the probe tip in one or more of a z-direction and in a lateral direction having a vector in an x-y plane. Also, a display writer includes a plurality of such units supported in an x-y array. The writer units may have a third actuator coupled to the probe. Also, a tactile vision system includes such a display writer, an image processor, and an image sensor. The processor transforms RGB image information from the image sensor into hue-based information having two or more attributes; and the actuators in the tactile display writer are activated by the information attributes. Also, a method for producing a tactile color stimulus at a site on the skin of a subject includes providing a probe having a contact tip; displacing the tip at the contact site in a direction generally normal to the skin surface at the site to an extent that relates one attribute of a hue-based model of the color, and displacing the tip in at least one lateral direction generally in a plane parallel to the skin surface at the site to an extent that relates to at least one additional attribute of the color.
摘要翻译：触觉显示写入器单元包括具有接触尖端的探针，以及耦合到探针的至少第一致动器和第二致动器，由此激活致动器导致探针尖端在z方向上的一个或多个中的位移并且在具有xy平面中的向量的横向方向上。此外，显示器写入器包括以x-y阵列支持的多个这样的单元。写入器单元可以具有耦合到探针的第三致动器。此外，触觉系统包括这样的显示写入器，图像处理器和图像传感器。处理器将RGB图像信息从图像传感器转换为具有两个或多个属性的基于色相的信息; 并且触觉显示写入器中的致动器被信息属性激活。此外，用于在被检体的皮肤上的部位产生触觉刺激的方法包括提供具有接触尖端的探针; 将位于接触位置处的尖端沿着与现场的皮肤表面大致垂直的方向移位到与颜色的基于色相的模型的一个属性相关联的程度，并且将尖端沿至少一个横向方向大致在平面中移位平行于该部位的皮肤表面至与颜色的至少一个附加属性有关的程度。

2. 发明授权

US09368046B2 Color tactile vision system 有权
标题翻译：彩色触觉视觉系统
公开(公告)号：US09368046B2
公开(公告)日：2016-06-14
申请号：US12836498
申请日：2010-07-14
申请人： Yi-Chou Chen , Shih Hung Chen , Yu-Yu Lin , Tung-Hua Chuang
发明人： Yi-Chou Chen , Shih Hung Chen , Yu-Yu Lin , Tung-Hua Chuang
IPC分类号： H04N9/47 , G09B21/00
CPC分类号： G09B21/003
摘要： A tactile display writer unit includes a probe having a contact tip, and at least a first actuator and a second actuator coupled to the probe, whereby activation of the actuators results in a displacement of the probe tip in one or more of a z-direction and in a lateral direction having a vector in an x-y plane. Also, a display writer includes a plurality of such units supported in an x-y array. The writer units may have a third actuator coupled to the probe. Also, a tactile vision system includes such a display writer, an image processor, and an image sensor. The processor transforms RGB image information from the image sensor into hue-based information having two or more attributes; and the actuators in the tactile display writer are activated by the information attributes. Also, a method for producing a tactile color stimulus at a site on the skin of a subject includes providing a probe having a contact tip; displacing the tip at the contact site in a direction generally normal to the skin surface at the site to an extent that relates one attribute of a hue-based model of the color, and displacing the tip in at least one lateral direction generally in a plane parallel to the skin surface at the site to an extent that relates to at least one additional attribute of the color.
摘要翻译：触觉显示写入器单元包括具有接触尖端的探针，以及耦合到探针的至少第一致动器和第二致动器，由此激活致动器导致探针尖端在z方向上的一个或多个中的位移并且在具有xy平面中的向量的横向方向上。此外，显示器写入器包括以x-y阵列支持的多个这样的单元。写入器单元可以具有耦合到探针的第三致动器。此外，触觉系统包括这样的显示写入器，图像处理器和图像传感器。处理器将RGB图像信息从图像传感器转换为具有两个或多个属性的基于色相的信息; 并且触觉显示写入器中的致动器被信息属性激活。此外，用于在被检体的皮肤上的部位产生触觉刺激的方法包括提供具有接触尖端的探针; 将位于接触位置处的尖端沿着与现场的皮肤表面大致垂直的方向移位到与颜色的基于色相的模型的一个属性相关联的程度，并且将尖端沿至少一个横向方向大致在平面中移位平行于该部位的皮肤表面至与颜色的至少一个附加属性有关的程度。

3. 发明授权

US08134139B2 Programmable metallization cell with ion buffer layer 有权
标题翻译：可编程金属化电池与离子缓冲层
公开(公告)号：US08134139B2
公开(公告)日：2012-03-13
申请号：US12692861
申请日：2010-01-25
申请人： Yu-Yu Lin , Feng-Ming Lee , Yi-Chou Chen
发明人： Yu-Yu Lin , Feng-Ming Lee , Yi-Chou Chen
IPC分类号： H01L29/18 , H01L21/06 , H01L45/00
CPC分类号： H01L45/085 , H01L45/122 , H01L45/1233 , H01L45/1266 , H01L45/145
摘要： A programmable metallization device, comprises a first electrode; a memory layer electrically coupled to the first electrode and adapted for electrolytic formation and destruction of a conducting bridge therethrough; an ion-supplying layer containing a source of ions of a first metal element capable of diffusion into and out of the memory layer; a conductive ion buffer layer between the ion-supplying layer and the memory layer, and which allows diffusion therethrough of said ions; and a second electrode electrically coupled to the ion-supplying layer. Circuitry is coupled to the device to apply bias voltages to the first and second electrodes to induce creation and destruction of conducting bridges including the first metal element in the memory layer. The ion buffer layer can improve retention of the conducting bridge by reducing the likelihood that the first metallic element will be absorbed into the ion supplying layer.
摘要翻译：可编程金属化器件，包括第一电极; 存储层，其电耦合到所述第一电极并适于通过其导电桥的电解形成和破坏; 离子供给层，其含有能够扩散到所述存储层中的第一金属元素的离子源; 在离子供给层和存储层之间的导电离子缓冲层，并且允许所述离子的扩散; 以及电耦合到所述离子供应层的第二电极。电路耦合到器件以向第一和第二电极施加偏置电压，以引起包括存储器层中的第一金属元件的导电桥的产生和破坏。离子缓冲层可以通过降低第一金属元素被吸收到离子供给层中的可能性来改善导电桥的保留。

4. 发明申请

US20120146218A1 Semiconductor package device with cavity structure and the packaging method thereof 有权
公开(公告)号：US20120146218A1
公开(公告)日：2012-06-14
申请号：US12929549
申请日：2011-02-01
申请人： Longqiang Zu , Yu-Yu Lin
发明人： Longqiang Zu , Yu-Yu Lin
IPC分类号： H01L23/485 , H01L21/50
CPC分类号： H01L23/16 , H01L23/041 , H01L23/3128 , H01L23/66 , H01L24/32 , H01L24/33 , H01L24/48 , H01L24/83 , H01L24/85 , H01L2224/29011 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/48091 , H01L2224/48227 , H01L2224/73215 , H01L2224/8385 , H01L2224/85181 , H01L2224/92147 , H01L2224/92247 , H01L2225/0651 , H01L2225/06568 , H01L2924/00014 , H01L2924/01019 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device with a cavity structure comprises: a carrier substrate; a first die having an active surface and the pads thereon; a back surface of the first die is disposed on the carrier substrate; a second die having a top surface and a back surface and a cavity structure therein; the top surface of a second die is flipped to dispose on the first die, and the cavity structure is an inverse U-type to dispose between the active surface of the first die and the top surface of the second die; the wires is electrically connected the pads with the first connecting points; a package body encapsulated the first die, the second die, the wires, and the portion of the top surface of the carrier substrate; and the connecting components is disposed on the back surface of the carrier substrate and is electrically connected the second connecting points.

5. 发明申请

US20120032328A1 Package structure with underfilling material and packaging method thereof 审中-公开
标题翻译：包装材料及其包装方法
公开(公告)号：US20120032328A1
公开(公告)日：2012-02-09
申请号：US12923462
申请日：2010-09-23
申请人： Yu-Yu Lin , Chung-Kai Wang , Li-Hua Lin
发明人： Yu-Yu Lin , Chung-Kai Wang , Li-Hua Lin
IPC分类号： H01L23/48 , H01L21/56
CPC分类号： H01L24/83 , H01L21/563 , H01L23/13 , H01L23/4985 , H01L24/16 , H01L24/73 , H01L24/92 , H01L2224/0401 , H01L2224/06135 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/83104 , H01L2224/92125 , H01L2924/014 , H01L2924/0665 , H01L2924/15151 , H01L2924/3641 , H01L2924/00
摘要： A method for packaging semiconductor device is provided, which comprises: providing a carrier substrate having a top surface and a back surface, a circuit arrangement on the top surface of the carrier substrate, and a through hole is disposed near the center of the carrier substrate and is formed passed through the carrier substrate; providing a chip having an active surface and a back surface, a plurality of pads is disposed on the periphery of the active surface and a plurality of connecting elements is disposed thereon; the active surface of chip is flipped and bonded on the circuit arrangement on the top surface of the carrier substrate, and the plurality of connecting elements is not covering the through hole; filling the underfilling material to encapsulate between the plurality of connecting elements and the top surface of the carrier substrate and to fill with the through hole; and performing a suction process to remove the air within the underfilling material between the plurality of connecting elements on the chip and the top surface of the carrier substrate, such that the underfilling material can completely encapsulate between the plurality of connecting elements on the chip and the top surface of the carrier surface.
摘要翻译：提供一种封装半导体器件的方法，其包括：提供具有顶表面和背表面的载体衬底，在载体衬底的顶表面上设置电路装置，并且在载体衬底的中心附近设置通孔并形成通过载体基板; 提供具有活性表面和背面的芯片，多个焊盘设置在有源表面的周边上，并且多个连接元件设置在其上; 芯片的有源表面被翻转并接合在载体基板的顶表面上的电路装置上，并且多个连接元件不覆盖通孔; 填充底填充材料以封装在多个连接元件和载体基板的顶表面之间并填充通孔; 并且进行抽吸处理以去除芯片上的多个连接元件和载体基板的顶表面之间的底部填充材料内的空气，使得底部填充材料可以完全封装在芯片上的多个连接元件和载体表面的顶表面。

6. 发明申请

US20100327725A1 Light-Emitting Diode (LED) Lamp and Polygonal Heat-Dissipation Structure Thereof 审中-公开
标题翻译：发光二极管（LED）灯及其多重散热结构
公开(公告)号：US20100327725A1
公开(公告)日：2010-12-30
申请号：US12492379
申请日：2009-06-26
申请人： Yen-Yu Huang , Yu-Yu Lin , Yu-Chun Lin , Huai-Jen Lu , Wan-Chih Lin
发明人： Yen-Yu Huang , Yu-Yu Lin , Yu-Chun Lin , Huai-Jen Lu , Wan-Chih Lin
IPC分类号： H01J61/52
CPC分类号： F21V29/767 , F21K9/232 , F21V7/0025 , F21Y2107/30 , F21Y2115/10
摘要： A light-emitting diode (LED) lamp and a polygonal heat-dissipation structure thereof are provided. The LED lamp includes a polygonal heat-dissipation unit and a lighting module. The polygonal heat-dissipation unit has a polygonal hollow column and fins. The fins and the lighting module are thermally disposed on an inner surface and an outer surface of the polygonal hollow column, respectively. Thus, heat generated by the lighting module is dissipated by the fins rapidly. As the fins are thermally disposed on the inner surface of the polygon hollow column instead of being exposed, the volume of the LED lamp can be minimized, and the look of the LED lamp also can be prettified.
摘要翻译：提供了一种发光二极管（LED）灯及其多边形散热结构。 LED灯包括多边形散热单元和照明模块。多边形散热单元具有多边形空心柱和翅片。翅片和照明模块分别热分布在多边形中空柱的内表面和外表面上。因此，照明模块产生的热量被散热片快速消散。由于翅片被热设置在多边形中空柱的内表面上而不是暴露，所以可以使LED灯的体积最小化，并且LED灯的外观也可以被优化。

7. 发明授权

US09449909B2 Method of forming a package substrate 有权
标题翻译：形成封装基板的方法
公开(公告)号：US09449909B2
公开(公告)日：2016-09-20
申请号：US13620225
申请日：2012-09-14
申请人： Chin-Sung Lin , Li-Hua Lin , Yu-Yu Lin
发明人： Chin-Sung Lin , Li-Hua Lin , Yu-Yu Lin
IPC分类号： H05K3/34 , H01L23/498 , H01L23/50 , H05K1/02 , H01L23/00
CPC分类号： H01L23/49838 , H01L23/50 , H01L24/29 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/73265 , H01L2224/85444 , H01L2224/85455 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/078 , H01L2924/14 , H01L2924/3011 , H05K1/0253 , H05K3/3436 , Y10T156/1089 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
摘要： In accordance with an embodiment, a method comprises providing a substrate having a conductive material thereon, forming a ground plane, a first trace rail, and a first perpendicular trace from the conductive material, and forming an insulator material over the ground plane, the first trace rail, and the first perpendicular trace. The ground plane is between the first trace rail and an area of the substrate over which will be a die. The first trace rail extends along a first outer edge of the ground plane, and the first perpendicular trace is coupled to the first trace rail and extends perpendicularly from the first trace rail.
摘要翻译：根据实施例，一种方法包括在其上提供具有导电材料的基板，从导电材料形成接地平面，第一迹线轨道和第一垂直迹线，以及在接地平面上形成绝缘体材料，第一轨迹轨迹和第一条垂直轨迹。接地平面位于第一轨迹和衬底的区域之间，在该区域上将是模具。第一轨迹沿接地平面的第一外边缘延伸，并且第一垂直迹线耦合到第一迹线轨道并且从第一轨迹线垂直延伸。

8. 发明授权

US09053949B2 Semiconductor device and associated method with heat spreader having protrusion 有权
标题翻译：具有突起的散热器的半导体装置及其相关方法
公开(公告)号：US09053949B2
公开(公告)日：2015-06-09
申请号：US13548311
申请日：2012-07-13
申请人： Yu-Yu Lin
发明人： Yu-Yu Lin
IPC分类号： H01L23/10 , H01L25/065 , H01L23/367 , H01L25/10 , H01L23/498 , H01L23/00 , H01L25/16 , H01L25/18
CPC分类号： H01L25/0655 , H01L23/367 , H01L23/49816 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/105 , H01L25/16 , H01L25/18 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32245 , H01L2224/73253 , H01L2224/81191 , H01L2224/81801 , H01L2224/8385 , H01L2224/92225 , H01L2225/1005 , H01L2924/014
摘要： The invention provides a semiconductor device and associated method, which includes a substrate, a first die, multiple sub-package systems surrounding the first die, and a heat spreader. The first die and the sub-package systems are installed on a same surface of the substrate, wherein projections of the first die and each sub-package system on the surface partially overlap, and have a portion not overlapping. Each of the sub-package systems includes an interposer and multiple second dice installed on the interposer by way of flip-chip. The heat spreader includes a protrusion portion and a dissipation plate; the dissipation plate covers the first die and the sub-package systems, and the protrusion portion is set between the dissipation plate and the first die.
摘要翻译：本发明提供一种半导体器件及其相关方法，其包括衬底，第一裸片，围绕第一裸片的多个子封装系统和散热器。第一模具和子包装系统安装在基板的相同表面上，其中第一模具和表面上的每个子封装系统的突出部分重叠，并且具有不重叠的部分。每个子封装系统包括通过倒装芯片安装在插入器上的插入器和多个第二裸片。散热器包括突出部分和散热板; 散热板覆盖第一模具和子封装体系，突起部分设置在散热板和第一模具之间。

9. 发明申请

US20140036570A1 OPERATING METHOD FOR MEMORY DEVICE AND MEMORY ARRAY AND OPERATING METHOD FOR THE SAME 有权
标题翻译：用于存储器件和存储器阵列的操作方法及其操作方法
公开(公告)号：US20140036570A1
公开(公告)日：2014-02-06
申请号：US13567750
申请日：2012-08-06
申请人： Feng-Min Lee , Yu-Yu Lin , Ming-Hsiu Lee
发明人： Feng-Min Lee , Yu-Yu Lin , Ming-Hsiu Lee
IPC分类号： G11C7/00 , G11C11/00
CPC分类号： G11C13/0069 , G11C13/0004 , G11C13/0007 , G11C13/0011 , G11C13/0033 , G11C13/004 , G11C2013/0047 , G11C2013/0052 , G11C2013/0073 , G11C2213/77
摘要： An operating method for a memory device and a memory array and an operating method for the same are provided. The operating method for the memory device comprises following steps. A memory device is made being in a set state. A method for making the memory device being in the set state comprises applying a first bias voltage to the memory device. The memory device in the set state is read. A method for reading the memory device in the set state comprises applying a second bias voltage to the memory device. A recovering bias voltage is applied to the memory device. The step for applying the recovering bias voltage is performed after the step for applying the first bias voltage or the step for applying the second bias voltage.
摘要翻译：提供了一种用于存储器件和存储器阵列的操作方法及其操作方法。存储器件的操作方法包括以下步骤。使存储器件处于置位状态。用于使存储器件处于设置状态的方法包括将第一偏置电压施加到存储器件。读取设置状态的存储器件。一种在设定状态下读取存储器件的方法，包括将第二偏置电压施加到存储器件。将恢复的偏置电压施加到存储器件。在施加第一偏置电压的步骤或施加第二偏置电压的步骤之后执行用于施加恢复偏压的步骤。

10. 发明申请

US20130032937A1 SEMICONDUCTOR DEVICE AND ASSOCIATED METHOD 有权
标题翻译：半导体器件及相关方法
公开(公告)号：US20130032937A1
公开(公告)日：2013-02-07
申请号：US13548311
申请日：2012-07-13
申请人： Yu-Yu Lin
发明人： Yu-Yu Lin
IPC分类号： H01L23/34 , H01L21/50
CPC分类号： H01L25/0655 , H01L23/367 , H01L23/49816 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/105 , H01L25/16 , H01L25/18 , H01L2224/131 , H01L2224/16225 , H01L2224/16227 , H01L2224/2919 , H01L2224/32245 , H01L2224/73253 , H01L2224/81191 , H01L2224/81801 , H01L2224/8385 , H01L2224/92225 , H01L2225/1005 , H01L2924/014
摘要： The invention provides a semiconductor device and associated method, which includes a substrate, a first die, multiple sub-package systems surrounding the first die, and a heat spreader. The first die and the sub-package systems are installed on a same surface of the substrate, wherein projections of the first die and each sub-package system on the surface partially overlap, and have a portion not overlapping. Each of the sub-package systems includes an interposer and multiple second dice installed on the interposer by way of flip-chip. The heat spreader includes a protrusion portion and a dissipation plate; the dissipation plate covers the first die and the sub-package systems, and the protrusion portion is set between the dissipation plate and the first die.
摘要翻译：本发明提供一种半导体器件及其相关方法，其包括衬底，第一裸片，围绕第一裸片的多个子封装系统和散热器。第一模具和子包装系统安装在基板的相同表面上，其中第一模具和表面上的每个子封装系统的突出部分重叠，并且具有不重叠的部分。每个子封装系统包括通过倒装芯片安装在插入器上的插入器和多个第二裸片。散热器包括突出部分和散热板; 散热板覆盖第一模具和子封装体系，突起部分设置在散热板和第一模具之间。

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