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    • 3. 发明授权
    • Method of evaluating the cleanliness of silicon wafers
    • 评估硅片清洁度的方法
    • US3982976A
    • 1976-09-28
    • US530637
    • 1974-12-09
    • Edmund T. Marciniec
    • Edmund T. Marciniec
    • H01L21/306H01L21/3065H01L7/50
    • H01L21/02046H01L21/3065
    • The cleanliness of silicon wafers is evaluated. At various stages of I.C. manufacture, silicon wafers may contain undesirable inorganic and organic contaminants and residues, the presence of which may be due to initial growing and slicing or to subsequent manufacturing steps such as the removal of photoresists. The present method involves differential etching of the silicon wafers. In a manner that removes silicon at a much faster rate than the contaminants and residues are removed. The differential etching is effected by subjecting the wafers to a low pressure, low temperature, RF, reactive plasma which includes a halocarbon gas, and oxygen for a time sufficient to texture the wafer. The differential etching continues at least until the onset of texturing which replicates the pattern of contaminants or residues initially present thereon for visual inspection.
    • 评估硅片的清洁度。 在I.C.的各个阶段 硅晶片可能含有不需要的无机和有机污染物和残留物,其存在可能是由于初始生长和切片或其后的制备步骤,如去除光致抗蚀剂。 本方法包括硅晶片的差分蚀刻。 以一种以比污染物快得多的速度除去硅的方式,残留物被去除。 微差蚀刻通过使晶片经受包括卤代烃气体在内的低压,低温,RF反应等离子体和氧气足以使晶片纹理化而实现。 差异蚀刻至少持续到纹理的开始,复制了最初存在于其上的污染物或残留物的图案以用于目视检查。
    • 5. 发明授权
    • Thin film thermal print head
    • 薄膜热敏打印头
    • US4298786A
    • 1981-11-03
    • US81003
    • 1979-10-01
    • Edmund T. Marciniec
    • Edmund T. Marciniec
    • B41J2/335G03F7/00H05K3/10H05B3/16
    • B41J2/3351B41J2/33515B41J2/3353B41J2/33535B41J2/3355B41J2/3357B41J2/3359G03F7/00H05K3/107Y10T29/49083Y10T29/49099
    • A dielectric substrate for a thin film dot matrix thermal print head has its working surface etched or otherwise treated for selective removal of the dielectric material in all areas that are to constitute electrical connectors for the resistance heater print elements, to a depth approximately equal to the sum of the thicknesses of all of the conductive films to be applied to the substrate surface in those areas, following which the working surface of the substrate is selectively coated with films of high-resistance electrically conductive material and low-resistance conductive material, with suitable adhesion films as required, to complete the operating elements of the print head. An outer protective wear-resistant film may also be employed on the entire print head surface or on only the electrical connector areas. The print head has its resistance heater print elements and its blank spaces all raised to approximately the same level as the outer surfaces of the electrical connectors affording improved performance and longer operating life; the etching of the substrate is effected by a process that leaves positive transition slopes to assure effective electrical connections to the print elements.
    • 用于薄膜点阵热敏打印头的电介质衬底具有蚀刻或其它处理的工作表面,用于选择性地去除构成用于电阻加热器打印元件的电连接器的所有区域中的电介质材料,其深度大致等于 在这些区域中施加到基板表面的所有导电膜的厚度之和,随后基板的工作表面选择性地涂覆有高电阻导电材料和低电阻导电材料的膜,具有合适的 粘贴膜根据需要,完成打印头的操作元件。 外部保护性耐磨膜也可以用于整个打印头表面或仅在电连接器区域上。 打印头具有其电阻加热器打印元件,并且其空白空间均与电连接器的外表面升高到大致相同的水平,提供改进的性能和更长的使用寿命; 衬底的蚀刻通过留下正转移斜率以确保与印刷元件的有效电连接的过程来实现。
    • 6. 发明授权
    • Method of manufacturing thin film thermal print heads
    • 制造薄膜热敏打印头的方法
    • US4206541A
    • 1980-06-10
    • US918845
    • 1978-06-26
    • Edmund T. Marciniec
    • Edmund T. Marciniec
    • B41J2/335G03F7/00H05K3/10H05B3/16
    • B41J2/3351B41J2/33515B41J2/3353B41J2/33535B41J2/3355B41J2/3357B41J2/3359G03F7/00H05K3/107Y10T29/49083Y10T29/49099
    • A dielectric substrate for a thin film dot matrix thermal print head has its working surface etched or otherwise treated to selectively remove the dielectric material, in all areas which will constitute electrical connectors for the resistance heater print elements, to a depth at least equal to the sum of the thicknesses of all of the conductive films to be applied to the substrate surface in those areas, following which the working surface of the substrate is selectively coated with films of high-resistance electrically conductive material and low-resistance conductive material, with suitable adhesion films as required, to complete the print head. An outer protective wear-resistant film is also employed. The resultant print head has its resistance heater print elements and blank surface elements raised at least to the same level as the outer surfaces of the electrical connectors, and preferably slightly higher, to provide improved performance and operating life.
    • 用于薄膜点阵热敏打印头的电介质基底具有蚀刻或以其它方式处理的工作表面,以在将构成电阻加热器印刷元件的电连接器的所有区域中选择性地去除介电材料至至少等于 在这些区域中施加到基板表面的所有导电膜的厚度之和,随后基板的工作表面选择性地涂覆有高电阻导电材料和低电阻导电材料的膜,具有合适的 粘贴膜根据需要,完成打印头。 还采用外部保护性耐磨膜。 所得的打印头具有其电阻加热器打印元件和空白表面元件至少升高到与电连接器的外表面相同的水平面,并且优选略高,以提供改进的性能和使用寿命。