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1. 发明授权

US08398812B2 Apparatus and method for treating substrates 有权
标题翻译：用于处理底物的装置和方法
公开(公告)号：US08398812B2
公开(公告)日：2013-03-19
申请号：US11888204
申请日：2007-07-31
申请人： Yi Jung Kim , Kyung Jin Seo , Chang Ro Yoon , Jung Keun Cho
发明人： Yi Jung Kim , Kyung Jin Seo , Chang Ro Yoon , Jung Keun Cho
IPC分类号： C25F5/00 , B08B3/02
CPC分类号： B08B7/0035 , G03F7/422 , G03F7/427 , H01L21/67069 , H01L21/6708
摘要： A substrate treating apparatus for stripping photoresist on a substrate includes a support part for supporting the substrate, a dry-type treating part for stripping the photoresist on the substrate, and a wet-type treating part for stripping the photoresist on the substrate. While the substrate is supported by the support part, the photoresist on the substrate is primarily stripped by means of the dry-type treating part and secondarily stripped by means of the wet-type treating part. The dry-type treating part includes a plasma supply unit configured to supply plasma onto the substrate and a moving unit configured to vary a relative position of the plasma supply unit and the substrate.
摘要翻译：用于剥离基板上的光致抗蚀剂的基板处理装置包括用于支撑基板的支撑部分，用于剥离基板上的光致抗蚀剂的干式处理部分和用于剥离基板上的光致抗蚀剂的湿式处理部件。当基板由支撑部支撑时，基板上的光致抗蚀剂主要通过干式处理部分剥离，并且通过湿式处理部分二次剥离。干式处理部件包括：等离子体供给单元，其被配置为将等离子体供应到基板上;以及移动单元，被配置为改变等离子体供给单元和基板的相对位置。

2. 发明申请

US20080047580A1 Apparatus and method for treating substrates 有权
标题翻译：用于处理底物的装置和方法
公开(公告)号：US20080047580A1
公开(公告)日：2008-02-28
申请号：US11888204
申请日：2007-07-31
申请人： Yi Jung Kim , Kyung Jin Seo , Chang Ro Yoon , Jung Keun Cho
发明人： Yi Jung Kim , Kyung Jin Seo , Chang Ro Yoon , Jung Keun Cho
IPC分类号： C25F5/00 , B08B3/02
CPC分类号： B08B7/0035 , G03F7/422 , G03F7/427 , H01L21/67069 , H01L21/6708
摘要： A substrate treating apparatus for stripping photoresist on a substrate includes a support part for supporting the substrate, a dry-type treating part for stripping the photoresist on the substrate, and a wet-type treating part for stripping the photoresist on the substrate. While the substrate is supported by the support part, the photoresist on the substrate is primarily stripped by means of the dry-type treating part and secondarily stripped by means of the wet-type treating part. The dry-type treating part includes a plasma supply unit configured to supply plasma onto the substrate and a moving unit configured to vary a relative position of the plasma supply unit and the substrate.
摘要翻译：用于剥离基板上的光致抗蚀剂的基板处理装置包括用于支撑基板的支撑部分，用于剥离基板上的光致抗蚀剂的干式处理部分和用于剥离基板上的光致抗蚀剂的湿式处理部件。当基板由支撑部支撑时，基板上的光致抗蚀剂主要通过干式处理部分剥离，并且通过湿式处理部分二次剥离。干式处理部件包括：等离子体供给单元，其被配置为将等离子体供应到基板上;以及移动单元，被配置为改变等离子体供给单元和基板的相对位置。

3. 发明授权

US07963248B2 Plasma generator, substrate treating apparatus including the same and substrate treating method 有权
标题翻译：等离子体发生器，包括其的基板处理装置和基板处理方法
公开(公告)号：US07963248B2
公开(公告)日：2011-06-21
申请号：US11888243
申请日：2007-07-31
申请人： Yi Jung Kim
发明人： Yi Jung Kim
IPC分类号： C23C16/00 , C23F1/00 , H01L21/306
CPC分类号： H01J37/32825 , H01J37/32568 , H05H1/2406 , H05H2001/2418 , H05H2001/2431
摘要： A plasma generator includes a gas supply member configured to supply source gas and a plurality of electrodes for generating plasma using the source gas. The plurality of electrodes have a long rod shape in a first direction and are arranged abreast in a second direction vertical to the first direction to be spaced apart from each other at the same height. A spaced distance between electrodes is adjusted by means of a distance adjusting unit including a first connector connected to a first electrode, a second connector connected to a second electrode, and a first shaft pin connecting the first and second connectors to each other. The first and second connectors rotate on the first shaft pin to adjust a spaced distance between the first and second electrodes.
摘要翻译：等离子体发生器包括：气体供给构件，其构造成供应源气体和多个用于使用源气体产生等离子体的电极。多个电极在第一方向上具有长棒状，并且在与第一方向垂直的第二方向上并排布置，以在相同的高度彼此间隔开。通过距离调节单元来调整电极之间的间隔距离，所述距离调节单元包括连接到第一电极的第一连接器，连接到第二电极的第二连接器和将第一和第二连接器彼此连接的第一轴销。第一和第二连接器在第一轴销上旋转以调节第一和第二电极之间的间隔距离。

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