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1. 发明申请

US20110316130A1 THIN SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：薄半导体封装及其制造方法
公开(公告)号：US20110316130A1
公开(公告)日：2011-12-29
申请号：US13092159
申请日：2011-04-22
申请人： Yeqing Su , Zhigang Bai , Weimin Chen , Wei Shen , Jianhong Wang , Baoguan Yin , Wanming Yu
发明人： Yeqing Su , Zhigang Bai , Weimin Chen , Wei Shen , Jianhong Wang , Baoguan Yin , Wanming Yu
IPC分类号： H01L23/495 , H01L21/28
CPC分类号： H01L21/6835 , H01L21/568 , H01L23/3107 , H01L23/49541 , H01L24/48 , H01L24/85 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/8501 , H01L2924/00014 , H01L2924/18165 , H01L2224/45099
摘要： A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads.
摘要翻译：一种用于制造薄半导体封装的方法，包括：提供具有可移除基板的引线框架，该可移除基板具有附接到引线框架的第一表面的附接表面。引线框架由导电片形成，并且具有从引线框架边界朝向引线框架的中心区域向内延伸的引线。半导体管芯安装在中央区域的可拆卸基板上。半导体管芯具有连接焊盘表面，其上具有焊盘，并且连接焊盘表面附接到可移除基板的附接表面。引线框架和管芯用第一密封剂封装，使得引线框架夹在第一密封剂和可移除基板之间。将可移除基板从引线框架移除以露出引线框架的第一表面，然后将管芯焊盘电连接到相应的引线。然后，管芯和引线框架用第二密封剂封装，使得引线框架和管芯夹在第一和第二密封剂之间。然后去除部分第一密封剂以减小包装的厚度并暴露引线。

2. 发明授权

US08354739B2 Thin semiconductor package and method for manufacturing same 有权
标题翻译：薄半导体封装及其制造方法
公开(公告)号：US08354739B2
公开(公告)日：2013-01-15
申请号：US13092159
申请日：2011-04-22
申请人： Yeqing Su , Zhigang Bai , Weimin Chen , Wei Shen , Jianhong Wang , Baoguan Yin , Wanming Yu
发明人： Yeqing Su , Zhigang Bai , Weimin Chen , Wei Shen , Jianhong Wang , Baoguan Yin , Wanming Yu
IPC分类号： H01L23/495 , H01L21/28
CPC分类号： H01L21/6835 , H01L21/568 , H01L23/3107 , H01L23/49541 , H01L24/48 , H01L24/85 , H01L2224/05554 , H01L2224/48091 , H01L2224/48247 , H01L2224/8501 , H01L2924/00014 , H01L2924/18165 , H01L2224/45099
摘要： A method for manufacturing a thin semiconductor package includes providing a lead frame with a removable substrate that has an attaching surface attached to a first surface of the lead frame. The lead frame is formed from an electrically conductive sheet and has leads that extend inwardly from a lead frame boundary towards a central region of the lead frame. A semiconductor die is mounted on the removable substrate at the central region. The semiconductor die has a connection pad surface with die pads on it, and the connection pad surface is attached to the attaching surface of the removable substrate. The lead frame and die are encapsulated with a first encapsulant so that the lead frame is sandwiched between the first encapsulant and the removable substrate. The removable substrate is removed from the lead frame to expose the first surface of the lead frame and then the die pads are electrically connected to respective ones of the leads. The die and lead frame then are encapsulated with a second encapsulant so that the lead frame and die are sandwiched between the first and second encapsulants. Part of the first encapsulant is then removed to reduce the thickness of the package and expose the leads.
摘要翻译：一种用于制造薄半导体封装的方法，包括：提供具有可移除基板的引线框架，该可移除基板具有附接到引线框架的第一表面的附接表面。引线框架由导电片形成，并且具有从引线框架边界朝向引线框架的中心区域向内延伸的引线。半导体管芯安装在中央区域的可拆卸基板上。半导体管芯具有连接焊盘表面，其上具有焊盘，并且连接焊盘表面附接到可移除基板的附接表面。引线框架和管芯用第一密封剂封装，使得引线框架夹在第一密封剂和可移除基板之间。将可移除基板从引线框架移除以露出引线框架的第一表面，然后将管芯焊盘电连接到相应的引线。然后，管芯和引线框架用第二密封剂封装，使得引线框架和管芯夹在第一和第二密封剂之间。然后去除部分第一密封剂以减小包装的厚度并暴露引线。

3. 发明申请

US20140127862A1 METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE INCLUDING INSULATING SUBSTRATE AND HEAT SINK 有权
标题翻译：组装绝缘衬底和散热片的半导体器件的方法
公开(公告)号：US20140127862A1
公开(公告)日：2014-05-08
申请号：US14155309
申请日：2014-01-14
申请人： Junhua Luo , Jinzhong Yao , Baoguan Yin
发明人： Junhua Luo , Jinzhong Yao , Baoguan Yin
IPC分类号： H01L21/56
CPC分类号： H01L21/561 , H01L23/13 , H01L23/3128 , H01L23/4334 , H01L23/49816 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/97 , H01L2224/291 , H01L2224/32225 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83 , H01L2224/85 , H01L2224/92247 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/01029 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/014 , H01L2924/00 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated.
摘要翻译：半导体管芯安装在散热片阵列框架结构上。散热器阵列框架结构和半导体管芯与绝缘基板组装在一起，绝缘基板在胶带上具有相应的孔阵列。半导体管芯与绝缘基板上的电触点电连接。半导体管芯，散热器和与触点的电气连接用模具化合物封装，然后封装的阵列被去磁和分离。

4. 发明申请

US20140357023A1 SEMICONDUCTOR DEVICE PACKAGE WITH CAP ELEMENT 有权
公开(公告)号：US20140357023A1
公开(公告)日：2014-12-04
申请号：US14459331
申请日：2014-08-14
申请人： Baoguan Yin , Junhua Luo , Deguo Sun
发明人： Baoguan Yin , Junhua Luo , Deguo Sun
IPC分类号： H01L23/495 , H01L21/78
CPC分类号： H01L23/49575 , H01L21/56 , H01L21/561 , H01L21/78 , H01L23/3107 , H01L23/4334 , H01L23/49 , H01L23/49537 , H01L23/49541 , H01L24/97 , H01L2224/48091 , H01L2224/97 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A method of assembling a semiconductor device includes providing a substrate having an array of substrate elements linked by substrate corner elements and separated by slots extending between the corner elements. Semiconductor dies are positioned on the substrate elements. A cap, frame and contact structure is provided that has a corresponding array of caps supported by corner legs linking the caps to frame corner elements, frame elements linking the frame corner elements, and sets of electrical contact elements supported by the frame elements. The cap, frame and contact structure is fitted on the substrate with the caps extending over corresponding dies, the frame corner elements extending over the substrate corner elements, and the sets of electrical contact elements disposed in the slots. The dies are connected electrically with the electrical contact elements and the assembly is encapsulated and singulated. Singulating removes the frame elements.

5. 发明授权

US09093438B2 Semiconductor device package with cap element 有权
标题翻译：带帽元件的半导体器件封装
公开(公告)号：US09093438B2
公开(公告)日：2015-07-28
申请号：US14459331
申请日：2014-08-14
申请人： Baoguan Yin , Junhua Luo , Deguo Sun
发明人： Baoguan Yin , Junhua Luo , Deguo Sun
IPC分类号： H01L21/00 , H01L23/495 , H01L23/49 , H01L21/56 , H01L23/433 , H01L23/00 , H01L21/78 , H01L23/31
CPC分类号： H01L23/49575 , H01L21/56 , H01L21/561 , H01L21/78 , H01L23/3107 , H01L23/4334 , H01L23/49 , H01L23/49537 , H01L23/49541 , H01L24/97 , H01L2224/48091 , H01L2224/97 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A method of assembling a semiconductor device includes providing a substrate having an array of substrate elements linked by substrate corner elements and separated by slots extending between the corner elements. Semiconductor dies are positioned on the substrate elements. A cap, frame and contact structure is provided that has a corresponding array of caps supported by corner legs linking the caps to frame corner elements, frame elements linking the frame corner elements, and sets of electrical contact elements supported by the frame elements. The cap, frame and contact structure is fitted on the substrate with the caps extending over corresponding dies, the frame corner elements extending over the substrate corner elements, and the sets of electrical contact elements disposed in the slots. The dies are connected electrically with the electrical contact elements and the assembly is encapsulated and singulated. Singulating removes the frame elements.
摘要翻译：一种组装半导体器件的方法包括提供具有由衬底角元件连接的衬底元件阵列并由角部元件之间延伸的槽分隔的衬底。半导体管芯位于衬底元件上。提供了一种帽，框架和接触结构，其具有相应的帽子阵列，所述帽子由将帽子连接到框架角元件，连接框架角元件的框架元件以及由框架元件支撑的一组电接触元件的角部支腿支撑。盖，框架和接触结构安装在基板上，盖子延伸在对应的模具上，框架角元件延伸在基板角元件上，并且设置在槽中的电接触元件组。模具与电接触元件电连接并且组件被封装和分割。 Singulating移除框架元素。

6. 发明授权

US08836105B2 Semiconductor device package with cap element 有权
标题翻译：带帽元件的半导体器件封装
公开(公告)号：US08836105B2
公开(公告)日：2014-09-16
申请号：US13681437
申请日：2012-11-20
申请人： Baoguan Yin , Junhua Luo , Deguo Sun
发明人： Baoguan Yin , Junhua Luo , Deguo Sun
IPC分类号： H01L23/48 , H01L23/00 , H01L21/56 , H01L23/49 , H01L23/495 , H01L23/433 , H01L23/31
CPC分类号： H01L23/49575 , H01L21/56 , H01L21/561 , H01L21/78 , H01L23/3107 , H01L23/4334 , H01L23/49 , H01L23/49537 , H01L23/49541 , H01L24/97 , H01L2224/48091 , H01L2224/97 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A method of assembling a semiconductor device includes providing a substrate having an array of substrate elements linked by substrate corner elements and separated by slots extending between the corner elements. Semiconductor dies are positioned on the substrate elements. A cap, frame and contact structure is provided that has a corresponding array of caps supported by corner legs linking the caps to frame corner elements, frame elements linking the frame corner elements, and sets of electrical contact elements supported by the frame elements. The cap, frame and contact structure is fitted on the substrate with the caps extending over corresponding dies, the frame corner elements extending over the substrate corner elements, and the sets of electrical contact elements disposed in the slots. The dies are connected electrically with the electrical contact elements and the assembly is encapsulated and singulated. Singulating removes the frame elements.
摘要翻译：一种组装半导体器件的方法包括提供具有由衬底角元件连接的衬底元件阵列并由角部元件之间延伸的槽分隔的衬底。半导体管芯位于衬底元件上。提供了一种帽，框架和接触结构，其具有相应的帽子阵列，所述帽子由将帽子连接到框架角元件，连接框架角元件的框架元件以及由框架元件支撑的一组电接触元件的角部支腿支撑。盖，框架和接触结构安装在基板上，盖子延伸在对应的模具上，框架角元件延伸在基板角元件上，并且设置在槽中的电接触元件组。模具与电接触元件电连接并且组件被封装和分割。 Singulating移除框架元素。

7. 发明授权

US08643170B2 Method of assembling semiconductor device including insulating substrate and heat sink 有权
标题翻译：包括绝缘基板和散热片的半导体器件组装方法
公开(公告)号：US08643170B2
公开(公告)日：2014-02-04
申请号：US13442878
申请日：2012-04-10
申请人： Junhua Luo , Jinzhong Yao , Baoguan Yin
发明人： Junhua Luo , Jinzhong Yao , Baoguan Yin
IPC分类号： H01L23/34
CPC分类号： H01L21/561 , H01L23/13 , H01L23/3128 , H01L23/4334 , H01L23/49816 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/97 , H01L2224/291 , H01L2224/32225 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83 , H01L2224/85 , H01L2224/92247 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/01029 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/014 , H01L2924/00 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated.
摘要翻译：半导体管芯安装在散热片阵列框架结构上。散热器阵列框架结构和半导体管芯与绝缘基板组装在一起，绝缘基板在胶带上具有相应的孔阵列。半导体管芯与绝缘基板上的电触点电连接。半导体管芯，散热器和与触点的电气连接用模具化合物封装，然后封装的阵列被去磁和分离。

8. 发明授权

US08722465B1 Method of assembling semiconductor device including insulating substrate and heat sink 有权
公开(公告)号：US08722465B1
公开(公告)日：2014-05-13
申请号：US14155309
申请日：2014-01-14
申请人： Junhua Luo , Jinzhong Yao , Baoguan Yin
发明人： Junhua Luo , Jinzhong Yao , Baoguan Yin
IPC分类号： H01L21/00
CPC分类号： H01L21/561 , H01L23/13 , H01L23/3128 , H01L23/4334 , H01L23/49816 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/97 , H01L2224/291 , H01L2224/32225 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83 , H01L2224/85 , H01L2224/92247 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/01029 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/014 , H01L2924/00 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated.

9. 发明申请

US20140027896A1 SEMICONDUCTOR DEVICE PACKAGE WITH CAP ELEMENT 有权
标题翻译：带有元件的半导体器件封装
公开(公告)号：US20140027896A1
公开(公告)日：2014-01-30
申请号：US13681437
申请日：2012-11-20
申请人： Baoguan Yin , Junhua Luo , Deguo Sun
发明人： Baoguan Yin , Junhua Luo , Deguo Sun
IPC分类号： H01L23/49 , H01L21/56
CPC分类号： H01L23/49575 , H01L21/56 , H01L21/561 , H01L21/78 , H01L23/3107 , H01L23/4334 , H01L23/49 , H01L23/49537 , H01L23/49541 , H01L24/97 , H01L2224/48091 , H01L2224/97 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： A method of assembling a semiconductor device includes providing a substrate having an array of substrate elements linked by substrate corner elements and separated by slots extending between the corner elements. Semiconductor dies are positioned on the substrate elements. A cap, frame and contact structure is provided that has a corresponding array of caps supported by corner legs linking the caps to frame corner elements, frame elements linking the frame corner elements, and sets of electrical contact elements supported by the frame elements. The cap, frame and contact structure is fitted on the substrate with the caps extending over corresponding dies, the frame corner elements extending over the substrate corner elements, and the sets of electrical contact elements disposed in the slots. The dies are connected electrically with the electrical contact elements and the assembly is encapsulated and singulated. Singulating removes the frame elements.
摘要翻译：一种组装半导体器件的方法包括提供具有由衬底角元件连接的衬底元件阵列并由角部元件之间延伸的槽分隔的衬底。半导体管芯位于衬底元件上。提供了一种帽，框架和接触结构，其具有相应的帽子阵列，所述帽子由将帽子连接到框架角元件，连接框架角元件的框架元件以及由框架元件支撑的一组电接触元件的角部支腿支撑。盖，框架和接触结构安装在基板上，盖子延伸在对应的模具上，框架角元件延伸在基板角元件上，并且设置在槽中的电接触元件组。模具与电接触元件电连接并且组件被封装和分割。 Singulating移除框架元素。

10. 发明申请

US20120264258A1 METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE INCLUDING INSULATING SUBSTRATE AND HEAT SINK 有权
标题翻译：组装绝缘衬底和散热片的半导体器件的方法
公开(公告)号：US20120264258A1
公开(公告)日：2012-10-18
申请号：US13442878
申请日：2012-04-10
申请人： Junhua LUO , Jinzhong Yao , Baoguan Yin
发明人： Junhua LUO , Jinzhong Yao , Baoguan Yin
IPC分类号： H01L21/78
CPC分类号： H01L21/561 , H01L23/13 , H01L23/3128 , H01L23/4334 , H01L23/49816 , H01L24/48 , H01L24/83 , H01L24/85 , H01L24/97 , H01L2224/291 , H01L2224/32225 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83 , H01L2224/85 , H01L2224/92247 , H01L2224/97 , H01L2924/00013 , H01L2924/00014 , H01L2924/01029 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/014 , H01L2924/00 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： Semiconductor dies are mounted on a heat sink array frame structure. The heat sink array frame structure and the semiconductor dies are assembled together with an insulating substrate that has a corresponding array of apertures on an adhesive tape. The semiconductor dies are connected electrically with electrical contacts on the insulating substrate. The semiconductor dies, heat sinks and electrical connections to the contacts are encapsulated with a mold compound and then the encapsulated array is de-taped and singulated.
摘要翻译：半导体管芯安装在散热片阵列框架结构上。散热器阵列框架结构和半导体管芯与绝缘基板组装在一起，绝缘基板在胶带上具有相应的孔阵列。半导体管芯与绝缘基板上的电触点电连接。半导体管芯，散热器和与触点的电气连接用模具化合物封装，然后封装的阵列被去磁和分离。

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