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1. 发明授权

US07130192B2 Heat dissipating device 失效
标题翻译：散热装置
公开(公告)号：US07130192B2
公开(公告)日：2006-10-31
申请号：US10833976
申请日：2004-04-27
申请人： Yaxiong Wang , Shun Chi Dong , Chung-Yuan Huang , Aimin Huang
发明人： Yaxiong Wang , Shun Chi Dong , Chung-Yuan Huang , Aimin Huang
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a heat sink (10) and a fan (30) generating airflow. The heat sink has a base (11) and a plurality of first fins (13) extending therefrom. First airflow channels (132) are defined between the first fins. A plurality of second fins (15) are transversely attached to the first fins. The second fins have second airflow channels (152) defined therebetween. The second airflow channels communicate with the first airflow channels.
摘要翻译：散热装置适于从电子包装中去除热量。散热装置包括散热器（10）和产生气流的风扇（30）。散热器具有从其延伸的基部（11）和多个第一散热片（13）。第一气流通道（132）被限定在第一散热片之间。多个第二散热片（15）横向地附接到第一散热片。第二散热片具有限定在其间的第二气流通道（152）。第二气流通道与第一气流通道相通。

2. 发明授权

US07055577B2 Heat dissipation device for electronic device 失效
标题翻译：电子设备散热装置
公开(公告)号：US07055577B2
公开(公告)日：2006-06-06
申请号：US10778704
申请日：2004-02-12
申请人： Yaxiong Wang , Shun Chi Dong , Chung-Yuan Huang
发明人： Yaxiong Wang , Shun Chi Dong , Chung-Yuan Huang
IPC分类号： F28F7/00
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a column (1) for being positioned on an electronic device for dissipating heat therefrom, a plurality of fin units (5) attached to and stacked along the column, an H-shaped securing member (3) attached to the column below the fin units for securing the heat dissipation device to the electronic device, a pair of fan supports (7) extending from opposite sides of the securing member, and a fan (9) mounted on the fan supports. The fin units define a plurality of sprial air passages along an axis of the column which consist with air flow of the fan. Each of the fin units is configured by a metal disc with a plurality of sectors (54, 54′, 54″) and channels (56, 56′, 56″) between adjacent sectors.
摘要翻译：一种散热装置，包括用于定位在电子装置上用于散发热量的柱（1），沿着柱附接并堆叠的多个翅片单元（5），附接到该柱的H形固定构件（3）用于将散热装置固定到电子装置的一对风扇支架（7），以及安装在风扇支架上的风扇（9）。翅片单元沿着柱的轴线限定多个沿风扇的空气流组成的空气通道。每个鳍单元由具有多个扇区（54,54'，54“）的金属盘和相邻扇区之间的通道（56,56'，56”）构成。

3. 发明授权

US06958915B2 Heat dissipating device for electronic component 失效
标题翻译：电子元件散热装置
公开(公告)号：US06958915B2
公开(公告)日：2005-10-25
申请号：US10681390
申请日：2003-10-07
申请人： Yaxiong Wang , Chung-Yuan Huang , Shun Chi Dong
发明人： Yaxiong Wang , Chung-Yuan Huang , Shun Chi Dong
IPC分类号： F28D15/02 , F28F1/32 , G06F1/16 , G06F1/20 , H01L23/34 , H01L23/40 , H01L23/427 , H01L23/467 , H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , F28F1/32 , H01L23/4093 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a retention module (20) around an electronic component (15), a heat sink (30) attached to the retention module, and a fan (90). The heat sink includes a plurality of fins (62, 64, 66, 68) and spacers (52) interleaved between the fins, two heat pipes (80) sequentially extending through lower portions of the fins, the spacers and upper portions of the fins to bond the fins and the spacers together. Each spacer includes a flat bottom face for contacting the electronic component, and an arcuate top face. The fins includes two outer fins, and a plurality of inner fins each defining a cutout (62a, 64a) cooperatively defining a chamber between the outer fins. The chamber and the arcuate spacers facilitate cooling air from the fan to blow to opposite sides of the heat sink thereby improving heat dissipation efficiency of the heat sink.
摘要翻译：散热装置包括围绕电子部件（15）的保持模块（20），附接到保持模块的散热器（30）和风扇（90）。散热片包括多个散热片（62,64,66,68）和间隔件（52），两个散热片之间交错，两个热管（80）依次延伸穿过翅片的下部，间隔件和翅片的上部以将翅片和间隔件结合在一起。每个间隔件包括用于接触电子部件的平坦底面和弧形顶面。散热片包括两个外部散热片和多个内部散热片，每个内部散热片限定了一个切口（62a，64a），它们协同地限定了外部散热片之间的室。腔室和弓形间隔件促进了风扇的冷却空气吹到散热器的相对两侧，从而提高了散热器的散热效率。

4. 发明申请

US20050237719A1 Heat dissipating device 失效
标题翻译：散热装置
公开(公告)号：US20050237719A1
公开(公告)日：2005-10-27
申请号：US10833976
申请日：2004-04-27
申请人： Yaxiong Wang , Shun Dong , Chung-Yuan Huang , Aimin Huang
发明人： Yaxiong Wang , Shun Dong , Chung-Yuan Huang , Aimin Huang
IPC分类号： H01L23/34 , H01L23/40 , H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a heat sink (10) and a fan (30) generating airflow. The heat sink has a base (11) and a plurality of first fins (13) extending therefrom. First airflow channels (132) are defined between the first fins. A plurality of second fins (15) are transversely attached to the first fins. The second fins have second airflow channels (152) defined therebetween. The second airflow channels communicate with the first airflow channels.
摘要翻译：散热装置适于从电子包装中去除热量。散热装置包括散热器（10）和产生气流的风扇（30）。散热器具有从其延伸的基部（11）和多个第一散热片（13）。第一气流通道（132）被限定在第一散热片之间。多个第二散热片（15）横向地附接到第一散热片。第二散热片具有限定在其间的第二气流通道（152）。第二气流通道与第一气流通道相通。

5. 发明授权

US06863118B1 Micro grooved heat pipe 失效
标题翻译：微槽热管
公开(公告)号：US06863118B1
公开(公告)日：2005-03-08
申请号：US10778701
申请日：2004-02-12
申请人： Yaxiong Wang , Chung-Yuan Huang
发明人： Yaxiong Wang , Chung-Yuan Huang
IPC分类号： F28D15/02 , F28D15/04 , F28D15/00
CPC分类号： F28D15/0233 , F28D15/046 , F28F2260/02 , Y10T29/49353
摘要： A heat pipe (100) includes a first substrate (102) including a plurality of first low fins (14) and high fins (16), and a second substrate (104) opposing the first substrate and including a plurality of second low fins (14) and high fins (16). A plurality of micro grooves (18) is formed between adjacent fins to form liquid channels (106) of the heat pipe. The first and second high fins are received in corresponding micro grooves of the heat pipe and soldered to the second and first substrates, respectively.
摘要翻译：热管（100）包括包括多个第一低翅片（14）和高翅片（16）的第一基底（102）和与第一基底相对的第二基底（104），并包括多个第二低翅片 14）和高翅片（16）。在相邻翅片之间形成多个微槽（18），以形成热管的液体通道（106）。第一和第二高翅片分别被接纳在热管的相应的微槽中并分别焊接到第二和第一基底。

6. 发明申请

US20050178527A1 Heat dissipation device for electronic device 失效
标题翻译：电子设备散热装置
公开(公告)号：US20050178527A1
公开(公告)日：2005-08-18
申请号：US10778704
申请日：2004-02-12
申请人： Yaxiong Wang , Shun Dong , Chung-Yuan Huang
发明人： Yaxiong Wang , Shun Dong , Chung-Yuan Huang
IPC分类号： G06F1/16 , G06F1/20 , H01L23/34 , H01L23/467 , H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation device includes a column (1) for being positioned on an electronic device for dissipating heat therefrom, a plurality of fin units (5) attached to and stacked along the column, an H-shaped securing member (3) attached to the column below the fin units for securing the heat dissipation device to the electronic device, a pair of fan supports (7) extending from opposite sides of the securing member, and a fan (9) mounted on the fan supports. The fin units define a plurality of sprial air passages along an axis of the column which consist with air flow of the fan. Each of the fin units is configured by a metal disc with a plurality of sectors (54, 54′, 54″) and channels (56, 56′, 56″) between adjacent sectors.
摘要翻译：一种散热装置，包括用于定位在电子装置上用于散发热量的柱（1），沿着柱附接并堆叠的多个翅片单元（5），附接到该柱的H形固定构件（3）用于将散热装置固定到电子装置的一对风扇支架（7），以及安装在风扇支架上的风扇（9）。翅片单元沿着柱的轴线限定多个沿风扇的空气流组成的空气通道。每个鳍单元由具有多个扇区（54,54'，54“）的金属盘和相邻扇区之间的通道（56,56'，56”）构成。

7. 发明申请

US20050073811A1 Heat dissipating device for electronic component 失效
标题翻译：电子元件散热装置
公开(公告)号：US20050073811A1
公开(公告)日：2005-04-07
申请号：US10681390
申请日：2003-10-07
申请人： Yaxiong Wang , Chung-Yuan Huang , Shun Dong
发明人： Yaxiong Wang , Chung-Yuan Huang , Shun Dong
IPC分类号： F28D15/02 , F28F1/32 , G06F1/16 , G06F1/20 , H01L23/34 , H01L23/40 , H01L23/427 , H01L23/467 , H05K7/20
CPC分类号： H01L23/427 , F28D15/0275 , F28F1/32 , H01L23/4093 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipating device includes a retention module (20) around an electronic component (15), a heat sink (30) attached to the retention module, and a fan (90). The heat sink includes a plurality of fins (62, 64, 66, 68) and spacers (52) interleaved between the fins, two heat pipes (80) sequentially extending through lower portions of the fins, the spacers and upper portions of the fins to bond the fins and the spacers together. Each spacer includes a flat bottom face for contacting the electronic component, and an arcuate top face. The fins includes two outer fins, and a plurality of inner fins each defining a cutout (62a, 64a) cooperatively defining a chamber between the outer fins. The chamber and the arcuate spacers facilitate cooling air from the fan to blow to opposite sides of the heat sink thereby improving heat dissipation efficiency of the heat sink.
摘要翻译：散热装置包括围绕电子部件（15）的保持模块（20），附接到保持模块的散热器（30）和风扇（90）。散热片包括多个散热片（62,64,66,68）和间隔件（52），两个散热片之间交错，两个热管（80）依次延伸穿过翅片的下部，间隔件和翅片的上部以将翅片和间隔件结合在一起。每个间隔件包括用于接触电子部件的平坦底面和弧形顶面。散热片包括两个外部散热片和多个内部散热片，每个内部散热片限定出一个切口（62a，64a），它们协同地限定了外部散热片之间的室。腔室和弓形间隔件促进了风扇的冷却空气吹到散热器的相对两侧，从而提高了散热器的散热效率。

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