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1. 发明授权

US5936418A Semiconductor device socket 失效
标题翻译：半导体器件插座
公开(公告)号：US5936418A
公开(公告)日：1999-08-10
申请号：US845473
申请日：1997-04-25
申请人： Yasushi Ideta , Akihiro Washitani , Tsunenori Umetsu , Keiko Kaneko , Kunio Kobayashi
发明人： Yasushi Ideta , Akihiro Washitani , Tsunenori Umetsu , Keiko Kaneko , Kunio Kobayashi
IPC分类号： G01R31/26 , H01L23/32 , H01R33/76 , H01R33/965 , H05K7/10 , G01R31/02 , H01R11/22
CPC分类号： H05K7/1023
摘要： A semiconductor device socket prevents adhesion of foreign material to mounting surfaces of external leads of a semiconductor device. A positioning base of the socket supports external leads of the semiconductor device such that the lead ends of the leads do not contact a body of the socket. Movable contact terminals of the socket disposed opposite the external leads can move into and out of contact with the external leads.
摘要翻译：半导体器件插座防止异物粘附到半导体器件的外部引线的安装表面。插座的定位座支持半导体器件的外部引线，使得引线的引线端不接触插座的本体。与外部引线相对设置的插座的可移动接触端子可以移动进入外部引线和与外部引线接触。

2. 发明授权

US5693982A Semiconductor device socket 失效
标题翻译：半导体器件插座
公开(公告)号：US5693982A
公开(公告)日：1997-12-02
申请号：US545381
申请日：1995-10-19
申请人： Yasushi Ideta , Akihiro Washitani , Tsunenori Umetsu , Keiko Kaneko , Kunio Kobayashi
发明人： Yasushi Ideta , Akihiro Washitani , Tsunenori Umetsu , Keiko Kaneko , Kunio Kobayashi
IPC分类号： G01R31/26 , H01L23/32 , H01R33/76 , H01R33/965 , H05K7/10 , H01L23/02 , H01L23/12
CPC分类号： H05K7/1023
摘要： A semiconductor device socket preventing adhesion of foreign material to mounting surfaces of external leads of a semiconductor device. In the semiconductor device socket, a positioning base supports a shoulder of each of external leads extending from the semiconductor device without contacting the base and the contact portion of each of the movable contact terminals makes electrical contact with the shoulder of the corresponding external lead. The movable contact terminals are disposed opposite to the external leads outside of the positioning base and are opened and closed as a movable cover is moved relative to the base.
摘要翻译：一种半导体器件插座，其防止异物粘附到半导体器件的外部引线的安装表面。在半导体器件插座中，定位基座支撑从半导体器件延伸的每个外部引线的肩部，而不接触基座，并且每个可动接触端子的接触部分与对应的外部引线的肩部电接触。可动接触端子与定位基座外部的外部引线相对设置，并且当可动盖相对于基座移动时打开和关闭。

3. 发明授权

US5917240A Semiconductor device socket 失效
标题翻译：半导体器件插座
公开(公告)号：US5917240A
公开(公告)日：1999-06-29
申请号：US923254
申请日：1997-09-04
申请人： Yasushi Ideta , Akihiro Washitani , Tsunenori Umetsu , Keiko Kaneko , Kunio Kobayashi
发明人： Yasushi Ideta , Akihiro Washitani , Tsunenori Umetsu , Keiko Kaneko , Kunio Kobayashi
IPC分类号： G01R31/26 , H01L23/32 , H01R33/76 , H01R33/965 , H05K7/10 , H01L23/34
CPC分类号： H05K7/1023
摘要： A semiconductor device test socket for connecting an external circuit to external leads of a semiconductor device to permit testing of the semiconductor device includes a body having a positioning base for supporting roots of external leads of a semiconductor device to be tested. A plurality of movable contact terminals are supported by the body and disposed opposite to the external leads of the semiconductor device when the semiconductor device is supported by the positioning base. The contact terminals are movable between a first position electrically contacting the external leads and a second position spaced from the external leads. The contact terminals are configured so as to be moved to their second positions when a conveyance tool for supporting the semiconductor device to be tested is moved towards the test socket and pressed against the contact terminals, and so as to move to their first positions when the conveyance tool is moved away from the test socket out of contact with the contact terminals.
摘要翻译：用于将外部电路连接到半导体器件的外部引线以允许半导体器件的测试的半导体器件测试插座包括具有用于支撑要测试的半导体器件的外部引线的根的定位基座的主体。当半导体器件被定位基座支撑时，多个可动触点端子由主体支撑并且设置成与半导体器件的外部引线相对。接触端子可以在与外部引线电接触的第一位置和与外部引线间隔开的第二位置之间移动。接触端子被构造成当用于支撑被测半导体器件的输送工具朝向测试插座移动并按压接触端子时移动到其第二位置，并且当第二位置移动到其第一位置时传送工具远离测试插座脱离与接触端子的接触。

4. 发明授权

US5461258A Semiconductor device socket 失效
标题翻译：半导体器件插座
公开(公告)号：US5461258A
公开(公告)日：1995-10-24
申请号：US162951
申请日：1993-12-08
申请人： Yasushi Ideta , Akihiro Washitani , Tsunenori Umetsu , Keiko Kaneko , Kunio Kobayashi
发明人： Yasushi Ideta , Akihiro Washitani , Tsunenori Umetsu , Keiko Kaneko , Kunio Kobayashi
IPC分类号： G01R31/26 , H01L23/32 , H01R33/76 , H01R33/965 , H05K7/10 , H01L23/02 , H01L23/12
CPC分类号： H05K7/1023
摘要： A semiconductor device socket preventing adhesion of foreign material to mounting surfaces of external leads of a semiconductor device. In the semiconductor device socket, a positioning base supports a shoulder of each of external leads extending from the semiconductor device without contacting the base and the contact portion of each of the movable contact terminals makes electrical contact with the shoulder of the corresponding external lead. The movable contact terminals are disposed opposite to the external leads outside of the positioning base and are opened and closed as a movable cover is moved relative to the base.
摘要翻译：一种半导体器件插座，其防止异物粘附到半导体器件的外部引线的安装表面。在半导体器件插座中，定位基座支撑从半导体器件延伸的每个外部引线的肩部，而不接触基座，并且每个可动接触端子的接触部分与对应的外部引线的肩部电接触。可动接触端子与定位基座外部的外部引线相对设置，并且当可动盖相对于基座移动时，可动接触端子被打开和关闭。

5. 发明授权

US5444388A Apparatus for testing semiconductor devices using a conductive sheet 失效
标题翻译：用于使用导电片测试半导体器件的装置
公开(公告)号：US5444388A
公开(公告)日：1995-08-22
申请号：US223538
申请日：1994-04-05
申请人： Yasushi Ideta , Tsunenori Umezu , Akihiro Washitani
发明人： Yasushi Ideta , Tsunenori Umezu , Akihiro Washitani
IPC分类号： G01R31/26 , G01R1/04 , G01R31/28 , H01L21/66 , H01R33/76 , G01R31/00 , G01R31/02
CPC分类号： G01R1/04 , G01R31/2886 , Y10T29/49117
摘要： A semiconductor apparatus for functionally inspecting semiconductor devices is designed to prevent contact failure, deformation, and the like caused by solder transferred from external leads of semiconductor devices and deposited on contact terminals of the inspection apparatus. A sheet having metal-film patterns corresponding to an array of external leads of a semiconductor device is interposed between the external leads and the contact terminals to electrically connect the external leads to the contact terminals. The semiconductor device is inspected and the sheet is changed at a suitable time when it is contaminated with solder.
摘要翻译：用于功能检查半导体器件的半导体装置被设计成防止由从半导体器件的外部引线传送并沉积在检查装置的接触端子上的焊料引起的接触故障，变形等。具有与半导体器件的外部引线阵列对应的金属膜图案的片材插入在外部引线和接触端子之间，以将外部引线电连接到接触端子。对半导体器件进行检查，并且在被焊料污染的适当时间改变片材。

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