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1. 发明申请

US20110281119A1 Adhesive composition 有权
标题翻译：粘合剂组合物
公开(公告)号：US20110281119A1
公开(公告)日：2011-11-17
申请号：US13137141
申请日：2011-07-22
申请人： Yasushi Akutsu , Yasunobu Yamada , Kouichi Miyauchi
发明人： Yasushi Akutsu , Yasunobu Yamada , Kouichi Miyauchi
IPC分类号： B32B27/06
CPC分类号： H01B1/22 , C08F290/06 , C08F290/061 , C08F290/065 , C08G18/8116 , C09J133/14 , C09J175/06 , G02F1/13452 , G02F2202/28 , H01L2924/00013 , H01L2924/0002 , H05K3/323 , H05K3/361 , H05K2201/0129 , Y10S428/901 , Y10T428/2852 , Y10T428/2857 , Y10T428/2883 , Y10T428/2887 , Y10T428/2896 , Y10T428/31551 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A connection structure comprising an adhesive composition is provided. The adhesive composition is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): CH2═CR0—COO—R1—NHCOO—R2 (1) wherein R0 is a hydrogen atom or a methyl group, R1 is a divalent hydrocarbon group, and R2 is an optionally substituted lower alkyl group.
摘要翻译：提供包括粘合剂组合物的连接结构。粘合剂组合物即使当聚酰亚胺表面相对光滑时，也能够暴露在金属布线表面和迹线之间的柔性电路板的聚酰亚胺表面上提供良好的粘附强度。粘合剂组合物含有热塑性树脂，多官能丙烯酸酯和自由基聚合引发剂，并且还包含其末端具有氨基甲酸酯残基的单官能聚氨酯丙烯酸酯。单官能氨基甲酸酯丙烯酸酯由式（1）表示：CH2 = CR0-COO-R1-NHCOO-R2（1）其中R0为氢原子或甲基，R1为二价烃基，R2为任选的取代的低级烷基。

2. 发明申请

US20090280332A1 Adhesive composition 有权
标题翻译：粘合剂组合物
公开(公告)号：US20090280332A1
公开(公告)日：2009-11-12
申请号：US12312000
申请日：2008-06-09
申请人： Yasushi Akutsu , Yasunobu Yamada , Kouichi Miyauchi
发明人： Yasushi Akutsu , Yasunobu Yamada , Kouichi Miyauchi
IPC分类号： B32B7/12 , C08L33/08
CPC分类号： H01B1/22 , C08F290/06 , C08F290/061 , C08F290/065 , C08G18/8116 , C09J133/14 , C09J175/06 , G02F1/13452 , G02F2202/28 , H01L2924/00013 , H01L2924/0002 , H05K3/323 , H05K3/361 , H05K2201/0129 , Y10S428/901 , Y10T428/2852 , Y10T428/2857 , Y10T428/2883 , Y10T428/2887 , Y10T428/2896 , Y10T428/31551 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： An adhesive composition is provided which is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): CH2═CR0—COO—R1—NHCOO—R2 (1) wherein R0 is a hydrogen atom or a methyl group, R1 is a divalent hydrocarbon group, and R2 is an optionally substituted lower alkyl group.
摘要翻译：提供了一种粘合剂组合物，即使当聚酰亚胺表面相对光滑时，其能够对露出在金属布线表面上和迹线之间的柔性电路板的聚酰亚胺表面提供良好的粘附强度。粘合剂组合物含有热塑性树脂，多官能丙烯酸酯和自由基聚合引发剂，并且还包含其末端具有氨基甲酸酯残基的单官能聚氨酯丙烯酸酯。单官能氨基甲酸酯丙烯酸酯由式（1）表示：CH2-CR0-COO-R1-NHCOO-R2（1）其中R0是氢原子或甲基，R1是二价烃基，R2是任选的取代的低级烷基。

3. 发明授权

US08319222B2 Adhesive composition 有权
标题翻译：粘合剂组合物
公开(公告)号：US08319222B2
公开(公告)日：2012-11-27
申请号：US13137141
申请日：2011-07-22
申请人： Yasushi Akutsu , Yasunobu Yamada , Kouichi Miyauchi
发明人： Yasushi Akutsu , Yasunobu Yamada , Kouichi Miyauchi
IPC分类号： H01L29/00
CPC分类号： H01B1/22 , C08F290/06 , C08F290/061 , C08F290/065 , C08G18/8116 , C09J133/14 , C09J175/06 , G02F1/13452 , G02F2202/28 , H01L2924/00013 , H01L2924/0002 , H05K3/323 , H05K3/361 , H05K2201/0129 , Y10S428/901 , Y10T428/2852 , Y10T428/2857 , Y10T428/2883 , Y10T428/2887 , Y10T428/2896 , Y10T428/31551 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A connection structure comprising an adhesive composition is provided. The adhesive composition is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): CH2═CR0—COO—R1—NHCOO—R2 (1) wherein R0 is a hydrogen atom or a methyl group, R1 is a divalent hydrocarbon group, and R2 is an optionally substituted lower alkyl group.
摘要翻译：提供包括粘合剂组合物的连接结构。粘合剂组合物即使当聚酰亚胺表面相对光滑时，也能够暴露在金属布线表面和迹线之间的柔性电路板的聚酰亚胺表面上提供良好的粘附强度。粘合剂组合物含有热塑性树脂，多官能丙烯酸酯和自由基聚合引发剂，并且还包含其末端具有氨基甲酸酯残基的单官能聚氨酯丙烯酸酯。单官能氨基甲酸酯丙烯酸酯由式（1）表示：CH2 = CR0-COO-R1-NHCOO-R2（1）其中R0为氢原子或甲基，R1为二价烃基，R2为任选的取代的低级烷基。

4. 发明授权

US08221880B2 Adhesive composition 有权
标题翻译：粘合剂组合物
公开(公告)号：US08221880B2
公开(公告)日：2012-07-17
申请号：US12312000
申请日：2008-06-09
申请人： Yasushi Akutsu , Yasunobu Yamada , Kouichi Miyauchi
发明人： Yasushi Akutsu , Yasunobu Yamada , Kouichi Miyauchi
IPC分类号： C04B37/00 , B32B15/04
CPC分类号： H01B1/22 , C08F290/06 , C08F290/061 , C08F290/065 , C08G18/8116 , C09J133/14 , C09J175/06 , G02F1/13452 , G02F2202/28 , H01L2924/00013 , H01L2924/0002 , H05K3/323 , H05K3/361 , H05K2201/0129 , Y10S428/901 , Y10T428/2852 , Y10T428/2857 , Y10T428/2883 , Y10T428/2887 , Y10T428/2896 , Y10T428/31551 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： An adhesive composition is provided which is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): CH2═CR0—COO—R1—NHCOO—R2 (1) wherein R0 is a hydrogen atom or a methyl group, R1 is a divalent hydrocarbon group, and R2 is an optionally substituted lower alkyl group.
摘要翻译：提供了一种粘合剂组合物，即使当聚酰亚胺表面相对光滑时，其能够对露出在金属布线表面上和迹线之间的柔性电路板的聚酰亚胺表面提供良好的粘附强度。粘合剂组合物含有热塑性树脂，多官能丙烯酸酯和自由基聚合引发剂，并且还包含其末端具有氨基甲酸酯残基的单官能聚氨酯丙烯酸酯。单官能氨基甲酸酯丙烯酸酯由式（1）表示：CH2 = CR0-COO-R1-NHCOO-R2（1）其中R0为氢原子或甲基，R1为二价烃基，R2为任选的取代的低级烷基。

5. 发明授权

US08067514B2 Anisotropic conductive film 有权
标题翻译：各向异性导电膜
公开(公告)号：US08067514B2
公开(公告)日：2011-11-29
申请号：US12227164
申请日：2008-01-17
申请人： Kouichi Miyauchi , Yasushi Akutsu , Yasunobu Yamada
发明人： Kouichi Miyauchi , Yasushi Akutsu , Yasunobu Yamada
IPC分类号： C08F4/38 , C08G63/91 , B32B37/06 , B32B37/12 , C08K3/10
CPC分类号： C09J4/00 , C08J5/18 , C08J2367/00 , C08J2371/12 , C08J2375/04 , H01R4/04 , H05K3/323
摘要： An anisotropic conductive film is provided which can provide high bonding strength and good conduction reliability when anisotropic conductive bonding is made under the compression bonding conditions of a compression bonding temperature of at most 130° C. for a compression bonding time of at most 3 seconds. The anisotropic conductive film contains a polymerizable acrylic compound, a film-forming rein, conductive particles, and a polymerization initiator. The polymerization initiator contains two types of organic peroxides that do not produce oxygen gas resulting from the decomposition thereof and have different one-minute half-life temperatures. Of the two types of organic peroxides, one organic peroxide that has a higher one-minute half-life temperature produces benzoic acid or a derivative thereof when it decomposes.
摘要翻译：提供了各向异性导电膜，其在压缩粘合温度为至多130℃的压接条件下进行各向异性导电接合时，可以提供高的接合强度和良好的传导可靠性，在压接时间为3秒以下。各向异性导电膜含有可聚合的丙烯酸类化合物，成膜树脂，导电颗粒和聚合引发剂。聚合引发剂含有两种不产生由其分解产生的氧气并具有不同的一分钟半衰期温度的有机过氧化物。在两种类型的有机过氧化物中，一分钟半衰期较高的一种有机过氧化物在分解时产生苯甲酸或其衍生物。

6. 发明授权

US08715833B2 Anisotropic conductive film 有权
标题翻译：各向异性导电膜
公开(公告)号：US08715833B2
公开(公告)日：2014-05-06
申请号：US13002543
申请日：2009-04-09
申请人： Yasunobu Yamada , Yasushi Akutsu , Kouichi Miyauchi
发明人： Yasunobu Yamada , Yasushi Akutsu , Kouichi Miyauchi
IPC分类号： B32B7/02 , B32B27/20 , B32B27/26 , B32B27/30 , B32B37/06 , B32B37/16 , C09J133/00
CPC分类号： H05K3/323 , C09J7/10 , C09J9/02 , C09J2201/36 , C09J2201/602 , C09J2433/00 , H01B1/22 , H01L2224/29 , H05K2203/1189 , Y10T156/10 , Y10T428/2857 , Y10T428/287 , Y10T428/2891 , Y10T428/31511 , Y10T428/31909
摘要： A high adhesive strength and good conduction reliability can be realized when anisotropic connection is performed under compression conditions of a compression temperature of 130° C. and a compression time of 3 seconds using an anisotropic conductive film which uses a polymerizable acrylic compound capable of being cured at a comparatively lower temperature and in a comparatively shorter time than a thermosetting epoxy resin along with a film-forming resin. Consequently, an anisotropic conductive film has a structure in which an insulating adhesive layer and an anisotropic conductive adhesive layer are laminated. The insulating adhesive layer and the anisotropic conductive adhesive layer each contain a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator. The polymerization initiator contains two kinds of organic peroxide having different one minute half-life temperatures. Of the two kinds of organic peroxide, the organic peroxide having the higher one minute half-life temperature produces benzoic acid or a derivative thereof by decomposition.
摘要翻译：使用能够固化的可聚合丙烯酸类化合物的各向异性导电膜，在130℃的压缩温度和3秒的压缩条件的压缩条件下进行各向异性连接时，可以实现高粘合强度和良好的导电可靠性在比相对较低的温度和相对较短的时间比热固性环氧树脂以及成膜树脂。因此，各向异性导电膜具有层叠绝缘粘合剂层和各向异性导电粘合剂层的结构。绝缘粘合剂层和各向异性导电粘合剂层各自含有可聚合的丙烯酸类化合物，成膜树脂和聚合引发剂。聚合引发剂含有两种具有不同一分钟半衰期温度的有机过氧化物。在两种有机过氧化物中，具有较高一分钟半衰期的有机过氧化物通过分解产生苯甲酸或其衍生物。

7. 发明申请

US20090107625A1 Anisotropic Conductive Film 有权
标题翻译：各向异性导电膜
公开(公告)号：US20090107625A1
公开(公告)日：2009-04-30
申请号：US12227164
申请日：2008-01-17
申请人： Kouichi Miyauchi , Yasushi Akutsu , Yasunobu Yamada
发明人： Kouichi Miyauchi , Yasushi Akutsu , Yasunobu Yamada
IPC分类号： H01B5/16 , H01R12/00 , B29C65/00
CPC分类号： C09J4/00 , C08J5/18 , C08J2367/00 , C08J2371/12 , C08J2375/04 , H01R4/04 , H05K3/323
摘要： An anisotropic conductive film is provided which can provide high bonding strength and good conduction reliability when anisotropic conductive bonding is made under the compression bonding conditions of a compression bonding temperature of at most 130° C. for a compression bonding time of at most 3 seconds. The anisotropic conductive film contains a polymerizable acrylic compound, a film-forming rein, conductive particles, and a polymerization initiator. The polymerization initiator contains two types of organic peroxides that do not produce oxygen gas resulting from the decomposition thereof and have different one-minute half-life temperatures. Of the two types of organic peroxides, one organic peroxide that has a higher one-minute half-life temperature produces benzoic acid or a derivative thereof when it decomposes.
摘要翻译：提供了各向异性导电膜，其在压缩粘合温度为至多130℃的压接条件下进行各向异性导电接合时，可以提供高的接合强度和良好的传导可靠性，在压接时间为3秒以下。各向异性导电膜含有可聚合的丙烯酸类化合物，成膜树脂，导电颗粒和聚合引发剂。聚合引发剂含有两种不产生由其分解产生的氧气并具有不同的一分钟半衰期温度的有机过氧化物。在两种类型的有机过氧化物中，一分钟半衰期较高的一种有机过氧化物在分解时产生苯甲酸或其衍生物。

8. 发明授权

US08187706B2 Adhesive composition 有权
公开(公告)号：US08187706B2
公开(公告)日：2012-05-29
申请号：US12312000
申请日：2008-06-09
申请人： Yasushi Akutsu , Yasunobu Yamada , Kouichi Miyauchi
发明人： Yasushi Akutsu , Yasunobu Yamada , Kouichi Miyauchi
IPC分类号： C04B37/00 , B32B15/04
摘要： An adhesive composition is provided which is capable of providing good adhesion strength to the polyimide surface of a flexible circuit board that is exposed on the metal wiring surface and between the traces even when the polyimide surface is relatively smooth. The adhesive composition contains a thermoplastic resin, a polyfunctional acrylate, and a radical polymerization initiator and further contains a monofunctional urethane acrylate having a urethane residue at its terminal end. The monofunctional urethane acrylate is represented by the formula (1): CH2═CR0—COO—R1—NHCOO—R2 (1) wherein R0 is a hydrogen atom or a methyl group, R1 is a divalent hydrocarbon group, and R2 is an optionally substituted lower alkyl group.

9. 发明申请

US20110110066A1 ANISOTROPIC CONDUCTIVE FILM 有权
标题翻译：各向异性导电膜
公开(公告)号：US20110110066A1
公开(公告)日：2011-05-12
申请号：US13002543
申请日：2009-04-09
申请人： Yasunobu Yamada , Yasushi Akutsu , Kouichi Miyauchi
发明人： Yasunobu Yamada , Yasushi Akutsu , Kouichi Miyauchi
IPC分类号： H05K1/11 , B32B7/12 , B32B37/00
CPC分类号： H05K3/323 , C09J7/10 , C09J9/02 , C09J2201/36 , C09J2201/602 , C09J2433/00 , H01B1/22 , H01L2224/29 , H05K2203/1189 , Y10T156/10 , Y10T428/2857 , Y10T428/287 , Y10T428/2891 , Y10T428/31511 , Y10T428/31909
摘要： A high adhesive strength and good conduction reliability can be realized when anisotropic connection is performed under compression conditions of a compression temperature of 130° C. and a compression time of 3 seconds using an anisotropic conductive film which uses a polymerizable acrylic compound capable of being cured at a comparatively lower temperature and in a comparatively shorter time than a thermosetting epoxy resin along with a film-forming resin. Consequently, an anisotropic conductive film has a structure in which an insulating adhesive layer and an anisotropic conductive adhesive layer are laminated. The insulating adhesive layer and the anisotropic conductive adhesive layer each contain a polymerizable acrylic compound, a film-forming resin, and a polymerization initiator. The polymerization initiator contains two kinds of organic peroxide having different one minute half-life temperatures. Of the two kinds of organic peroxide, the organic peroxide having the higher one minute half-life temperature produces benzoic acid or a derivative thereof by decomposition.
摘要翻译：使用能够固化的可聚合丙烯酸类化合物的各向异性导电膜，在130℃的压缩温度和3秒的压缩条件的压缩条件下进行各向异性连接时，可以实现高粘合强度和良好的导电可靠性在比相对较低的温度和相对较短的时间比热固性环氧树脂以及成膜树脂。因此，各向异性导电膜具有层叠绝缘粘合剂层和各向异性导电粘合剂层的结构。绝缘粘合剂层和各向异性导电粘合剂层各自含有可聚合的丙烯酸类化合物，成膜树脂和聚合引发剂。聚合引发剂含有两种具有不同一分钟半衰期温度的有机过氧化物。在两种有机过氧化物中，具有较高一分钟半衰期的有机过氧化物通过分解产生苯甲酸或其衍生物。

10. 发明授权

US09023464B2 Connecting film, and joined structure and method for producing the same 有权
标题翻译：连接膜及其结合体及其制造方法
公开(公告)号：US09023464B2
公开(公告)日：2015-05-05
申请号：US12838625
申请日：2010-07-19
申请人： Yasushi Akutsu , Tomoyuki Ishimatsu , Koichi Miyauchi
发明人： Yasushi Akutsu , Tomoyuki Ishimatsu , Koichi Miyauchi
IPC分类号： H01R4/04 , C09J7/00 , H01L23/00 , H05K3/32 , C08K3/00 , C08K3/08 , C08K9/02 , H05K1/03
CPC分类号： C09J7/00 , C08K3/017 , C08K3/08 , C08K9/02 , C09J7/10 , C09J2201/134 , C09J2201/36 , C09J2205/102 , C09J2433/00 , C09J2463/00 , H01L24/32 , H01L24/83 , H01L2224/16225 , H01L2224/29082 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/73204 , H01L2224/83192 , H01L2224/838 , H01L2224/83851 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/14 , H01L2924/15788 , H01R4/04 , H05K1/0346 , H05K3/323 , H05K2201/0154 , H05K2201/10674 , H05K2203/1189 , Y10T29/49126 , Y10T29/49155 , Y10T428/25 , Y10T428/31511 , H01L2924/00 , H01L2924/3512 , H01L2224/0401
摘要： A connecting film which electrically connects a first circuit member with a second circuit member having a nitrogen atom-containing film on a surface thereof facing the first circuit member, the connecting film including a first layer which is to be located at the first circuit member side, and a second layer which is to be located at the second circuit member side, wherein the first layer contains a cationic curing agent and an epoxy resin, and the second layer contains a radical curing agent, an acrylic resin and an epoxy compound, wherein one of the first layer and the second layer is a conductive particle-containing organic resin layer, and the other layer is an insulating organic resin layer containing no conductive particles, and wherein the minimum melt viscosity of the conductive particle-containing organic resin layer is ten times or more greater than that of the insulating organic resin layer.
摘要翻译：一种连接膜，其将第一电路部件与具有含氮原子的膜的第二电路部件的面对第一电路部件的表面电连接，所述连接膜包括位于第一电路部件侧的第一层以及位于第二电路部件侧的第二层，其中第一层含有阳离子固化剂和环氧树脂，第二层含有自由基固化剂，丙烯酸树脂和环氧化合物，其中，第一层和第二层之一是含导电粒子的有机树脂层，另一层是不含导电性粒子的绝缘性有机树脂层，其中，导电性粒子的有机树脂层的最小熔融粘度为是绝缘性有机树脂层的10倍以上。

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