专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4327482A Electronic parts mounting apparatus 失效
标题翻译：电子零件安装装置
公开(公告)号：US4327482A
公开(公告)日：1982-05-04
申请号：US115279
申请日：1980-01-25
申请人： Shigeru Araki , Yasuo Taki , Kazuhiro Mori , Yoshihiko Misawa , Souhei Tanaka
发明人： Shigeru Araki , Yasuo Taki , Kazuhiro Mori , Yoshihiko Misawa , Souhei Tanaka
IPC分类号： H05K13/02 , B23P21/00 , H05K13/00 , H05K13/04 , H05K13/08 , H05K3/32
CPC分类号： H05K13/0417 , H05K13/0408 , Y10T29/49144 , Y10T29/53026 , Y10T29/53061 , Y10T29/53178 , Y10T29/53261 , Y10T83/091
摘要： An electronic parts mounting apparatus using a band carrier for feeding electronic parts incrementally, the carrier being a strip having many recesses disposed at equal intervals each holding an electronic part and a tape covering the recesses. The apparatus has a support for horizontally supporting the carrier with the coating tape on the top side, a separator for separating the tape from the carrier; and a pick up device for picking up the electronic parts one-by-one from the recesses in the carrier and carrying the electronic parts and placing them in position on a circuit board for continuously and stably mounting the electronic parts on the circuit board.
摘要翻译：一种电子部件安装装置，使用用于递增地馈送电子部件的带状载体，所述载体是具有以等间隔设置的许多凹部的条带，每个保持电子部分的条带和覆盖所述凹部的带。该装置具有用于在顶侧上涂覆带水平支撑载体的支撑件，用于将带与载体分离的分离器; 以及拾取装置，用于从载体中的凹部一个接一个地拾取电子部件，并携带电子部件并将它们放置在电路板上的适当位置，以将电子部件连续稳定地安装在电路板上。

2. 发明授权

US4437232A Electronic parts mounting apparatus 失效
标题翻译：电子零件安装装置
公开(公告)号：US4437232A
公开(公告)日：1984-03-20
申请号：US351312
申请日：1982-02-22
申请人： Shigeru Araki , Yasuo Taki , Kazuhiro Mori , Yoshihiko Misawa , Souhei Tanaka
发明人： Shigeru Araki , Yasuo Taki , Kazuhiro Mori , Yoshihiko Misawa , Souhei Tanaka
IPC分类号： H05K13/02 , B23P21/00 , H05K13/00 , H05K13/04 , H05K13/08 , H05K3/34
CPC分类号： H05K13/0417 , H05K13/0408 , Y10T29/49144 , Y10T29/53026 , Y10T29/53061 , Y10T29/53178 , Y10T29/53261 , Y10T83/091
摘要： An electronic parts mounting apparatus using a band carrier for feeding electronic parts incrementally, the carrier being a strip having many recesses disposed at equal intervals each holding an electronic part and a tape covering the recesses. The apparatus has a support for horizontally supporting the carrier with the coating tape on the top side; a separator for separating the tape from the carrier; and a pickup device for picking up the electronic parts one by one from the recesses in the carrier and by carrying the electronic parts and placing them in position on a circuit board for continuously and stably mounting the electronic parts on the circuit board.

3. 发明授权

US4290732A Apparatus for carrying and placing components 失效
标题翻译：用于携带和放置部件的装置
公开(公告)号：US4290732A
公开(公告)日：1981-09-22
申请号：US72850
申请日：1979-09-06
申请人： Yasuo Taki , Shigeru Araki , Kazuhiro Mori , Yoshihiko Misawa , Souhei Tanaka
发明人： Yasuo Taki , Shigeru Araki , Kazuhiro Mori , Yoshihiko Misawa , Souhei Tanaka
IPC分类号： B25J15/00 , B25J15/06 , B65H9/00 , H01L21/683 , B65G47/91 , H01L21/58
CPC分类号： H01L21/6838 , Y10T29/53178
摘要： An apparatus for carrying electronic components from a supply position to an electronic circuit board or the like and placing the electronic components on the electronic circuit board or the like, which has a rod provided at its tip end with a suction tool for picking up components to be carried and which is connected with an air suction apparatus; a body frame supporting the rod for movement of the rod in the vertical and horizontal directions; two pairs of position regulating pawls which are movably supported on the rod and are supported for freely opening and closing to grasp the components from different directions which the components are held by the suction tool and positioning them; and an arrangement for opening and closing the position regulating pawls.
摘要翻译：一种用于将电子部件从供给位置运送到电子电路板等的装置，并且将电子部件放置在电子电路板等上，该电子部件具有设置在其末端的杆，其具有用于拾取部件的吸入工具携带并与吸气装置连接; 支撑杆的主体框架，用于在垂直和水平方向上移动杆; 两对位置调节爪，其可移动地支撑在杆上并被支撑以自由地打开和关闭，以从部件被抽吸工具保持的不同方向上抓住部件并定位它们; 以及用于打开和关闭位置调节爪的装置。

4. 发明授权

US4239576A Process for mounting electronic parts 失效
标题翻译：电子零件安装工艺
公开(公告)号：US4239576A
公开(公告)日：1980-12-16
申请号：US58319
申请日：1979-07-17
申请人： Yasuo Taki , Yoshihiko Misawa , Shigeru Araki , Kazuhiro Mori , Souhei Tanaka
发明人： Yasuo Taki , Yoshihiko Misawa , Shigeru Araki , Kazuhiro Mori , Souhei Tanaka
IPC分类号： H05K13/04 , B32B31/26
CPC分类号： H05K13/0408 , H05K13/0469 , Y10T156/1089 , Y10T156/1092 , Y10T156/1093 , Y10T156/1097 , Y10T156/1098 , Y10T29/49144
摘要： A process for mounting electronic parts of very small size on electronic circuit boards or substrates, in which the substrates are maintained in predetermined relative positions, and a dispenser unit dispensing a bonding material for bonding the electronic parts to each of the substrates, a mounting unit mounting the electronic parts on each of the substrates, and/or an inspecting unit inspecting the position and/or the electrical properties of the electronic parts mounted on each of the substrates are disposed in the same relative positions as those of the substrates to carry out their individual functions on the associated substrates, so that the electronic parts can be efficiently and rationally mounted on the substrates.
摘要翻译：一种将非常小尺寸的电子部件安装在电子电路板或基板上的方法，其中基板保持在预定的相对位置，以及分配器单元，其分配用于将电子部件接合到每个基板的接合材料，安装单元将电子部件安装在每个基板上，和/或检查安装在每个基板上的电子部件的位置和/或电气特性的检查单元设置在与基板相同的相对位置，以执行它们在相关联的基板上的各自的功能，使得电子部件能够被有效且合理地安装在基板上。

5. 发明授权

US4631800A Electronic parts outfitting device 失效
标题翻译：电子零件装备
公开(公告)号：US4631800A
公开(公告)日：1986-12-30
申请号：US717274
申请日：1985-03-20
申请人： Taira Ishii , Yoshihiko Misawa , Yoshinobu Maeda , Souhei Tanaka
发明人： Taira Ishii , Yoshihiko Misawa , Yoshinobu Maeda , Souhei Tanaka
IPC分类号： H05K13/04 , B23Q41/00
CPC分类号： H05K13/0426 , Y10T29/5142 , Y10T29/5143 , Y10T29/5149
摘要： An electronic part mounting device having tape feeding units for holding and intermittently transferring electronic part assemblies each having a plurality of electronic parts fixed on tapes at specified intervals, a movable table being in a disc shape and rotatably installed for transferring the removably installed tape feeding unit to a specified first position, pressure clampers each removably mounted on the aforementioned movable table in proximity and in correspondence with the tape feeding unit, an inserting head as the working head for taking each electronic part off the electronic part assembly at the first position and then, holding and transferring the electronic part to a second position apart from the moving path of the movable table where this electronic part is mounted on a printed substrate, a chute located beneath the bottom of the movable table in correspondence with the aforementioned tape feeding unit for guiding to near the center of rotation of the movable table tape scraps and which have been cut off the taped electronic part assemblies and a tape cutter capable of cutting the tape scraps, located and between the chute and the center of rotation of the movable table, which does not intefer with the chute or the movable table. The device has the advantage of enabling random selection of electronic parts without sequentially arranging the electronic parts, has the effect of being unrestricted in the direction of mounting the electronic part on the printed substrate and in addition, permits integral holding and ready removal of the tape feeding unit and the electronic part assembly and moreover, cutting disposal of tape scraps and at a specified length.
摘要翻译： PCT No.PCT / JP83 / 00233 Sec。 371日期：1985年3月20日 102（e）1985年3月20日PCT提交1983年7月20日PCT公布。出版物WO85 / 0072400 日期：1985年2月14日。一种电子部件安装装置，具有用于保持并间歇地传送电子部件组件的带进给单元，每个电子部件组件具有以规定间隔固定在带上的多个电子部件，可移动的台子，将可拆卸地安装的带子馈送单元传送到指定的第一位置，每个可拆卸地安装在上述可移动台上的压紧夹紧件邻近并与带馈送单元相对应，插入头作为工作头，用于将每个电子部件从电子部件组装在第一位置，然后将电子部件保持并转移到远离可移动工作台的移动路径的第二位置，该电子部件安装在印刷基板上，相应地位于可动台底部下方的斜槽用上述带子馈送单元引导到靠近t的旋转中心他可移动的桌面胶带废料，并且已经切断了带状电子部件组件，以及能够切割位于滑槽和可移动工作台的旋转中心之间并且在滑槽的中心之间的胶带切割器的带切割机，其不与滑槽相连，或活动台。该装置具有能够随机选择电子部件而不依次布置电子部件的优点，具有在将电子部件安装在印刷基板上的方向上不受限制的效果，此外，允许整体保持并准备移除胶带进给单元和电子部件组件，此外，还可以在特定长度上对磁带屑进行切割处理。

6. 发明授权

US6101790A Packing band, packing method and packing apparatus, of little parts, and mounting method of electronic parts 失效
标题翻译：包装带，包装方法和包装设备，小零件和电子零件的安装方法
公开(公告)号：US6101790A
公开(公告)日：2000-08-15
申请号：US113887
申请日：1998-07-10
申请人： Kazuhiro Mori , Eiji Itemadani , Souhei Tanaka , Uzo Tomii , Yukihiko Asao , Yozo Uotsu
发明人： Kazuhiro Mori , Eiji Itemadani , Souhei Tanaka , Uzo Tomii , Yukihiko Asao , Yozo Uotsu
IPC分类号： B65B15/04 , B65D73/02
CPC分类号： B65B15/04 , B65D73/02
摘要： The band 10 which stores little parts 20 in many storing dents 14 arranged along a longitudinal direction and packs the little parts 20 by covering surfaces of the storing dents 14 with a cover tape 30, and is made of a flexible material having a compress-forming nature, and comprises storing dents 14 which are compress-formed from a surface to a fixed depth in a thickness direction.
摘要翻译：沿着纵向方向存放许多储存凹痕14中的小零件20的带10，并且用覆盖带30覆盖存储凹部14的表面，并且由具有压缩成形的柔性材料制成，并且包括将从表面压缩形成的凹陷14存储在厚度方向上的固定深度。

7. 发明授权

US06250051B1 Packing band, packing method and packing apparatus, of little parts, and mounting method of electronic parts 失效
标题翻译：包装带，包装方法和包装设备，小零件和电子零件的安装方法
公开(公告)号：US06250051B1
公开(公告)日：2001-06-26
申请号：US09566589
申请日：2000-05-08
申请人： Kazuhiro Mori , Eiji Itemadani , Souhei Tanaka , Uzo Tomii , Yukihiko Asao , Yozo Uotsu
发明人： Kazuhiro Mori , Eiji Itemadani , Souhei Tanaka , Uzo Tomii , Yukihiko Asao , Yozo Uotsu
IPC分类号： B65B1504
CPC分类号： B65B15/04 , B65D73/02
摘要： The band 10 which stores little parts 20 in many storing dents 14 arranged along a longitudinal direction and packs the little parts 20 by covering surfaces of the storing dents 14 with a cover tape 30, and is made of a flexible material having a compress-forming nature, and comprises storing dents 14 which are compress-formed from a surface to a fixed depth in a thickness direction.
摘要翻译：沿着纵向方向存放许多储存凹痕14中的小零件20的带10，并且用覆盖带30覆盖存储凹部14的表面，并且由具有压缩成形的柔性材料制成，并且包括将从表面压缩形成的凹陷14存储在厚度方向上的固定深度。

8. 发明授权

US6142306A Carrier band of electronic parts 失效
标题翻译：电子部件的载波带
公开(公告)号：US6142306A
公开(公告)日：2000-11-07
申请号：US202707
申请日：1998-12-18
申请人： Kazuhiro Mori , Eiji Itemadani , Souhei Tanaka , Osamu Hikita , Uzo Tomii , Kanji Sugio , Teruo Shoji , Yukihiko Asao
发明人： Kazuhiro Mori , Eiji Itemadani , Souhei Tanaka , Osamu Hikita , Uzo Tomii , Kanji Sugio , Teruo Shoji , Yukihiko Asao
IPC分类号： B65D85/90 , B65D73/02 , H05K13/00
CPC分类号： B65D73/02 , H05K13/003
摘要： A carrier band of electronic parts which can carry electronic parts such as IC packages in good protected condition without spoiling the convenience of a carrier tape having convexities and sticking tape. An electronic parts carrier band T which includes a flexible band (10) and keeps and carries longitudinally at intervals a large quantity of electronic parts (40) where each part (40) has a part body (42) and projecting portions (44) with the carrier band comprising: supporting stands (20), which are mounted longitudinally at intervals and project from the band (10); supporting faces (22), which are formed on the supporting stands (20) and support the electronic parts (40) by contacting the part body (42); opening portions (26), which are opened from the supporting faces (22) to a part of both side faces (24) of the supporting stands (20) at positions corresponding to the part bodies (42); and a sticking tape (30), which is longitudinally affixed to a back side of the band (10) including the supporting faces (22) by a one-sided sticking face (32) of the sticking tape (30), wherein a part of the sticking face (32) is exposed by the opening portions (26) and is stuck to a part body (42).
摘要翻译： PCT No.PCT / JP98 / 01212 Sec。 371 1998年12月18日第 102（e）1998年12月18日日期PCT 1998年3月20日PCT PCT。第WO98 / 52845号公报日期：1998年11月26日电子部件的载带，其可以承载具有良好保护条件的IC封装的电子部件，而不破坏具有凸起和粘着带的载带的便利性。一种电子部件载体带T，其包括柔性带（10），并且间隔地保持并纵向地承载大量电子部件（40），其中每个部分（40）具有部分主体（42）和突出部分（44）所述载体带包括：支撑架（20），其间隔地纵向安装并且从所述带（10）伸出; 支撑面（22），其形成在所述支撑架（20）上并且通过使所述部件主体（42）接触来支撑所述电子部件（40）。开口部分（26），其从所述支撑面（22）向所述支撑架（20）的两个侧面（24）的一部分在对应于所述零件体（42）的位置处被打开; 和粘贴带（30），其通过粘着带（30）的单面粘贴面（32）纵向固定在包括支撑面（22）的带（10）的后侧，其中，所述粘贴面（32）被所述开口部（26）露出，并粘贴在所述部件体（42）上。

9. 发明授权

US4592137A Method of circuit connection across both surfaces of substrate 失效
标题翻译：基板两面电路连接方法
公开(公告)号：US4592137A
公开(公告)日：1986-06-03
申请号：US638448
申请日：1984-07-26
申请人： Souhei Tanaka , Kazuhiro Mori , Eiji Itemadani
发明人： Souhei Tanaka , Kazuhiro Mori , Eiji Itemadani
IPC分类号： H05K1/02 , H05K1/11 , H05K3/34 , H05K3/40 , H05K13/04
CPC分类号： H01R12/526 , H05K3/3447 , H05K3/4046 , H05K2201/10363 , H05K2201/10984 , H05K2203/041 , H05K3/3468 , Y10T29/49149
摘要： According to this invention, an electrically conducting wire provided with a solder ball is inserted through throughholes provided around the perimeters thereof with electrically conductive members such as copper foils which form printed wiring on both surfaces of an insulating substrate. One of the conductive members and the conducting wire are soldered by dipping or flow-soldering, thereby making a circuit connection across both surfaces of the substrate by causing melting of the solder ball on the conducting wire on the substrate surface not soldered.
摘要翻译： PCT No.PCT / JP83 / 00417 Sec。 371日期1984年7月26日 102（e）日期1984年7月26日PCT提交1983年11月22日PCT公布。公开号WO84 / 02248 日本1984年6月7日。根据本发明，设置有焊球的导电线通过在其周围设置的通孔插入绝缘基板的两个表面上形成印刷布线的铜箔等导电构件。导电构件和导线中的一个通过浸渍或流焊来焊接，从而通过使未焊接的基板表面上的导线上的焊球熔化而在基板的两个表面上形成电路连接。

10. 发明授权

US07528984B2 Printing apparatus, data processing method for printing apparatus, and printing system 失效
标题翻译：打印装置，打印装置的数据处理方法和打印系统
公开(公告)号：US07528984B2
公开(公告)日：2009-05-05
申请号：US11679288
申请日：2007-02-27
申请人： Nobuhiro Ishizaka , Souhei Tanaka
发明人： Nobuhiro Ishizaka , Souhei Tanaka
IPC分类号： G06K15/00 , G06K15/10 , G06F3/12 , B41J2/195 , B41J29/38 , G06K15/22 , B41J11/20 , B41J5/30
CPC分类号： G06K15/102 , H04N1/504
摘要： In a printing apparatus including a reception buffer which stores setting data and printing data of printing element arrays transmitted from a connected host device, and a printing buffer which stores the printing data of the printing element arrays in association with printing positions in a scanning direction, the printing data are controlled to be stored in the printing buffer by adjusting the storage positions of the printing data of the printing element arrays on the basis of registration information which is contained in the setting data and corresponds to the relative distance between the printing element arrays in the scanning direction. Read address information for reading out the printing data stored in the printing buffer is controlled for each printing element array. Printing is performed by driving each printing element array in accordance with the printing data read out on the basis of the read address information. The printing apparatus executes a registration adjustment process associated with the relative distance between the printing element arrays that has conventionally been done in a host device, simplifying a printing data generation process by the host device.
摘要翻译：在包括存储从连接的主机设备发送的打印元件阵列的设置数据和打印数据的接收缓冲器的打印设备中，以及与扫描方向上的打印位置相关联地存储打印元件阵列的打印数据的打印缓冲器，通过根据包含在设定数据中的登记信息调整打印元件阵列的打印数据的存储位置，将打印数据控制为存储在打印缓冲器中，并对应于打印元件阵列之间的相对距离在扫描方向。对于每个打印元件阵列控制用于读出存储在打印缓冲器中的打印数据的读取地址信息。通过根据读取的地址信息读出的打印数据驱动每个打印元件阵列执行打印。打印设备执行与传统上在主机设备中完成的打印元件阵列之间的相对距离相关联的配准调整处理，简化了主机设备的打印数据生成处理。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式