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    • 1. 发明申请
    • Silica Sol and Process for Producing Same
    • 二氧化硅溶胶及其制造方法
    • US20070237701A1
    • 2007-10-11
    • US11632936
    • 2005-01-18
    • Yasuhiro YamakawaYoshiaki TomodaKeiji ToyamaMasatoshi Sakai
    • Yasuhiro YamakawaYoshiaki TomodaKeiji ToyamaMasatoshi Sakai
    • C01B33/141
    • C01B33/141
    • [PROBLEMS] To provide a silica sol and the method of producing the silica sol, wherein the silica sol is suitable for use as a material for, e.g., an abrasive material for electronic materials, silicon wafers or the like which are required to have a high purity, has excellent sol stability, can hence be easily made to have an increased silica concentration, and can be regulated so as to have a silica concentration equal to or higher than that of silica sols produced from water glass. [MEANS FOR SOLVING PROBLEMS] The silica sol comprises water and fine silica particles dispersed therein, and wherein the fine silica particles have a secondary-particle diameter of 10-1,000 nm, a metal impurity content of 1 ppm or lower, and a silica concentration of 10-50 wt. %. Also provided is a process for producing a stable silica sol comprising the following steps (a) and (b). (a) A first step in which a hydrolyzable silicon compound is hydrolyzed and condensation-polymerized to produce a silica sol. (b) A second step in which the silica sol obtained in the first step is concentrated to a silica concentration not higher than a certain value according to the particle diameter, and the dispersion medium and alkali catalyst in the silica sol are replaced with water to regulate the pH to 6.0-9.0.
    • [问题]为了提供二氧化硅溶胶和二氧化硅溶胶的制造方法,其中硅溶胶适合用作例如用于电子材料的研磨材料,硅晶片等的材料,其需要具有 高纯度,具有优异的溶胶稳定性,因此可以容易地具有增加的二氧化硅浓度,并且可以调节为具有等于或高于由水玻​​璃制备的二氧化硅溶胶的二氧化硅浓度的二氧化硅浓度。 [解决问题的手段]二氧化硅溶胶包含分散在其中的水和二氧化硅微粒,其中二氧化硅微粒的二次粒径为10-1000nm,金属杂质含量为1ppm以下,二氧化硅浓度 为10-50重量% %。 还提供了制备稳定的二氧化硅溶胶的方法,其包括以下步骤(a)和(b)。 (a)将水解性硅化合物水解并缩聚而制成二氧化硅溶胶的第一工序。 (b)将第一工序得到的二氧化硅溶胶根据粒径浓缩至不高于一定值的二氧化硅浓度的第二工序,将二氧化硅溶胶中的分散介质和碱催化剂换成水, 调节pH至6.0-9.0。