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    • 8. 发明授权
    • Reflow soldering apparatus and method
    • 回流焊接装置及方法
    • US06382497B1
    • 2002-05-07
    • US09671111
    • 2000-09-28
    • Nobuyasu NagafukuAkihiko WachiMasaya MatsumotoToshiyuki Koyama
    • Nobuyasu NagafukuAkihiko WachiMasaya MatsumotoToshiyuki Koyama
    • B23Q15013
    • B23Q15/013
    • The present invention provides an apparatus and a method for operating reflow soldering in a mounting field whereby an abnormality in transfer of circuit boards can be detected with high reliability. Whether or not a circuit board is transferred by a transfer conveyor is judged. A discharge conveyor is started when a control device judges occurrence of transfer abnormality. After the discharge conveyor starts, the transfer abnormality is determined to be a drop of the circuit board if a discharge completion detector detects that a dropped circuit board is discharged. And then the control device continues the reflow soldering. The transfer abnormality in the reflow soldering apparatus can be detected with high reliability because it can be detected whether the transfer abnormality is either the drop or a clog of the circuit board.
    • 本发明提供了一种用于在安装领域中操作回流焊接的装置和方法,由此可以高可靠性地检测电路板的传送异常。 判断电路板是否被转印输送机转印。 当控制装置判断传送异常的发生时,开始排出输送机。 在排出传送器启动之后,如果放电完成检测器检测到掉落的电路板被放电,则传送异常被确定为电路板的下降。 然后控制装置继续回流焊接。 由于可以检测转印异常是电路板的下降还是堵塞,可以高可靠性地检测回流焊装置中的转印异常。