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1. 发明授权

US08258409B2 Circuit board and circuit device 失效
标题翻译：电路板和电路设备
公开(公告)号：US08258409B2
公开(公告)日：2012-09-04
申请号：US12058040
申请日：2008-03-28
申请人： Yasuhiro Kohara , Kiyoshi Shibata , Masayuki Nagamatsu , Ryosuke Usui , Toshiya Shimizu
发明人： Yasuhiro Kohara , Kiyoshi Shibata , Masayuki Nagamatsu , Ryosuke Usui , Toshiya Shimizu
IPC分类号： H05K1/00
CPC分类号： H05K3/383 , H01L23/3128 , H01L23/498 , H01L23/49838 , H01L23/564 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/056 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/48599 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H05K3/243 , H05K3/3452 , H05K2201/09727 , H05K2201/09772 , H05K2201/0989 , H05K2203/0307 , H05K2203/0361 , H05K2203/049 , H05K2203/0542 , H05K2203/0723 , H05K2203/1152 , H05K2203/1476 , Y10T29/49155 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： Provided are a circuit board with enhanced moisture resist and the method of manufacturing the circuit board, and a circuit device and a method of manufacturing the circuit device. A circuit board of the present invention includes: a substrate; wirings formed on the main surface of the substrate; a cover layer covering the wirings excluding the regions to be connectors; back electrodes formed on the bottom surface of the substrate; and through-hole electrodes formed so as to penetrate the substrate, and thereby connecting the wirings and the back electrodes. On surfaces of each of the wirings in this circuit board, convex portions on the periphery of the substrate are set larger in width than convex portions in a center portion of the substrate. With this configuration, adhesion reliability between the wirings and the cover layer under a thermal cycle load can be enhanced.
摘要翻译：提供了一种具有增强的抗湿性的电路板和制造该电路板的方法，以及电路装置和该电路装置的制造方法。本发明的电路板包括：基板; 在基板的主表面上形成的布线; 覆盖除了作为连接器的区域的布线的覆盖层; 形成在基板的底面上的背面电极; 以及形成为穿透基板的通孔电极，从而连接布线和背面电极。在该电路基板的各配线的表面上，基板周边的凸部的宽度比基板的中央部的凸部的宽度大。利用这种结构，可以提高热循环负载下的布线与覆盖层之间的粘附可靠性。

2. 发明申请

US20080236879A1 CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, AND CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译：电路板及其制造方法和电路装置及其制造方法
公开(公告)号：US20080236879A1
公开(公告)日：2008-10-02
申请号：US12058040
申请日：2008-03-28
申请人： Yasuhiro Kohara , Kiyoshi Shibata , Masayuki Nagamatsu , Ryosuke Usui , Toshiya Shimizu
发明人： Yasuhiro Kohara , Kiyoshi Shibata , Masayuki Nagamatsu , Ryosuke Usui , Toshiya Shimizu
IPC分类号： H05K1/00 , H05K3/00
CPC分类号： H05K3/383 , H01L23/3128 , H01L23/498 , H01L23/49838 , H01L23/564 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/056 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/48599 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/351 , H05K3/243 , H05K3/3452 , H05K2201/09727 , H05K2201/09772 , H05K2201/0989 , H05K2203/0307 , H05K2203/0361 , H05K2203/049 , H05K2203/0542 , H05K2203/0723 , H05K2203/1152 , H05K2203/1476 , Y10T29/49155 , H01L2924/00012 , H01L2924/00 , H01L2224/05599
摘要： Provided are a circuit board with enhanced moisture resist and the method of manufacturing the circuit board, and a circuit device and a method of manufacturing the circuit device. A circuit board of the present invention includes: a substrate; wirings formed on the main surface of the substrate; a cover layer covering the wirings excluding the regions to be connectors; back electrodes formed on the bottom surface of the substrate; and through-hole electrodes formed so as to penetrate the substrate, and thereby connecting the wirings and the back electrodes. On surfaces of each of the wirings in this circuit board, convex portions on the periphery of the substrate are set larger in width than convex portions in a center portion of the substrate. With this configuration, adhesion reliability between the wirings and the cover layer under a thermal cycle load can be enhanced.
摘要翻译：提供了一种具有增强的抗湿性的电路板和制造该电路板的方法，以及电路装置和该电路装置的制造方法。本发明的电路板包括：基板; 在基板的主表面上形成的布线; 覆盖除了作为连接器的区域的布线的覆盖层; 形成在基板的底面上的背面电极; 以及形成为穿透基板的通孔电极，从而连接布线和背面电极。在该电路基板的各配线的表面上，基板周边的凸部的宽度比基板的中央部的凸部的宽度大。利用这种结构，可以提高热循环负载下的布线与覆盖层之间的粘附可靠性。

3. 发明授权

US09520585B2 Assembled battery and cell connection method 有权
标题翻译：组装电池和电池连接方法
公开(公告)号：US09520585B2
公开(公告)日：2016-12-13
申请号：US14003492
申请日：2012-02-27
申请人： Toshiya Shimizu , Kiyoshi Shibata , Yasuhiro Kohara , Yasuhiro Asai , Takashi Seto , Daiki Uchiyama
发明人： Toshiya Shimizu , Kiyoshi Shibata , Yasuhiro Kohara , Yasuhiro Asai , Takashi Seto , Daiki Uchiyama
IPC分类号： H01M2/20 , H01M2/10 , H01M2/30
CPC分类号： H01M2/204 , H01M2/1016 , H01M2/202 , H01M2/206 , H01M2/30 , Y10T29/49108
摘要： An assembled battery comprises: multiple cells 30 each having external terminals including a negative electrode terminal 50 and a positive electrode terminal; a bus bar 40 which connects the external terminal of one of two adjacent cells 30 and that of the other thereof; an electrically-conductive connecting member 70 which connects the external terminal and the bus bar 40 by welding to the external terminal and the bus bar 40; a welding portion 80 welded to the bus bar 40 and the connecting member 70; and a welding portion 82 welded to the external terminal and the connecting member 70. The connecting member 70 comprises an intervening portion 70b connected to the welding portion 80, and a main body portion 70a extending from the intervening portion 70b to the welding portion 82. The intervening portion 70b has a thickness that is smaller than that of the main body portion 70a.
摘要翻译：电池组包括：多个电池单元30，每个电池单元具有包括负极端子50和正极端子的外部端子; 连接两个相邻单元30中的一个的外部端子和另一个单元30的外部端子的汇流条40; 通过焊接将外部端子和汇流条40连接到外部端子和母线40的导电连接构件70; 焊接到汇流条40的焊接部分80和连接部件70; 以及焊接到外部端子和连接构件70的焊接部分82.连接构件70包括连接到焊接部分80的中间部分70b和从中间部分70b延伸到焊接部分82的主体部分70a。中间部70b的厚度小于主体部70a的厚度。

4. 发明申请

US20140057157A1 ASSEMBLED BATTERY AND CELL CONNECTION METHOD 有权
标题翻译：组装电池和电池连接方法
公开(公告)号：US20140057157A1
公开(公告)日：2014-02-27
申请号：US14003492
申请日：2012-02-27
申请人： Toshiya Shimizu , Kiyoshi Shibata , Yasuhiro Kohara , Yasuhiro Asai , Takashi Seto , Daiki Uchiyama
发明人： Toshiya Shimizu , Kiyoshi Shibata , Yasuhiro Kohara , Yasuhiro Asai , Takashi Seto , Daiki Uchiyama
IPC分类号： H01M2/20
CPC分类号： H01M2/204 , H01M2/1016 , H01M2/202 , H01M2/206 , H01M2/30 , Y10T29/49108
摘要： An assembled battery comprises: multiple cells 30 each having external terminals including a negative electrode terminal 50 and a positive electrode terminal; a bus bar 40 which connects the external terminal of one of two adjacent cells 30 and that of the other thereof; an electrically-conductive connecting member 70 which connects the external terminal and the bus bar 40 by welding to the external terminal and the bus bar 40; a welding portion 80 welded to the bus bar 40 and the connecting member 70; and a welding portion 82 welded to the external terminal and the connecting member 70. The connecting member 70 comprises an intervening portion 70b connected to the welding portion 80, and a main body portion 70a extending from the intervening portion 70b to the welding portion 82. The intervening portion 70b has a thickness that is smaller than that of the main body portion 70a.
摘要翻译：电池组包括：多个电池单元30，每个电池单元具有包括负极端子50和正极端子的外部端子; 连接两个相邻单元30中的一个的外部端子和另一个单元30的外部端子的汇流条40; 通过焊接将外部端子和汇流条40连接到外部端子和母线40的导电连接构件70; 焊接到汇流条40的焊接部分80和连接部件70; 以及焊接到外部端子和连接构件70的焊接部分82.连接构件70包括连接到焊接部分80的中间部分70b和从中间部分70b延伸到焊接部分82的主体部分70a。中间部70b的厚度小于主体部70a的厚度。

5. 发明授权

US08344522B2 Solder structure, method for forming the solder structure, and semiconductor module including the solder structure 失效
标题翻译：焊接结构，形成焊料结构的方法以及包括焊料结构的半导体模块
公开(公告)号：US08344522B2
公开(公告)日：2013-01-01
申请号：US12935864
申请日：2009-03-18
申请人： Hideki Mizuhara , Hajime Kobayashi , Toshiya Shimizu
发明人： Hideki Mizuhara , Hajime Kobayashi , Toshiya Shimizu
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： B23K1/0016 , B23K31/02 , B23K35/262 , B23K35/3013 , B23K2101/42 , B32B15/018 , C22C13/00 , C22C13/02 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0231 , H01L2224/02313 , H01L2224/02319 , H01L2224/0233 , H01L2224/0239 , H01L2224/0401 , H01L2224/1132 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H05K3/3463 , H05K2203/0435 , H01L2924/00
摘要： The invention provides a solder structure which is least likely to develop Sn whiskers and a method for forming such a solder structure. The solder structure includes an Sn alloy capable of a solid-liquid coexistent state and an Au (or Au alloy) coating covering at least part of the surface of the Sn alloy. The Au covering is a film that covers and coats at least part of the surface of the Sn alloy. As a preferable mode, the Au coating forms a netlike structure on the surface of the Sn alloy. The thickness of the Au coating is, for instance, 1 to 5 μm.
摘要翻译：本发明提供一种不太可能开发Sn晶须的焊料结构和形成这种焊料结构的方法。焊料结构包括能够具有固液共存状态的Sn合金和覆盖Sn合金表面的至少一部分的Au（或Au合金）涂层。 Au覆盖层是覆盖并涂覆Sn合金表面的至少一部分的膜。作为优选的方式，Au涂层在Sn合金的表面上形成网状结构。 Au涂层的厚度例如为1〜5μm。

6. 发明授权

US6062748A Stamp logotype printing apparatus 失效
标题翻译：邮票标识印刷设备
公开(公告)号：US6062748A
公开(公告)日：2000-05-16
申请号：US3241
申请日：1998-01-06
申请人： Toshiya Shimizu , Takashi Takamoto
发明人： Toshiya Shimizu , Takashi Takamoto
IPC分类号： G07G1/06 , B41J11/00 , B41J11/66 , B41J11/70 , G07G1/12 , B41J3/42
CPC分类号： B41J11/70 , B41J11/008 , B41J11/663 , B41J11/666
摘要： In case of printing a stamp logotype in a constitution in which a distance from a printing position to a cutting position is relatively short, it is designed to prevent useless space from being formed at the top region of a receipt and to appropriate relatively wide area for a stamp logotype printing region. A printer controller controls a head and a cutter so that, when a length of the stamp logotype is longer than a distance L from the printing position of the head to the cutting position of the cutter, the image of the stamp logotype is divided into a first logotype A equal to the distance L and a remaining second logotype B, so as to have the logotype A printed on the receipt before a preceding receipt is cut, and the logotype B printed on the receipt after the preceding receipt is cut.
摘要翻译：在从打印位置到切割位置的距离相对较短的构造中印刷邮票标识的情况下，被设计成防止在收据的顶部区域形成无用的空间并且适当地相对较宽的区域邮票标识印刷区域。打印机控制器控制头部和切割器，使得当标签标识的长度比从头部的打印位置到切割器的切割位置的距离L长时，标记徽标的图像被分成第一标识A等于距离L和剩余的第二标识B，以便在先前收到之前打印在收据上的标识A，并且在先前收到之后打印在收据上的标识B.

7. 发明申请

US20110127669A1 SOLDER STRUCTURE, METHOD FOR FORMING THE SOLDER STRUCTURE, AND SEMICONDUCTOR MODULE INCLUDING THE SOLDER STRUCTURE 失效
标题翻译：焊接结构，形成焊接结构的方法和包括焊接结构的半导体模块
公开(公告)号：US20110127669A1
公开(公告)日：2011-06-02
申请号：US12935864
申请日：2009-03-18
申请人： Hideki Mizuhara , Hajime Kobayashi , Toshiya Shimizu
发明人： Hideki Mizuhara , Hajime Kobayashi , Toshiya Shimizu
IPC分类号： H01L23/498 , H01L23/48 , H01B5/02 , B23K1/20
CPC分类号： B23K1/0016 , B23K31/02 , B23K35/262 , B23K35/3013 , B23K2101/42 , B32B15/018 , C22C13/00 , C22C13/02 , H01L23/544 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/0231 , H01L2224/02313 , H01L2224/02319 , H01L2224/0233 , H01L2224/0239 , H01L2224/0401 , H01L2224/1132 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H05K3/3463 , H05K2203/0435 , H01L2924/00
摘要： The invention provides a solder structure which is least likely to develop Sn whiskers and a method for forming such a solder structure. The solder structure includes an Sn alloy capable of a solid-liquid coexistent state and an Au (or Au alloy) coating covering at least part of the surface of the Sn alloy. The Au covering is a film that covers and coats at least part of the surface of the Sn alloy. As a preferable mode, the Au coating forms a netlike structure on the surface of the Sn alloy. The thickness of the Au coating is, for instance, 1 to 5 μm.
摘要翻译：本发明提供一种不太可能开发Sn晶须的焊料结构和形成这种焊料结构的方法。焊料结构包括能够具有固液共存状态的Sn合金和覆盖Sn合金表面的至少一部分的Au（或Au合金）涂层。 Au覆盖层是覆盖并涂覆Sn合金表面的至少一部分的膜。作为优选的方式，Au涂层在Sn合金的表面上形成网状结构。 Au涂层的厚度例如为1〜5μm。

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