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1. 发明授权

US09538637B2 Multichannel RF feedthroughs 有权
标题翻译：多通道RF馈通
公开(公告)号：US09538637B2
公开(公告)日：2017-01-03
申请号：US13533895
申请日：2012-06-26
申请人： Yan yang Zhao , Bernd Huebner , Tengda Du , Yuheng Lee
发明人： Yan yang Zhao , Bernd Huebner , Tengda Du , Yuheng Lee
IPC分类号： G01J1/42 , H05K1/02 , H05K1/11 , H05K1/14 , G02B6/42
CPC分类号： G02B6/4279 , G01J1/0425 , G02B6/4246 , G02B6/428 , G02B6/4292 , H05K1/0219 , H05K1/0224 , H05K1/0243 , H05K1/0274 , H05K1/0284 , H05K1/0298 , H05K1/115 , H05K1/117 , H05K1/147 , H05K2201/09227 , H05K2201/09409 , H05K2201/0949 , H05K2201/09618 , H05K2201/09672 , H05K2201/10121
摘要： Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.
摘要翻译：多通道RF馈通。在一些示例中，多通道RF馈通包括内部部分和外部部分。内部部分包括形成有第一和第二组迹线的顶表面。每组轨迹被配置为电气通信通道以承载电气数据信号。外部部分包括形成第一组迹线的底表面和形成有第二组迹线的顶表面。一组通孔将内部部分的顶表面和外部部分的底表面之间的第一组迹线连接起来。

2. 发明申请

US20130001410A1 MULTICHANNEL RF FEEDTHROUGHS 有权
标题翻译：多通道射频信号
公开(公告)号：US20130001410A1
公开(公告)日：2013-01-03
申请号：US13533895
申请日：2012-06-26
申请人： Yan yang Zhao , Bernd Huebner , Tengda Du , Yuheng Lee
发明人： Yan yang Zhao , Bernd Huebner , Tengda Du , Yuheng Lee
IPC分类号： G01J1/04 , H05K1/11
CPC分类号： G02B6/4279 , G01J1/0425 , G02B6/4246 , G02B6/428 , G02B6/4292 , H05K1/0219 , H05K1/0224 , H05K1/0243 , H05K1/0274 , H05K1/0284 , H05K1/0298 , H05K1/115 , H05K1/117 , H05K1/147 , H05K2201/09227 , H05K2201/09409 , H05K2201/0949 , H05K2201/09618 , H05K2201/09672 , H05K2201/10121
摘要： Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.
摘要翻译：多通道RF馈通。在一些示例中，多通道RF馈通包括内部部分和外部部分。内部部分包括形成有第一和第二组迹线的顶表面。每组轨迹被配置为电气通信通道以承载电气数据信号。外部部分包括形成第一组迹线的底表面和形成有第二组迹线的顶表面。一组通孔将内部部分的顶表面和外部部分的底表面之间的第一组迹线连接起来。

3. 发明授权

US07880570B2 Feed thru with flipped signal plane using guided vias 有权
标题翻译：通过引导通孔使用翻转的信号平面进行馈送
公开(公告)号：US07880570B2
公开(公告)日：2011-02-01
申请号：US12259202
申请日：2008-10-27
申请人： Jianying Zhou , Yuheng Lee , Yan Yang Zhao , Bernd Huebner
发明人： Jianying Zhou , Yuheng Lee , Yan Yang Zhao , Bernd Huebner
IPC分类号： H01P3/00
CPC分类号： H01P3/003 , H01P1/04 , H01P3/006 , H05K1/0201 , H05K1/0237
摘要： An embodiment of the invention includes a high speed feed thru connecting a first circuit outside a housing to a second circuit inside the housing. The first circuit includes a first high speed integrated circuit chip and the second circuit includes a second high speed integrated circuit chip or optoelectronic device. The high speed feed thru includes an inside coplanar structure positioned at least partially inside the housing, the inside coplanar structure connected to the second circuit. The high speed feed thru also includes an outside coplanar structure positioned at least partially outside the housing, the outside coplanar structure connected to the first circuit. A material separates the inside coplanar structure and the outside coplanar structure. At least one guided via extends through the material, connecting the inside coplanar structure and the outside coplanar structure.
摘要翻译：本发明的实施例包括通过将外壳外部的第一电路连接到壳体内的第二电路的高速馈电。第一电路包括第一高速集成电路芯片，第二电路包括第二高速集成电路芯片或光电子器件。高速馈送包括至少部分地位于壳体内部的内部共面结构，内部共面结构连接到第二电路。高速进料通过还包括至少部分地位于壳体外部的外共面结构，外共面结构连接到第一回路。一种材料将内部共面结构和外部共面结构分开。至少一个导向孔延伸穿过材料，连接内部共面结构和外部共面结构。

4. 发明申请

US20090267712A1 FEED THRU WITH FLIPPED SIGNAL PLANE USING GUIDED VIAS 有权
标题翻译：使用指南VIAS进行拖动信号平面的进给
公开(公告)号：US20090267712A1
公开(公告)日：2009-10-29
申请号：US12259202
申请日：2008-10-27
申请人： Jianying Zhou , Yuheng Lee , Yan Yang Zhao , Bernd Huebner
发明人： Jianying Zhou , Yuheng Lee , Yan Yang Zhao , Bernd Huebner
IPC分类号： H01P3/08
CPC分类号： H01P3/003 , H01P1/04 , H01P3/006 , H05K1/0201 , H05K1/0237
摘要： An embodiment of the invention includes a high speed feed thru connecting a first circuit outside a housing to a second circuit inside the housing. The first circuit includes a first high speed integrated circuit chip and the second circuit includes a second high speed integrated circuit chip or optoelectronic device. The high speed feed thru includes an inside coplanar structure positioned at least partially inside the housing, the inside coplanar structure connected to the second circuit. The high speed feed thru also includes an outside coplanar structure positioned at least partially outside the housing, the outside coplanar structure connected to the first circuit. A material separates the inside coplanar structure and the outside coplanar structure. At least one guided via extends through the material, connecting the inside coplanar structure and the outside coplanar structure.
摘要翻译：本发明的实施例包括通过将外壳外部的第一电路连接到壳体内的第二电路的高速馈电。第一电路包括第一高速集成电路芯片，第二电路包括第二高速集成电路芯片或光电子器件。高速馈送包括至少部分地位于壳体内部的内部共面结构，内部共面结构连接到第二电路。高速进料通过还包括至少部分地位于壳体外部的外共面结构，外共面结构连接到第一回路。一种材料将内部共面结构和外部共面结构分开。至少一个导向孔延伸穿过材料，连接内部共面结构和外部共面结构。

5. 发明申请

US20080191818A1 HIGH-SPEED INTERCONNECTS 有权
标题翻译：高速互联
公开(公告)号：US20080191818A1
公开(公告)日：2008-08-14
申请号：US12030142
申请日：2008-02-12
申请人： Yuheng Lee , Jianying Zhou , Yan Yang Zhao , Christopher R. Cole , Bernd Huebner
发明人： Yuheng Lee , Jianying Zhou , Yan Yang Zhao , Christopher R. Cole , Bernd Huebner
IPC分类号： H01P1/00
CPC分类号： H01P5/028
摘要： In one example embodiment, a high-speed transponder includes a printed circuit board having a set of coplanar high-speed traces, and a high-speed circuit and a package mounted to the printed circuit board. The package includes an outside housing and a second high-speed circuit positioned inside the housing. The high-speed transponder also includes a high-speed feed thru which includes an inside coplanar structure positioned inside the housing, a strip line structure positioned through the housing, and an outside coplanar structure positioned outside the housing. The second high-speed circuit is operably coupled to the inside coplanar structure, which is operably coupled to the strip line structure, which is operably coupled to the outside coplanar structure, which is operably coupled to the first high-speed circuit via the set of coplanar high-speed traces. The signal plane of the outside coplanar structure is flipped with respect to a signal plane of the inside coplanar structure.
摘要翻译：在一个示例性实施例中，高速应答器包括具有一组共面高速迹线的印刷电路板，以及安装到印刷电路板的高速电路和封装。该包装包括位于壳体内的外壳和第二高速电路。高速转发器还包括高速进给器，其包括位于壳体内部的内部共面结构，通过壳体定位的带状线结构以及位于壳体外部的外部共面结构。第二高速电路可操作地耦合到内部共面结构，其可操作地耦合到带状线结构，其可操作地耦合到外部共面结构，其可操作地耦合到第一高速电路，该组合共面高速轨迹。外部共面结构的信号平面相对于内部共面结构的信号平面翻转。

6. 发明授权

US07978030B2 High-speed interconnects 有权
标题翻译：高速互连
公开(公告)号：US07978030B2
公开(公告)日：2011-07-12
申请号：US12030142
申请日：2008-02-12
申请人： Yuheng Lee , Jianying Zhou , Yan Yang Zhao , Christopher R. Cole , Bernd Huebner
发明人： Yuheng Lee , Jianying Zhou , Yan Yang Zhao , Christopher R. Cole , Bernd Huebner
IPC分类号： H01P1/00
CPC分类号： H01P5/028
摘要： In one example embodiment, a high-speed transponder includes a printed circuit board having a set of coplanar high-speed traces, and a high-speed circuit and a package mounted to the printed circuit board. The package includes an outside housing and a second high-speed circuit positioned inside the housing. The high-speed transponder also includes a high-speed feed thru which includes an inside coplanar structure positioned inside the housing, a strip line structure positioned through the housing, and an outside coplanar structure positioned outside the housing. The second high-speed circuit is operably coupled to the inside coplanar structure, which is operably coupled to the strip line structure, which is operably coupled to the outside coplanar structure, which is operably coupled to the first high-speed circuit via the set of coplanar high-speed traces. The signal plane of the outside coplanar structure is flipped with respect to a signal plane of the inside coplanar structure.
摘要翻译：在一个示例性实施例中，高速应答器包括具有一组共面高速迹线的印刷电路板，以及安装到印刷电路板的高速电路和封装。该包装包括位于壳体内的外壳和第二高速电路。高速转发器还包括高速进给器，其包括位于壳体内部的内部共面结构，通过壳体定位的带状线结构以及位于壳体外部的外部共面结构。第二高速电路可操作地耦合到内部共面结构，其可操作地耦合到带状线结构，其可操作地耦合到外部共面结构，其可操作地耦合到第一高速电路，该组合共面高速轨迹。外部共面结构的信号平面相对于内部共面结构的信号平面翻转。

7. 发明授权

US07859367B2 Non-coplanar high-speed interconnects 有权
标题翻译：非共面高速互连
公开(公告)号：US07859367B2
公开(公告)日：2010-12-28
申请号：US12248456
申请日：2008-10-09
申请人： Yan Yang Zhao , Yuheng Lee , Jianying Zhou
发明人： Yan Yang Zhao , Yuheng Lee , Jianying Zhou
IPC分类号： H03H7/38 , H01P1/04
CPC分类号： H01P5/028 , H05K1/0219 , H05K1/0243 , H05K1/0245 , H05K1/0251 , H05K3/429 , H05K2201/09236 , H05K2201/09636 , H05K2201/10689
摘要： In one example embodiment, a high-speed package includes first and second layers and a multi-channel non-coplanar interconnect. The first layer includes first and second sets of coplanar transmission lines. The second layer includes third and fourth sets of coplanar transmission lines. The multi-channel non-coplanar interconnect includes first and second channels. The first channel connects the first set of transmission lines to the third set of transmission lines. The second channel connects the second set of transmission lines to the fourth set of transmission lines.
摘要翻译：在一个示例实施例中，高速封装包括第一和第二层以及多通道非共面互连。第一层包括第一和第二组共面传输线。第二层包括第三和第四组共面传输线。多通道非共面互连包括第一和第二通道。第一通道将第一组传输线连接到第三组传输线。第二通道将第二组传输线连接到第四组传输线。

8. 发明申请

US20090033442A1 NON-COPLANAR HIGH-SPEED INTERCONNECTS 有权
标题翻译：非共享高速互联
公开(公告)号：US20090033442A1
公开(公告)日：2009-02-05
申请号：US12248456
申请日：2008-10-09
申请人： Yan Yang Zhao , Yuheng Lee , Jianying Zhou
发明人： Yan Yang Zhao , Yuheng Lee , Jianying Zhou
IPC分类号： H01P1/00
CPC分类号： H01P5/028 , H05K1/0219 , H05K1/0243 , H05K1/0245 , H05K1/0251 , H05K3/429 , H05K2201/09236 , H05K2201/09636 , H05K2201/10689
摘要： In one example embodiment, a high-speed package includes first and second layers and a multi-channel non-coplanar interconnect. The first layer includes first and second sets of coplanar transmission lines. The second layer includes third and fourth sets of coplanar transmission lines. The multi-channel non-coplanar interconnect includes first and second channels. The first channel connects the first set of transmission lines to the third set of transmission lines. The second channel connects the second set of transmission lines to the fourth set of transmission lines.
摘要翻译：在一个示例实施例中，高速封装包括第一和第二层以及多通道非共面互连。第一层包括第一和第二组共面传输线。第二层包括第三和第四组共面传输线。多通道非共面互连包括第一和第二通道。第一通道将第一组传输线连接到第三组传输线。第二通道将第二组传输线连接到第四组传输线。

9. 发明申请

US20120032752A1 VERTICAL QUASI-CPWG TRANSMISSION LINES 有权
标题翻译：垂直准CPWG传输线
公开(公告)号：US20120032752A1
公开(公告)日：2012-02-09
申请号：US12849629
申请日：2010-08-03
申请人： Yunpeng Song , Yanyang Zhao , Yuheng Lee , Jianying Zhou
发明人： Yunpeng Song , Yanyang Zhao , Yuheng Lee , Jianying Zhou
IPC分类号： H01P5/02
CPC分类号： H01P3/006 , H01P5/022 , H01P5/028
摘要： In one example embodiment, a coplanar waveguide signal transition element transitions high-speed signals between vertically stacked coplanar waveguide transmission lines. The signal transition element comprises one or more dielectric layers and a plurality of electrically conductive vias extending through at least a portion of the one or more dielectric layers. The vias include one or more signal vias and one or more ground vias that are configured to transition signals between the vertically stacked coplanar waveguide transmission lines. The signal transition element also comprises a ground plane disposed within the one or more dielectric layers and electrically coupled to the one or more ground vias. The ground plane has one or more openings through which the one or more signal vias respectively pass.
摘要翻译：在一个示例性实施例中，共面波导信号过渡元件在垂直堆叠的共面波导传输线之间转换高速信号。信号转换元件包括一个或多个电介质层和延伸穿过该一个或多个电介质层的至少一部分的多个导电通孔。通孔包括一个或多个信号通路和一个或多个接地通孔，其配置成在垂直堆叠的共面波导传输线之间转换信号。信号过渡元件还包括设置在一个或多个电介质层内并且电耦合到一个或多个接地通孔的接地平面。接地平面具有一个或多个开口，一个或多个信号通孔通过该开口分别通过。

10. 发明申请

US20090160583A1 HYBRID SURFACE MOUNTABLE PACKAGES FOR VERY HIGH SPEED INTEGRATED CIRCUITS 有权
标题翻译：用于非常高速集成电路的混合表面安装套件
公开(公告)号：US20090160583A1
公开(公告)日：2009-06-25
申请号：US12340375
申请日：2008-12-19
申请人： Jianying Zhou , Yuheng Lee
发明人： Jianying Zhou , Yuheng Lee
IPC分类号： H01P1/00
CPC分类号： H01P3/003
摘要： In one example, a hybrid surface mountable package includes a housing at least partially defining a sealed cavity, two microwave integrated circuits (MIC) chips positioned inside the sealed cavity, and a very-high-speed interconnect connecting the two MIC chips to each other. The very-high-speed interconnect includes strong coupling co-planar waveguide (CPWG) transmission lines.
摘要翻译：在一个示例中，混合表面可安装封装包括至少部分地限定密封空腔的壳体，位于密封空腔内的两个微波集成电路（MIC）芯片和将两个MIC芯片彼此连接的非常高速的互连。超高速互连包括强耦合共面波导（CPWG）传输线。

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