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1. 发明申请

US20130063202A1 SECURE ANTI-FUSE WITH LOW VOLTAGE PROGRAMMING THROUGH LOCALIZED DIFFUSION HEATING 失效
标题翻译：通过局部扩散加热实现低电压编程的安全保险丝
公开(公告)号：US20130063202A1
公开(公告)日：2013-03-14
申请号：US13612938
申请日：2012-09-13
申请人： Yan Zun Li , Chandrasekharan Kothandaraman , Dan Moy , Norman W. Robson , John M. Safran
发明人： Yan Zun Li , Chandrasekharan Kothandaraman , Dan Moy , Norman W. Robson , John M. Safran
IPC分类号： H01L23/544 , H01H37/76
CPC分类号： H01L23/5252 , H01L2924/0002 , H01L2924/00
摘要： An antifuse has first and second semiconductor regions having one conductivity type and a third semiconductor region therebetween having an opposite conductivity type. A conductive region contacting the first region has a long dimension in a second direction transverse to the direction of a long dimension of a gate. An antifuse anode is spaced apart from the first region in the second direction and a contact is connected with the second region. Applying a programming voltage between the anode and the contact with gate bias sufficient to fully turn on field effect transistor operation of the antifuse heats the first region to drive a dopant outwardly, causing an edge of the first region to move closer to an edge of the second region and reduce electrical resistance between the first and second regions by an one or more orders of magnitude.
摘要翻译：反熔丝具有一个导电类型的第一和第二半导体区域和它们之间具有相反导电类型的第三半导体区域。接触第一区域的导电区域在横向于栅极的长尺寸方向的第二方向上具有长尺寸。反熔丝阳极在第二方向上与第一区域间隔开，并且触点与第二区域连接。在阳极和接触之间施加编程电压，栅极偏压足以完全导通反熔丝的场效应晶体管操作加热第一区域以向外驱动掺杂剂，导致第一区域的边缘更接近于并且将第一和第二区域之间的电阻降低一个或多个数量级。

2. 发明授权

US08350264B2 Secure anti-fuse with low voltage programming through localized diffusion heating 有权
标题翻译：通过局部扩散加热，通过低电压编程实现安全的反熔丝
公开(公告)号：US08350264B2
公开(公告)日：2013-01-08
申请号：US12835764
申请日：2010-07-14
申请人： Yan Zun Li , Chandrasekharan Kothandaraman , Dan Moy , Norman W. Robson , John M. Safran
发明人： Yan Zun Li , Chandrasekharan Kothandaraman , Dan Moy , Norman W. Robson , John M. Safran
IPC分类号： H01L29/04
CPC分类号： H01L23/5252 , H01L2924/0002 , H01L2924/00
摘要： An antifuse is provided having a unitary monocrystalline semiconductor body including first and second semiconductor regions each having the same first conductivity type, and a third semiconductor region between the first and second semiconductor regions which has a second conductivity type opposite from the first conductivity type. An anode and a cathode can be electrically connected with the first semiconductor region. A conductive region including a metal, a conductive compound of a metal or an alloy of a metal can contact the first semiconductor region and extend between the cathode and the anode. The antifuse can further include a contact electrically connected with the second semiconductor region. In this way, the antifuse can be configured such that the application of a programming voltage between the anode and the cathode heats the first semiconductor region sufficiently to reach a temperature which drives a dopant outwardly therefrom, causing an edge of the first semiconductor region to move closer to an adjacent edge of the second semiconductor region, thus permanently reducing electrical resistance between the first and second semiconductor regions by one or more orders of magnitude.
摘要翻译：提供一种具有单一单晶半导体本体的反熔丝，该单体半导体本体包括具有相同的第一导电类型的第一和第二半导体区域以及具有与第一导电类型相反的第二导电类型的第一和第二半导体区域之间的第三半导体区域。阳极和阴极可以与第一半导体区域电连接。包括金属，金属的导电化合物或金属的合金的导电区域可以接触第一半导体区域并在阴极和阳极之间延伸。反熔丝还可以包括与第二半导体区域电连接的触点。以这种方式，反熔丝可被配置为使得在阳极和阴极之间施加编程电压将第一半导体区域充分加热以达到从其向外驱动掺杂剂的温度，从而使第一半导体区域的边缘移动更靠近第二半导体区域的相邻边缘，从而将第一和第二半导体区域之间的电阻永久地减小一个或多个数量级。

3. 发明授权

US08569755B2 Secure anti-fuse with low voltage programming through localized diffusion heating 失效
标题翻译：通过局部扩散加热，通过低电压编程实现安全的反熔丝
公开(公告)号：US08569755B2
公开(公告)日：2013-10-29
申请号：US13612938
申请日：2012-09-13
申请人： Yan Zun Li , Chandrasekharan Kothandaraman , Dan Moy , Norman W. Robson , John M. Safran
发明人： Yan Zun Li , Chandrasekharan Kothandaraman , Dan Moy , Norman W. Robson , John M. Safran
IPC分类号： H01L29/04
CPC分类号： H01L23/5252 , H01L2924/0002 , H01L2924/00
摘要： An antifuse has first and second semiconductor regions having one conductivity type and a third semiconductor region therebetween having an opposite conductivity type. A conductive region contacting the first region has a long dimension in a second direction transverse to the direction of a long dimension of a gate. An antifuse anode is spaced apart from the first region in the second direction and a contact is connected with the second region. Applying a programming voltage between the anode and the contact with gate bias sufficient to fully turn on field effect transistor operation of the antifuse heats the first region to drive a dopant outwardly, causing an edge of the first region to move closer to an edge of the second region and reduce electrical resistance between the first and second regions by an one or more orders of magnitude.
摘要翻译：反熔丝具有一个导电类型的第一和第二半导体区域和它们之间具有相反导电类型的第三半导体区域。接触第一区域的导电区域在横向于栅极的长尺寸方向的第二方向上具有长尺寸。反熔丝阳极在第二方向上与第一区域间隔开，并且触点与第二区域连接。在阳极和接触之间施加编程电压，栅极偏压足以完全导通反熔丝的场效应晶体管操作加热第一区域以向外驱动掺杂剂，导致第一区域的边缘更接近于并且将第一和第二区域之间的电阻降低一个或多个数量级。

4. 发明申请

US20120012977A1 SECURE ANTI-FUSE WITH LOW VOLTAGE PROGRAMMING THROUGH LOCALIZED DIFFUSION HEATING 有权
标题翻译：通过局部扩散加热实现低电压编程的安全保险丝
公开(公告)号：US20120012977A1
公开(公告)日：2012-01-19
申请号：US12835764
申请日：2010-07-14
申请人： Yan Zun Li , Chandrasekharan Kothandaraman , Dan Moy , Norman W. Robson , John M. Safran
发明人： Yan Zun Li , Chandrasekharan Kothandaraman , Dan Moy , Norman W. Robson , John M. Safran
IPC分类号： H01L23/525 , H01L21/768
CPC分类号： H01L23/5252 , H01L2924/0002 , H01L2924/00
摘要： An antifuse is provided having a unitary monocrystalline semiconductor body including first and second semiconductor regions each having the same first conductivity type, and a third semiconductor region between the first and second semiconductor regions which has a second conductivity type opposite from the first conductivity type. An anode and a cathode can be electrically connected with the first semiconductor region. A conductive region including a metal, a conductive compound of a metal or an alloy of a metal can contact the first semiconductor region and extend between the cathode and the anode. The antifuse can further include a contact electrically connected with the second semiconductor region. In this way, the antifuse can be configured such that the application of a programming voltage between the anode and the cathode heats the first semiconductor region sufficiently to reach a temperature which drives a dopant outwardly therefrom, causing an edge of the first semiconductor region to move closer to an adjacent edge of the second semiconductor region, thus permanently reducing electrical resistance between the first and second semiconductor regions by one or more orders of magnitude.
摘要翻译：提供一种具有单一单晶半导体本体的反熔丝，该单体半导体本体包括具有相同的第一导电类型的第一和第二半导体区域以及具有与第一导电类型相反的第二导电类型的第一和第二半导体区域之间的第三半导体区域。阳极和阴极可以与第一半导体区域电连接。包括金属，金属的导电化合物或金属的合金的导电区域可以接触第一半导体区域并在阴极和阳极之间延伸。反熔丝还可以包括与第二半导体区域电连接的触点。以这种方式，反熔丝可被配置为使得在阳极和阴极之间施加编程电压将第一半导体区域充分加热以达到从其向外驱动掺杂剂的温度，从而使第一半导体区域的边缘移动更靠近第二半导体区域的相邻边缘，从而将第一和第二半导体区域之间的电阻永久地减小一个或多个数量级。

5. 发明申请

US20140021578A1 VERTICAL ELECTRONIC FUSE 有权
公开(公告)号：US20140021578A1
公开(公告)日：2014-01-23
申请号：US13552106
申请日：2012-07-18
申请人： Junjing Bao , Elbert Emin Huang , Yan Zun Li , Dan Moy
发明人： Junjing Bao , Elbert Emin Huang , Yan Zun Li , Dan Moy
IPC分类号： H01L23/525 , H01L21/768
CPC分类号： H01L23/5256 , H01L21/76832 , H01L21/76834 , H01L21/76849 , H01L23/5226 , H01L23/53223 , H01L23/53238 , H01L23/53266 , H01L23/53295 , H01L2924/0002 , H01L2924/00
摘要： An electronic fuse structure including a first Mx metal comprising a conductive cap, an Mx+1 metal located above the Mx metal, wherein the Mx+1 metal does not comprise a conductive cap, and a via, wherein the via electrically connects the Mx metal to the Mx+1 metal in a vertical orientation.

6. 发明授权

US08841208B2 Method of forming vertical electronic fuse interconnect structures including a conductive cap 有权
标题翻译：形成包括导电帽的垂直电子熔断器互连结构的方法
公开(公告)号：US08841208B2
公开(公告)日：2014-09-23
申请号：US13552106
申请日：2012-07-18
申请人： Junjing Bao , Elbert Emin Huang , Yan Zun Li , Dan Moy
发明人： Junjing Bao , Elbert Emin Huang , Yan Zun Li , Dan Moy
IPC分类号： H01L21/44 , H01L21/82 , H01L23/52
CPC分类号： H01L23/5256 , H01L21/76832 , H01L21/76834 , H01L21/76849 , H01L23/5226 , H01L23/53223 , H01L23/53238 , H01L23/53266 , H01L23/53295 , H01L2924/0002 , H01L2924/00
摘要： An electronic fuse structure including a first Mx metal comprising a conductive cap, an Mx+1 metal located above the Mx metal, wherein the Mx+1 metal does not comprise a conductive cap, and a via, wherein the via electrically connects the Mx metal to the Mx+1 metal in a vertical orientation.
摘要翻译：一种电子熔丝结构，包括包括导电盖的第一Mx金属，位于Mx金属上方的Mx + 1金属，其中Mx + 1金属不包括导电盖，以及通孔，其中通孔电连接Mx金属以垂直方向连接到Mx + 1金属。

7. 发明申请

US20130071998A1 Electrical Fuse With Metal Line Migration 审中-公开
标题翻译：具有金属线迁移的电气保险丝
公开(公告)号：US20130071998A1
公开(公告)日：2013-03-21
申请号：US13234205
申请日：2011-09-16
申请人： Baozhen Li , Yan Zun Li , Keith Kwong Hon Wong , Chih-Chao Yang
发明人： Baozhen Li , Yan Zun Li , Keith Kwong Hon Wong , Chih-Chao Yang
IPC分类号： H01L21/326 , H01L21/28 , H01L23/52
CPC分类号： H01L23/5256 , H01L21/326 , H01L2924/0002 , H01L2924/00
摘要： An electrical fuse device is disclosed. A circuit apparatus can include the fuse device, a first circuit element and a second circuit element. The fuse includes a first contact that has a first electromigration resistance, a second contact that has a second electromigration resistance and a metal line, which is coupled to the first contact and to the second contact, that has a third electromigration resistance that is lower than the second electromigration resistance. The first circuit element is coupled to the first contact and the second circuit element coupled to the second contact. The fuse is configured to conduct a programming current from the first contact to the second contact through the metal line. Further, the programming current causes the metal line to electromigrate away from the second contact to electrically isolate the second circuit element from the first circuit element.
摘要翻译：公开了一种电熔丝装置。电路装置可以包括熔丝装置，第一电路元件和第二电路元件。熔丝包括具有第一电迁移电阻的第一触点，具有第二电迁移电阻的第二触点和耦合到第一触点和第二触点的金属线，其具有低于第二次电迁移阻力。第一电路元件耦合到第一触点，而第二电路元件耦合到第二触点。保险丝被配置为通过金属线将编程电流从第一触点传导到第二触点。此外，编程电流使金属线电离远离第二触点，以将第二电路元件与第一电路元件电隔离。

8. 发明授权

US11152300B2 Electrical fuse with metal line migration 有权
公开(公告)号：US11152300B2
公开(公告)日：2021-10-19
申请号：US13234205
申请日：2011-09-16
申请人： Baozhen Li , Yan Zun Li , Keith Kwong Hon Wong , Chih-Chao Yang
发明人： Baozhen Li , Yan Zun Li , Keith Kwong Hon Wong , Chih-Chao Yang
IPC分类号： H01L23/525 , H01L21/326
摘要： An electrical fuse device is disclosed. A circuit apparatus can include the fuse device, a first circuit element and a second circuit element. The fuse includes a first contact that has a first electromigration resistance, a second contact that has a second electromigration resistance and a metal line, which is coupled to the first contact and to the second contact, that has a third electromigration resistance that is lower than the second electromigration resistance. The first circuit element is coupled to the first contact and the second circuit element coupled to the second contact. The fuse is configured to conduct a programming current from the first contact to the second contact through the metal line. Further, the programming current causes the metal line to electromigrate away from the second contact to electrically isolate the second circuit element from the first circuit element.

9. 发明申请

US20120275208A1 RELIABLE ELECTRICAL FUSE WITH LOCALIZED PROGRAMMING AND METHOD OF MAKING THE SAME 有权
标题翻译：具有本地化编程的可靠电气保险丝及其制造方法
公开(公告)号：US20120275208A1
公开(公告)日：2012-11-01
申请号：US13095164
申请日：2011-04-27
申请人： Yan Zun Li , Zhengwen Li , Chengwen Pei , Jian Yu
发明人： Yan Zun Li , Zhengwen Li , Chengwen Pei , Jian Yu
IPC分类号： G11C17/16 , H01L21/8238 , H01L23/62
CPC分类号： H01L23/62 , G11C17/16 , H01L21/02532 , H01L21/28518 , H01L21/76886 , H01L21/823814 , H01L21/84 , H01L23/5256 , H01L27/1203 , H01L2924/0002 , H01L2924/00
摘要： An electrical fuse has an anode contact on a surface of a semiconductor substrate. The electrical fuse has a cathode contact on the surface of the semiconductor substrate spaced from the anode contact. The electrical fuse has a link within the substrate electrically interconnecting the anode contact and the cathode contact. The link comprises a semiconductor layer and a silicide layer. The silicide layer extends beyond the anode contact. An opposite end of the silicide layer extends beyond the cathode contact. A silicon germanium region is embedded in the semiconductor layer under the silicide layer, between the anode contact and the cathode contact.
摘要翻译：电熔丝在半导体衬底的表面上具有阳极接触。电熔丝在半导体衬底的与阳极接触件间隔开的表面上具有阴极接触。电熔丝在衬底内具有连接阳极接触件和阴极接触件的连接。该连接件包括半导体层和硅化物层。硅化物层延伸超过阳极接触。硅化物层的另一端延伸超过阴极接触。在硅化物层之下的阳极接触和阴极接触之间的半导体层中嵌入硅锗区。

10. 发明授权

US08981523B2 Programmable fuse structure and methods of forming 有权
标题翻译：可编程熔丝结构和成型方法
公开(公告)号：US08981523B2
公开(公告)日：2015-03-17
申请号：US13419877
申请日：2012-03-14
申请人： Yan Zun Li , Zhengwen Li , Chengwen Pei , Jian Yu
发明人： Yan Zun Li , Zhengwen Li , Chengwen Pei , Jian Yu
IPC分类号： H01L23/52 , H01L23/525 , H01L23/532 , H01L27/115
CPC分类号： H01L23/5256 , H01L23/53204 , H01L27/115 , H01L2924/0002 , H01L2924/00
摘要： Methods of forming an electrically programmable fuse (e-fuse) structure and the e-fuse structure are disclosed. Various embodiments of forming the e-fuse structure include: forming a dummy poly gate structure to contact a surface of a silicon structure, the dummy poly gate structure extending only a part of a length of the silicon structure; and converting an unobstructed portion of the surface of the silicon structure to silicide to form a thinned strip of the silicide between two end regions.
摘要翻译：公开了形成电可编程熔丝（e熔丝）结构和电熔体结构的方法。形成e熔丝结构的各种实施例包括：形成虚拟多晶硅结构以接触硅结构的表面，所述虚设多晶硅结构仅延伸所述硅结构的长度的一部分; 以及将所述硅结构的表面的无障碍部分转化为硅化物以在两个端部区域之间形成所述硅化物的薄化带。

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