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1. 发明专利

JP2004349032A Ic socket 审中-公开
公开(公告)号：JP2004349032A
公开(公告)日：2004-12-09
申请号：JP2003142654
申请日：2003-05-20
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： NAKANO KAZUNORI , SASAKI MAKOTO
IPC分类号： G01R31/26 , H01R33/76
摘要： PROBLEM TO BE SOLVED: To provide an IC socket whereby an IC package can be stably manufactured by causing no sticking of the IC package and no damage on a solder ball, since accuracy can be enhanced by providing an engagement mechanism having a projecting part and a recessed part between a guide member to be mounted with the IC package and an IC loaded substrate or between the upper and lower substrates of the IC loaded substrate, by making the side wall of the recessed part with which the projecting part is engaged elastically deformable as a sheet-like wall member, and by narrowing gaps.
SOLUTION: This IC socket having an inserting type contact to form electrical connection by inserting the IC package in it is provided with the guide member to be mounted with the IC package, the IC loaded substrate to mount the guide member, and an elastically deformable engagement mechanism to slidably install the guide member on the IC loaded substrate.
COPYRIGHT: (C)2005,JPO&NCIPI

2. 发明专利

JP2003017209A Socket for ic package 有权
标题翻译： IC封装插座
公开(公告)号：JP2003017209A
公开(公告)日：2003-01-17
申请号：JP2001202641
申请日：2001-07-03
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： NAKANO KAZUNORI , MATSUOKA NORIYUKI
IPC分类号： G01R31/26 , G01R1/073 , H01R33/76
摘要： PROBLEM TO BE SOLVED: To provide a socket for IC package which can gain a substantial pressing power at time of burn-in and can operate with a small operating force at time of mounting of an IC package.
SOLUTION: With the socket for IC package provided with a pressure mechanism pressing and holding an IC package onto a socket main body with the contact state of its terminal and contact maintained, a normal coil spring 82 and a shape-memory coil spring 84 are set in combination as a pressing force changing means for differentiating a pressing force at normal temperature and that at burn-in.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：提供用于IC封装的插座，其可以在老化时获得显着的按压力，并且可以在安装IC封装时以小的操作力操作。解决方案：具有压接机构的集成电路封装的插座，将压接机构按压并保持IC封装在插座主体上，保持接线端子和触点的接触状态，设置正常的螺旋弹簧82和形状记忆螺旋弹簧84 组合作为用于区分常温下的按压力和老化时的按压力的按压力改变装置。

3. 发明专利

JP2003017205A Ic socket 有权
标题翻译： IC插座
公开(公告)号：JP2003017205A
公开(公告)日：2003-01-17
申请号：JP2001203790
申请日：2001-07-04
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： NAKANO KAZUNORI
IPC分类号： H01R33/76
CPC分类号： H01R12/89
摘要： PROBLEM TO BE SOLVED: To fit a guide member for mounting on an IC package in free swaying movement with respect to an IC loading board. SOLUTION: The IC socket having a wedge-in contact forming an electric connection by an insertion of an IC package, is provided with an oscillating mechanism for fitting a guide member for mounting the IC package in free swaying movement with respect to an IC loading board.
摘要翻译：要解决的问题：为了将相对于IC装载板的自由摇摆运动中安装在IC封装上的引导构件安装。解决方案：具有通过插入IC封装形成电连接的楔入触点的IC插座设置有摆动机构，用于安装用于安装IC封装的引导构件相对于IC装载板的自由摆动运动。

4. 发明专利

JP2004047477A Socket for semiconductor device 有权
公开(公告)号：JP2004047477A
公开(公告)日：2004-02-12
申请号：JP2003277909
申请日：2003-07-22
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： NAKANO KAZUNORI , UJIIE AKIRA , ICHIHARA KENJI
IPC分类号： G01R31/26 , H01R24/00 , H01R33/76 , H01R24/10
摘要： PROBLEM TO BE SOLVED: To sufficiently secure a clearance between contact terminals independently of the density of electrodes of a semiconductor element, and to surely separate a traveling contact of the contact terminal from the electrode of the semiconductor element. SOLUTION: The plurality of contact terminals 36ai each have the traveling contacts 36A1 and 36A2 arranged in face to face diagonally, and the traveling contact 36A2 of the contact terminal 36ai is arranged movably to the vicinity position adjacent to the traveling contact 36A1 of the adjacent contact terminal 36ai. When the electrode 26a of the semiconductor element 26 is released from the contact terminal 36ai, the electrode 26a is pressed by the back face of the traveling contact 36A2 in the separating direction of the electrode 26a from the traveling contact 36A1. COPYRIGHT: (C)2004,JPO

5. 发明专利

JP2003017210A Ic socket 审中-公开
标题翻译： IC插座
公开(公告)号：JP2003017210A
公开(公告)日：2003-01-17
申请号：JP2001203788
申请日：2001-07-04
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： NAKANO KAZUNORI , KOBORI EIJI
IPC分类号： G06K17/00 , H01R33/76
摘要： PROBLEM TO BE SOLVED: To aim at reduction of operating force by using a cover member as a switching means of a contact and adopting a rotatable member fitted to a movable plate as a driven member of a slanting cam member.
SOLUTION: With the IC socket provided with a fixed socket body, a cover member fitted to the socket body in free up and down movement, a movable plate moving laterally with the up and down movement of the cover member, and a contact to which an IC package is inserted to form an electric connection, the movable plate is provided with a freely rotating member as a driven member with which a slanting cam member fitted to the cover member so as to drive the movable plate is engaged.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了通过使用盖构件作为接触的切换装置并采用安装到作为倾斜凸轮构件的从动构件的可动板的可旋转构件来减小操作力。解决方案：具有固定插座体的IC插座，具有自由上下运动装配到插座主体上的盖构件，与盖构件的上下运动横向移动的可动板，以及接触件， IC封装被插入以形成电连接，可动板设置有作为从动构件的自由旋转构件，与该构件配合以驱动可动板的倾斜凸轮构件接合。

6. 发明专利

JP2002350493A SOCKET FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2002350493A
公开(公告)日：2002-12-04
申请号：JP2001154313
申请日：2001-05-23
申请人： YAMAICHI ELECTRONICS CO LTD
发明人： NAKANO KAZUNORI , UJIIE AKIRA , ICHIHARA KENJI
IPC分类号： G01R31/26 , G01R1/073 , H01L23/32 , H01R33/76 , H01R33/97 , H05K7/10
摘要： PROBLEM TO BE SOLVED: To sufficiently secure a clearance between respective contact elements without respect to density of an electrode part in a semiconductor and to surely separate a movable contact part of the contact terminal from the electrode part in the semiconductor. SOLUTION: Each of a plurality of contact terminals 36ai has movable contacts 36A1 and 36A2 arranged face to face diagonally, and the movable contact 36A2 in the contact terminal 36ai is arranged movably to the vicinity of the position in which the movable contact 36A2 abuts on the movable contact 36A1 in the adjacent contact terminal 36ai. In this arrangement when the electrode part 26a in the semiconductor element 26 is released from the contact terminal 36ai, the electrode part 26a is pressed by means of the back face part of the movable contact 36A2 in the separating direction apart from the movable contact 36A1.

7. 发明专利

JP2002343519A IC SOCKET 失效
公开(公告)号：JP2002343519A
公开(公告)日：2002-11-29
申请号：JP2001151234
申请日：2001-05-21
申请人： YAMAICHI ELECTRONICS CO LTD
发明人： NAKANO KAZUNORI , UJIIE AKIRA
IPC分类号： H01R33/76
摘要： PROBLEM TO BE SOLVED: To open and close a contact only using a lever, disusing a cover pressing a shaft or a lever as a means of opening and closing the contact. SOLUTION: For the IC socket having a clipping contact forming an electric connection by inserting an IC package, a lever, having a cam structure to which, an almost S-shaped part and a pressing part are integrally molded, is used as a means of opening and closing the contact in order to open and close the contact only by the lever, and a receiving part, corresponding to the S-shaped part, is formed into a shape which corrects the displacement of a fulcrum and a point of application.

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