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1. 发明专利

DE10331037B4 未知
公开(公告)号：DE10331037B4
公开(公告)日：2010-04-29
申请号：DE10331037
申请日：2003-07-09
申请人： YAMAICHI ELECTRONICS CO LTD
发明人： SUZUKI TAKEYUKI , MATSUOKA NORIYUKI , WAKABAYASHI YOSHINORI , KURODA TOSHITAKA
IPC分类号： H01L21/66 , H01R12/00 , H01R13/24 , H01R33/76 , H05K7/10
摘要： The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.

2. 发明专利

DE10362167B4 未知
公开(公告)号：DE10362167B4
公开(公告)日：2009-12-31
申请号：DE10362167
申请日：2003-07-09
申请人： YAMAICHI ELECTRONICS CO LTD
发明人： SUZUKI TAKEYUKI , MATSUOKA NORIYUKI , WAKABAYASHI YOSHINORI , KURODA TOSHITAKA
IPC分类号： H01L21/66 , H01R12/04 , H01R33/76 , H05K7/10
摘要： The cap body of the pressing cap has lamellar pieces for pressing portions of the substrate in the contact sheet, in which ends of the respective sides of the bare chip are positioned.

3. 发明专利

JP2006156598A Recovery processing method of electrode 审中-公开
标题翻译：电极恢复处理方法
公开(公告)号：JP2006156598A
公开(公告)日：2006-06-15
申请号：JP2004342991
申请日：2004-11-26
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： SUZUKI TAKESHI , WAKABAYASHI YOSHINORI
IPC分类号： H05K3/34
摘要： PROBLEM TO BE SOLVED: To recover an electrode by such a method that produces no undesired cutting scrap on a joint surface of an electrode and is simplified.
SOLUTION: The tip end of a bump 44B is pressurized at a pressing force of 5 g or more per bump by a transfer plate 10 which is provided with a transfer surface 10s having an irregular part 10a which is formed so that its arithmetic average roughness Ra may range between 0.5 or more and around 1.5 (μm).
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过在电极的接合表面上不产生不需要的切屑的方法来回收电极，并被简化。解决方案：凸块44B的末端通过转印板10以每个凸块5g或更多的压力加压，转印板10设置有具有不规则部分10a的转印表面10s，转印表面10s形成为使得其算术平均粗糙度Ra可以在0.5以上至1.5（μm）左右。版权所有（C）2006，JPO＆NCIPI

4. 发明专利

JP2013072847A Testing holder 审中-公开
标题翻译：测试座
公开(公告)号：JP2013072847A
公开(公告)日：2013-04-22
申请号：JP2011214309
申请日：2011-09-29
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： WAKABAYASHI YOSHINORI , UJIIE AKIRA
IPC分类号： G01R1/073 , G01R1/06 , G01R1/067
摘要： PROBLEM TO BE SOLVED: To provide a low-cost testing holder capable of efficiently testing an object to be tested in accordance with the fine pitch and fine region of electrodes while suppressing the influence of the object to be tested on the electrodes.SOLUTION: The testing holder includes a testing probe 31 in which a plurality of contact shoes 33 having conductivity to be brought into contact with electrodes 22 of an object to be tested 21 are formed on a base plate 32 by a small electromechanical system technique, and a probe block 12 for supporting the testing probe 31, the testing probe 31 is arranged perpendicularly to the object to be tested 21, tip sides of the contact shoes 33 of the testing probe 31 are bent with respect to the surface of the base plate 32 at a predetermined angle, the probe block 12 and the object to be tested 21 are brought into close contact with each other, to thereby be brought into close contact with the object to be tested 21 from a perpendicular direction, and contact points 35 composed of tips of the contact shoes 33 are brought into contact with the electrodes 22 of the object to be tested 21.
摘要翻译：要解决的问题：提供一种能够在抑制待测对象对电极的影响的同时，根据电极的细微间距和细小区域有效地测试待测试物体的低成本测试保持器。解决方案：测试架包括测试探针31，其中通过小型机电系统在基板32上形成具有与待测试物体21的电极22接触的导电性的多个接触靴33 技术和用于支撑测试探针31的探针块12，测试探针31垂直于待测试物体21设置，测试探针31的接触鞋33的顶端相对于底板32以预定的角度，探针块12和待测试物体21彼此紧密接触，从而从垂直方向与待测试物体21紧密接触，并且接触点 35由接触鞋33的尖端组成的部分35与待测试物体21的电极22接触。版权所有：（C）2013，JPO＆INPIT

5. 发明专利

JP2004056078A Recovery method for electrode 有权
公开(公告)号：JP2004056078A
公开(公告)日：2004-02-19
申请号：JP2003003508
申请日：2003-01-09
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： SUZUKI TAKESHI , WAKABAYASHI YOSHINORI
IPC分类号： G01R1/073 , H01L21/48 , H01L21/60 , H05K3/22 , H05K3/40
CPC分类号： H01L21/4846 , H01L2924/0002 , H05K3/225 , H05K3/4007 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To facilitate and ensure the formation of predetermined roughness on the connecting surface of an electrode of a worn electrode plate. SOLUTION: A transfer surface 10a of a transfer plate 10 having a predetermined transfer surface 10s with prescribed roughness is brought into contact, at predetermined pressure, with a plurality of bumps 44B on a contact sheet 44 which is formed on a substrate 44M having a linear expansion coefficient larger than that of the transfer plate 10. Simultaneously, the substrate 44M and the transfer plate 10 are heated to a predetermined temperature to recover the roughness of the connecting surface of the bump 44B at a predetermined level. COPYRIGHT: (C)2004,JPO

6. 发明专利

JP2013061247A Inspection probe and manufacturing method of the same 审中-公开
标题翻译：检验探针及其制造方法
公开(公告)号：JP2013061247A
公开(公告)日：2013-04-04
申请号：JP2011199915
申请日：2011-09-13
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： WAKABAYASHI YOSHINORI , SATO RIEKO , TANIOKA MICHINAGA
IPC分类号： G01R1/073 , G01R31/26 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To provide a low cost inspection probe capable of efficiently inspecting an inspection object while suppressing influence on the electrodes of the inspection object, and a manufacturing method of the same.SOLUTION: The inspection probe 11 includes an insulating substrate 12, a plurality of elastic and conductive contact pieces 13 which are arranged in parallel and extended outwardly from the edge of the substrate 12, a wiring pattern 14 formed on the substrate 12 and electrically continues to the contact pieces 13. In inspecting the inspection object, contact points 15 formed of tip ends of the contact pieces 13 are brought into contact with the electrodes of the inspection object. The contact points 13 and the wiring pattern 14 are formed on the substrate 12 with a MEMS technology, and electrode contacting projections 16 which project in convex curved shapes are formed at contact positions 15 with the electrodes on the contact pieces 13.
摘要翻译：要解决的问题：提供一种能够有效地检查检查对象的低成本检查探针，同时抑制对检查对象的电极的影响及其制造方法。解决方案：检查探针11包括绝缘基板12，平行布置并从基板12的边缘向外延伸的多个弹性导电接触片13，形成在基板12上的布线图案14和电连续接触片13.在检查检查对象时，由接触件13的顶端形成的接触点15与检查对象的电极接触。接触点13和布线图案14利用MEMS技术形成在基板12上，并且在与接触片13上的电极的接触位置15处形成凸起的弯曲形状的电极接触突起16。（C）2013，JPO＆INPIT

7. 发明专利

JP2003059608A Socket for semiconductor device equipped with cover member pressing structure 审中-公开
标题翻译：配有封盖构件压力结构的半导体器件插座
公开(公告)号：JP2003059608A
公开(公告)日：2003-02-28
申请号：JP2001251596
申请日：2001-08-22
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： WAKABAYASHI YOSHINORI
IPC分类号： H01R33/76
摘要： PROBLEM TO BE SOLVED: To provide a socket to which, a semiconductor device can be easily attached/detached by manual operation with relatively small force.
SOLUTION: Pressing members 22A, 22B have a latch member 26 holding a pressing surface pressing a cover member 14 and keeping the pressing state, and supported at a pedestal part 20 in a state of double-leafed hinged door.
COPYRIGHT: (C)2003,JPO
摘要翻译：要解决的问题：为了提供一种插座，可以通过手动操作以相对小的力容易地安装/拆卸半导体器件。解决方案：按压构件22A，22B具有保持压盖的保持构件14并保持按压状态的按压面的闩锁构件26，并且在双叶铰链门的状态下支撑在基座部20。

8. 发明专利

JP2010122101A Method for manufacturing multilayer-structure probe and probe 审中-公开
标题翻译：制造多层结构探针和探针的方法
公开(公告)号：JP2010122101A
公开(公告)日：2010-06-03
申请号：JP2008296671
申请日：2008-11-20
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： ARIIZUMI SHOJI , TANIOKA MICHINAGA , WAKABAYASHI YOSHINORI
IPC分类号： G01R1/073 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To secure the coplanarity of contacts in each layer of a multilayer-structure probe in the manufacture of multilayer-structure probes.
SOLUTION: A first probe 10A having a plurality of first leads 12 on a first flat substrate 11 and first contacts 12a at their tip parts is to be pasted to a second probe 10B having a plurality of second leads 22 on a second flat substrate 21 and second contacts 22a at their tip parts. In this case, the first probe 10A and the second probe 10B are superposed on each other via an adhesive in such a way that the first contacts 12a and the second contacts 22a may be in the same direction. The amount of displacement of the first contacts 12a and the second contacts 22a in the direction is corrected through the use of a first mark 13 for position correction on the first flat substrate 11 and a second mark 23 for position correction on the second flat substrate 21. After this correction, the first flat substrate 11 and the second flat substrate 21 are positioned and joined to each other by the adhesive.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了确保多层结构探针的制造中的多层结构探针的各层中的接触的共面性。解决方案：在第一平面基板11上具有多个第一引线12的第一探针10A和其尖端部分处的第一触头12a将被粘贴到具有多个第二引线22的第二探针10B上，第二探针10B在第二平面基板21和第二触点22a在其尖端部分。在这种情况下，第一探针10A和第二探针10B经由粘合剂彼此重叠，使得第一触头12a和第二触点22a可以在相同的方向上。通过在第一平面基板11上使用用于位置校正的第一标记13和在第二平坦基板21上进行位置校正的第二标记23来校正第一触头12a和第二触点22a在该方向上的位移量在该修正之后，第一平坦基板11和第二平坦基板21通过粘合剂彼此定位和接合。版权所有（C）2010，JPO＆INPIT

9. 发明专利

JP2006300926A Carrier unit for semiconductor device, and socket for semiconductor device 审中-公开
标题翻译：半导体器件的载体单元和半导体器件的插座
公开(公告)号：JP2006300926A
公开(公告)日：2006-11-02
申请号：JP2006061785
申请日：2006-03-07
申请人： Yamaichi Electronics Co Ltd , 山一電機株式会社
发明人： WAKABAYASHI YOSHINORI , HISAISHI MINORU , SUZUKI TAKESHI , MATSUOKA NORIYUKI
IPC分类号： G01R31/26 , H01R33/76
CPC分类号： G01R1/0483
摘要： PROBLEM TO BE SOLVED: To provide a socket for a semiconductor device that can uniformly bring a bare chip into contact with a bump of a sheet with an electrode without depending on the size of the bare chip and can press it with a suitable pressure. SOLUTION: In an IC socket body, a carrier unit 21 storing the bare chip inside is removably mounted to a storage section. The carrier unit 21 has the sheet 32 with the electrode and an attitude stabilizing member 30 mounted on this, and the attitude stabilizing member 30 stabilizes the attitude of the bare chip to be substantially parallel with the flat face of the sheet 32 with the electrode. COPYRIGHT: (C)2007,JPO&INPIT

10. 发明专利

JP2003115361A IC SOCKET 审中-公开
公开(公告)号：JP2003115361A
公开(公告)日：2003-04-18
申请号：JP2001307552
申请日：2001-10-03
申请人： YAMAICHI ELECTRONICS CO LTD
发明人： WAKABAYASHI YOSHINORI
IPC分类号： B42D15/10 , H01R33/76
摘要： PROBLEM TO BE SOLVED: To enable it to be used so that a press lever component of a press mechanism as a latch mechanism may not be influenced at all even if a cover component moves up and down, and it can be pressed with holding always constant contact pressure. SOLUTION: An IC socket has a plinth, which has an IC package wearing part in its center portion, a socket main part, to which the above plinth is attached so as to possible to stop or separate, a cover component of a frame form prepared in the socket main part so as to be possible to move in up-and- down motion, and the press mechanism, which presses and holds the IC package equipped in the above IC package wearing part. In addition to a pushing up spring component prepared in the corner part so that the above cover component may be pushed up and supported, it has an pushing-up auxiliary spring component prepared in the center of the circumference part of the above cover component.

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