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1. 发明申请

US20120304825A1 PROCESS FOR PRODUCING SPONGE TITANIUM 有权
标题翻译：生产海绵钛的工艺
公开(公告)号：US20120304825A1
公开(公告)日：2012-12-06
申请号：US13585717
申请日：2012-08-14
申请人： Xuemin CHEN , Jun YANG , Zhi ZHOU
发明人： Xuemin CHEN , Jun YANG , Zhi ZHOU
IPC分类号： C22B9/02
CPC分类号： C22B34/1277 , C22B34/1272
摘要： The present invention provides a process for producing sponge titanium, which includes the following steps: Step A: placing aluminum into a resistance furnace, vacuum pumping, introducing inert gas, heating to molten aluminum; Step B: opening a reactor cover, adding a proper amount of potassium fluotitanate to a reactor, leakage detecting after closing the reactor cover, slowly raising the temperature to 150° C., vacuum pumping, and continuously heating to 250° C.; Step C: introducing inert gas into the reactor, continuously raising the temperature to 750° C., stirring uniformly; Step D: opening a valve to adjust the stirring speed, adding molten aluminum drops, and controlling the reaction temperature to 750° C. to 850° C.; Step E: opening the reactor cover, removing a stirring device, eliminating the upper layer of KAlF4 to obtain sponge titanium. The present invention has the beneficial effects of short process flow, low cost, environmental protection and harmlessness.
摘要翻译：本发明提供一种生产海绵钛的方法，其包括以下步骤：步骤A：将铝放入电阻炉中，真空泵送，引入惰性气体，加热至熔融铝; 步骤B：打开反应器盖，向反应器中加入适量的氟钛酸钾，关闭反应器盖后进行泄漏检测，缓慢升温至150℃，真空泵送，并连续加热至250℃。步骤C：将惰性气体引入反应器，将温度持续升至750℃，均匀搅拌; 步骤D：打开阀门以调节搅拌速度，加入熔融的铝滴，并将反应温度控制在750℃至850℃; 步骤E：打开反应器盖，取出搅拌装置，取出上层的KAlF4，得到海绵钛。本发明具有工艺流程短，成本低，环保和无害化的有益效果。

2. 发明申请

US20120304824A1 TECHNOLOGICAL METHOD FOR PREPARING SPONGE TITANIUM FROM SODIUM FLUOTITANATE RAW MATERIAL 有权
标题翻译：从氟化钠原料制备海绵钛的技术方法
公开(公告)号：US20120304824A1
公开(公告)日：2012-12-06
申请号：US13585783
申请日：2012-08-14
申请人： Xuemin CHEN , Jun YANG , Zhi ZHOU
发明人： Xuemin CHEN , Jun YANG , Zhi ZHOU
IPC分类号： C22B5/00
CPC分类号： C22B34/1277 , C22B34/1272
摘要： The invention provides a technological method for preparing sponge titanium from sodium fluotitanate raw material, comprising the following steps: step A: placing aluminum in an airtight resistance furnace, evacuating, introducing inert gas into the resistance furnace, and heating the aluminum to obtain molten aluminum; step B: opening a reactor cover, adding a proper amount of sodium fluotitanate into the reactor, closing the reactor cover, detecting leakage, slowly heating the reactor to 150° C., evacuating and continuously heating the reactor to 250° C.; step C: introducing inert gas into the reactor, continuously heating the reactor to 900° C., and stirring uniformly; step D: opening a valve, adjusting the stirring speed, dripping the molten aluminum, and controlling the temperature of reaction in a range from 900 to 1000° C.; and step E: opening the reactor cover, removing a stirring device out of the reactor, and eliminating NaAlF4 at upper layer to obtain sponge titanium.
摘要翻译：本发明提供了一种由氟钛酸钠原料制备海绵钛的技术方法，包括以下步骤：步骤A：将铝放置在密封电阻炉中，抽真空，将惰性气体引入电阻炉，并加热铝以获得熔融铝 ; 步骤B：打开反应器盖，向反应器中加入适量的氟钛酸钠，关闭反应器盖，检测泄漏，将反应器缓慢加热至150℃，抽空并连续加热反应器至250℃。步骤C：将惰性气体引入反应器，将反应器连续加热至900℃，均匀搅拌; 步骤D：打开阀门，调节搅拌速度，滴入熔融铝，并将反应温度控制在900至1000℃的范围内。步骤E：打开反应器盖，从反应器中取出搅拌装置，除去上层的NaAlF4，得到海绵钛。

3. 发明申请

US20120304826A1 METHOD FOR PREPARING SPONGE TITANIUM FROM SODIUM FLUOTITANATE BY ALUMINOTHERMIC REDUCTION 有权
标题翻译：通过氧化铝还原从氟磷酸钠制备海绵钛的方法
公开(公告)号：US20120304826A1
公开(公告)日：2012-12-06
申请号：US13585786
申请日：2012-08-14
申请人： Xuemin CHEN , Jun YANG , Zhi ZHOU
发明人： Xuemin CHEN , Jun YANG , Zhi ZHOU
IPC分类号： C22B34/12 , C22B9/00
CPC分类号： C22B34/1277
摘要： The invention provides a method for preparing sponge titanium from sodium fluotitanate by aluminothermic reduction, comprising the following steps: a reaction step: aluminum and zinc are mixed under a vacuum state, and sodium fluotitanate is then added into the mixture for reaction; a separation step: the product resulting from the complete reaction stands still and is then introduced with inert gas, and NaF and AlF3 in upper-layer liquid phase are extracted; and a distillation step: Zn in the remaining product Zn—Ti is distilled out under a vacuum state, wherein the mass ratio of the aluminum to the zinc is 1:2 to 1:10.
摘要翻译：本发明提供了一种通过铝热还原从氟酸钠制备海绵钛的方法，包括以下步骤：反应步骤：将铝和锌在真空状态下混合，然后将氟钛酸钠加入到混合物中进行反应; 分离步骤：由完全反应产生的产物静置，然后引入惰性气体，提取上层液相中的NaF和AlF3; 和蒸馏步骤：在真空状态下蒸馏剩余产物Zn-Ti中的Zn，其中铝与锌的质量比为1:2至1:10。

4. 发明申请

US20120304823A1 METHOD FOR PREPARING SPONGE TITANIUM FROM POTASSIUM FLUOTITANATE BY ALUMINOTHERMIC REDUCTION 有权
标题翻译：通过氧化铝还原从氟磷酸钙制备海绵钛的方法
公开(公告)号：US20120304823A1
公开(公告)日：2012-12-06
申请号：US13585721
申请日：2012-08-14
申请人： Xuemin CHEN , Jun YANG , Zhi ZHOU
发明人： Xuemin CHEN , Jun YANG , Zhi ZHOU
IPC分类号： C22B5/00
CPC分类号： C22B34/1277
摘要： The invention provides a method for preparing sponge titanium from potassium fluotitanate by aluminothermic reduction, comprising the following steps: a reaction step: aluminum and zinc are mixed under a vacuum state, and the mixture is then reacted with potassium fluotitanate; a distillation step: KF, AlF3 and Zn generated by reaction are distilled out under a vacuum state; and a cooling step: sponge titanium is obtained subsequent to banking cooling. The invention further provides another method for preparing sponge titanium from potassium fluotitanate by aluminothermic reduction, comprising the following steps: a reaction step: aluminum and magnesium are mixed under a vacuum argon introduction condition, and the mixture is then reacted with potassium fluotitanate; a distillation step: KF, AlF3, MgF2 and Mg generated by reaction are distilled out under a vacuum state; and a cooling step: sponge titanium is obtained subsequent to banking cooling.
摘要翻译：本发明提供了一种通过铝热还原从氟酸钾制备海绵钛的方法，包括以下步骤：反应步骤：将铝和锌在真空状态下混合，然后使该混合物与氟钛酸钾反应; 蒸馏步骤：在真空状态下蒸馏出由反应产生的KF，AlF 3和Zn; 和冷却步骤：在银行冷却之后获得海绵钛。本发明还提供另一种通过铝热还原由氟钛酸钾制备海绵钛的方法，包括以下步骤：反应步骤：在真空氩气引入条件下将铝和镁混合，然后使该混合物与氟钛酸钾反应; 蒸馏步骤：在真空状态下蒸馏出由反应产生的KF，AlF 3，MgF 2和Mg; 和冷却步骤：在银行冷却之后获得海绵钛。

5. 发明申请

US20180352661A1 15993351 审中-公开
公开(公告)号：US20180352661A1
公开(公告)日：2018-12-06
申请号：US15993351
申请日：2018-05-30
申请人： Jun YANG , Tengyuan ZHANG , Qiuquan GUO
发明人： Jun YANG , Tengyuan ZHANG , Qiuquan GUO
IPC分类号： H05K3/42 , H05K3/18 , H05K1/03 , H05K3/12 , H05K3/38 , H05K1/09 , C23C18/16
摘要： Provided herein is a method to printed electronics, and more particularly related to printed electronics on flexible, porous substrates. The method includes applying a coating compound comprising poly (4-vinylpyridine) (P4VP) and SU-8 dissolved in an organic alcohol solution to one or more surface of a flexible, porous substrate, curing the porous substrate at a temperature of at least 130° C. such that the porous substrate is coated with a layer of said coating compound, printing a jet of a transition metal salt catalyst solution onto one or more printing sides of the flexible, porous substrate to deposit a transition metal salt catalyst onto the one or more printing sides, and submerging the substrate in an electroless metal deposition solution to deposit the metal on the flexible, porous substrate, wherein the deposited metal induces the formation of one or more three-dimensional metal-fiber conductive structures within the flexible, porous substrate.

6. 发明公开

US20240021111A1 DISPLAY MODULE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE 审中-公开
公开(公告)号：US20240021111A1
公开(公告)日：2024-01-18
申请号：US17312415
申请日：2021-04-26
申请人： Jun YANG , Kuihua YOU , Chihshun TANG
发明人： Jun YANG , Kuihua YOU , Chihshun TANG
IPC分类号： G09F9/30
CPC分类号： G09F9/301
摘要： Embodiments of the application discloses a display module, a manufacturing method thereof, and a display device, wherein the display module includes a display panel, a functional layer, and a sealant layer disposed on the display panel, the sealant layer includes a first sealant section spaced apart from the functional layer and a second sealant section filled between the first sealant section and the functional layer, and an elastic modulus of the second sealant section is smaller than an elastic modulus of the first sealant section.

7. 发明申请

US20120219867A1 MAGNESIUM SECONDARY BATTERY, USE OF ELECTROLYTIC SOLUTION IN MAGNESIUM SECONDARY BATTERY AND ELECTROLYTIC SOLUTION FOR MAGNETIC SECONDARY BATTERY 有权
标题翻译：镁二次电池，电磁解决方案用于磁性二次电池和电解液用于磁性二次电池
公开(公告)号：US20120219867A1
公开(公告)日：2012-08-30
申请号：US13403381
申请日：2012-02-23
申请人： Yanna NULI , Qingsong ZHAO , Jun YANG , Yongsheng GUO
发明人： Yanna NULI , Qingsong ZHAO , Jun YANG , Yongsheng GUO
IPC分类号： H01M10/0569
CPC分类号： H01M4/13 , H01M4/466 , H01M10/054 , H01M10/0568 , H01M10/0569 , Y02E60/122 , Y02P70/54
摘要： A magnesium secondary battery includes a positive electrode, a negative electrode, a separator membrane and an electrolytic solution. The electrolytic solution includes nitrogen-containing heterocyclic magnesium halide and an organic ether solvent.
摘要翻译：镁二次电池包括正极，负极，隔膜和电解液。电解液包括含氮杂环卤化镁和有机醚溶剂。

8. 发明申请

US20080032452A1 CHIP SCALE PACKAGE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：芯片尺寸包装及其制造方法
公开(公告)号：US20080032452A1
公开(公告)日：2008-02-07
申请号：US11757795
申请日：2007-06-04
申请人： Jun YANG , You JOO , Dong JUNG
发明人： Jun YANG , You JOO , Dong JUNG
IPC分类号： H01L21/58
CPC分类号： H01L23/3114 , H01L24/11 , H01L24/13 , H01L2224/05001 , H01L2224/05026 , H01L2224/0557 , H01L2224/05571 , H01L2224/11 , H01L2224/11334 , H01L2224/13 , H01L2224/13099 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01087 , H01L2924/014 , H01L2924/07811 , H01L2924/14 , H01L2924/30107 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： A chip scale package includes a patterned circuit layer attached to the active surface of a semiconductor chip through an anisotropic conductive adhesive layer such that contact pads on a lower surface of the patterned circuit layer are electrically coupled to corresponding bonding pads on the semiconductor chip. The patterned circuit layer has a plurality of openings formed therein at locations corresponding to the contact pads such that each of the contact pads has a portion exposed from an upper surface of the patterned circuit layer through the corresponding opening. A plurality of metal bumps are respectively disposed in the openings and mounted to the exposed portions of the contact pads for making external electrical connection. The present invention further provides a method for manufacturing the chip scale package at the wafer-level.
摘要翻译：芯片级封装包括通过各向异性导电粘合剂层附着到半导体芯片的有源表面的图案化电路层，使得图案化电路层的下表面上的接触焊盘电耦合到半导体芯片上的对应焊盘。图案化电路层在对应于接触焊盘的位置处具有形成在其中的多个开口，使得每个接触焊盘具有通过相应的开口从图案化电路层的上表面露出的部分。多个金属凸块分别设置在开口中并安装到接触垫的暴露部分以进行外部电连接。本发明还提供了一种在晶片级制造芯片级封装的方法。

9. 发明申请

US20190104618A1 METHOD FOR SOLVENT-FREE PRINTING CONDUCTORS ON SUBSTRATE 审中-公开
公开(公告)号：US20190104618A1
公开(公告)日：2019-04-04
申请号：US16086851
申请日：2017-03-07
申请人： Jun YANG , Tengyuan ZHANG , Qiuquan GUO
发明人： Jun YANG , Tengyuan ZHANG , Qiuquan GUO
IPC分类号： H05K3/10 , G03G9/093 , H05K3/12 , C08J3/20
摘要： A solvent-free method for fabricating conductors is disclosed. A thick patterned layer up to 13 microns containing metal precursor and reducing agent precursor are initially deposited onto a substrate using laser printing technology. The deposited patterned precursor materials are then irradiated with a newly developed high energy intense pulsed light (IPL) system in order to transform the deposited materials to thick conductive metal patterns. The easy metallization of printed patterns makes this invention an especially effective method for massive production of flexible printed circuits.

10. 发明申请

US20180208792A1 FILM COATING AND FILM COATING COMPOSITIONS FOR SURFACE MODIFICATION AND METALLIZATION 审中-公开
公开(公告)号：US20180208792A1
公开(公告)日：2018-07-26
申请号：US15928527
申请日：2018-03-22
申请人： Jun YANG
发明人： Jun YANG , Mingjun HU , Tengyuan ZHANG , Qiuquan GUO
IPC分类号： C09D139/08 , B05D3/06 , B05D3/02 , C23C18/42 , C23C18/16 , C09D7/20 , C09D7/63 , C08J7/04 , H05K3/12 , H05K3/18
CPC分类号： C09D139/08 , B05D1/18 , B05D3/0254 , B05D3/0272 , B05D3/067 , B05D7/02 , B05D2401/10 , B05D2518/00 , C08J7/047 , C08J2367/02 , C08J2439/08 , C08L39/08 , C09D7/20 , C09D7/63 , C23C18/1605 , C23C18/1608 , C23C18/165 , C23C18/2006 , C23C18/2086 , C23C18/30 , C23C18/32 , C23C18/405 , C23C18/42 , H05K1/038 , H05K1/0386 , H05K1/0393 , H05K3/1208 , H05K3/181 , H05K3/182 , H05K3/387 , H05K2203/013 , H05K2203/072 , H05K2203/0783 , H05K2203/125 , C08L63/00
摘要： The present disclosure provides a coating composition for use in coating polyester film, polyimide film, polyvinyl chloride film, semi-embossed film, polyvinyl chloride film and like, comprises poly(4-vinyl pyridine), SU-8, a solution such as isopropyl alcohol, 1,4-dioxane. A simple universal solution-based coating method for fast surface modification of various substances by applying an effective amount of pyridine ligands to immobilize transitional metal ions that can behave as the catalyst of electroless copper plating for surface metallization while functioning as the adhesion-promoting layer between the substrate and deposited metal.

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