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    • 2. 发明申请
    • Thin-Film Photovoltaic Devices and Methods of Manufacture
    • 薄膜光伏器件及其制造方法
    • US20130327398A1
    • 2013-12-12
    • US14001607
    • 2012-02-27
    • Ramesh DhereJoel DuenowTimothy A. Gessert
    • Ramesh DhereJoel DuenowTimothy A. Gessert
    • H01L31/073
    • H01L31/073H01L31/0749H01L31/1828Y02E10/541Y02E10/543
    • Improved thin-film photovoltaic devices and methods of manufacturing such devices are described. Embodiments include a substrate-configured thin-film PV device (200) having a photo-absorbing semiconductor layer (230) and a window layer (240). Embodiments include devices having a CdTe photo-absorbing semiconductor layer, a CdS or CdS:In window layer, and an n-p junction residing at or proximate an interface of the photo-absorbing semiconductor and window layers. Variations include methods of manufacture wherein i) O2 is excluded from an ambient environment during deposition of the CdTe layer (102), ii) O2 is included in an ambient environment during CdCl2 treatment (103), iii) O2 is included in an ambient environment during deposition of a CdS or CdS:In layer (104), or iv) a medium-temperature anneal (MTA) having an anneal temperature of 300° C. or less is performed (105) after deposition of the CdS layer.
    • 描述了改进的薄膜光伏器件及其制造方法。 实施例包括具有光吸收半导体层(230)和窗口层(240)的基板构造的薄膜PV器件(200)。 实施例包括具有CdTe光吸收半导体层,CdS或CdS:窗口层以及驻留在光吸收半导体和窗口层的界面处或附近的n-p结的器件。 变化包括制造方法,其中i)在CdTe层(102)沉积期间从环境环境中排除O 2,ii)在CdCl 2处理(103)期间,O 2包含在周围环境中,iii)在环境环境中包括O 2 在沉积CdS或CdS时:在层(104)中,或iv)在沉积CdS层之后执行退火温度为300℃或更低的中温退火(MTA)(105)。