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1. 发明申请

US20130130601A1 CHEMICAL MECHANICAL POLISHING MACHINE AND CHEMICAL MECHANICAL POLISHING APPARATUS COMPRISING THE SAME 有权
标题翻译：化学机械抛光机及其化学机械抛光装置
公开(公告)号：US20130130601A1
公开(公告)日：2013-05-23
申请号：US13384627
申请日：2011-06-08
申请人： Xinchun Lu , Zhenjie Xu , Yongyong He , Tongqing Wang , Pan Shen , Dewen Zhao , Hegeng Mei , Lianqing Zhang , Zhaohui Pei , Jianbin Luo
发明人： Xinchun Lu , Zhenjie Xu , Yongyong He , Tongqing Wang , Pan Shen , Dewen Zhao , Hegeng Mei , Lianqing Zhang , Zhaohui Pei , Jianbin Luo
IPC分类号： B24B37/04
CPC分类号： B24B37/04 , B24B37/10
摘要： A chemical-mechanical polishing machine includes a work table, polishing platen mounted onto the work table, pad conditioner and slurry-delivery device mounted on the work table and disposed near the polishing platen, and polishing-head support mounted on the work table and including a base plate and supporting side plates. The base plate is formed with a groove in a “thickness” direction. A loading and unloading table is mounted on the work table, disposed below the base plate, and opposed to the polishing platen. A polishing head is rotatably disposed on the polishing-head support, movable in the longitudinal direction, and passes through the groove to extend downwardly. A robotic manipulator is disposed near the work table for placing a wafer on the loading and unloading table and taking the wafer away from it. A chemical-mechanical polishing apparatus includes an array of a plurality of the machine.
摘要翻译：化学机械抛光机包括安装在工作台上的工作台，安装在工作台上的抛光台板，安装在工作台上并设置在抛光台板附近的浆料输送装置，以及安装在工作台上的抛光头支架，基板和支撑侧板。底板形成有“厚度”方向的凹槽。装载和卸载台安装在工作台上，设置在底板下方并与抛光台相对。抛光头可旋转地设置在抛光头支撑件上，可沿纵向方向移动，并穿过凹槽向下延伸。机器人操纵器设置在工作台附近，用于将晶片放置在装载和卸载台上并将晶片远离它。化学机械抛光装置包括多个机器的阵列。

2. 发明申请

US20120115403A1 PAD CONDITIONER HEAD FOR CONDITIONING A POLISHING PAD 审中-公开
标题翻译：用于调节抛光垫的PAD调节器头
公开(公告)号：US20120115403A1
公开(公告)日：2012-05-10
申请号：US13384631
申请日：2011-06-28
申请人： Xinchun Lu , Pan Shen , Yongyong He , Jianbin Luo
发明人： Xinchun Lu , Pan Shen , Yongyong He , Jianbin Luo
IPC分类号： B24B53/12
CPC分类号： B24B53/017
摘要： The pad conditioner head for conditioning a polishing pad comprises a bearing seat, a spindle, a protective cover, an annular pressure plate, a self-adaptive platen, a diamond disk and a flexible ring. A flange is mounted on the lower end of the spindle. A press ring is mounted onto a lower surface of the flange. The flexible ring has an upper edge sandwiched between the flange and the press ring and a lower edge sandwiched between the protective cover and the annular pressure plate. The flexible ring, the flange, the annular pressure plate and the self-adaptive platen define a sealed chamber (M). The protective cover, the annular pressure plate, the self-adaptive platen and the diamond disk are rotatable along with the spindle through the flexible ring and movable in an up and down direction relative to the spindle via a deformation of the flexible ring.
摘要翻译：用于调理抛光垫的垫调节头包括轴承座，心轴，保护盖，环形压板，自适应压板，金刚石圆盘和柔性环。法兰安装在主轴的下端。压环安装在凸缘的下表面上。柔性环具有夹在凸缘和压环之间的上边缘和夹在保护盖和环形压板之间的下边缘。柔性环，法兰，环形压板和自适应压板限定了密封室（M）。保护盖，环形压板，自适应压板和金刚石盘可以通过柔性环与主轴一起旋转，并通过柔性环的变形相对于主轴在上下方向上移动。

3. 发明授权

US09138857B2 Chemical mechanical polishing machine and chemical mechanical polishing apparatus comprising the same 有权
标题翻译：化学机械抛光机及其组成的化学机械抛光装置
公开(公告)号：US09138857B2
公开(公告)日：2015-09-22
申请号：US13384627
申请日：2011-06-08
申请人： Xinchun Lu , Zhenjie Xu , Yongyong He , Tongqing Wang , Pan Shen , Dewen Zhao , Hegeng Mei , Lianqing Zhang , Zhaohui Pei , Jianbin Luo
发明人： Xinchun Lu , Zhenjie Xu , Yongyong He , Tongqing Wang , Pan Shen , Dewen Zhao , Hegeng Mei , Lianqing Zhang , Zhaohui Pei , Jianbin Luo
IPC分类号： B24B37/04 , B24B37/10
CPC分类号： B24B37/04 , B24B37/10
摘要： A chemical-mechanical polishing machine includes a work table, polishing platen mounted onto the work table, pad conditioner and slurry-delivery device mounted on the work table and disposed near the polishing platen, and polishing-head support mounted on the work table and including a base plate and supporting side plates. The base plate is formed with a groove in a “thickness” direction. A loading and unloading table is mounted on the work table, disposed below the base plate, and opposed to the polishing platen. A polishing head is rotatably disposed on the polishing-head support, movable in the longitudinal direction, and passes through the groove to extend downwardly. A robotic manipulator is disposed near the work table for placing a wafer on the loading and unloading table and taking the wafer away from it. A chemical-mechanical polishing apparatus includes an array of a plurality of the machine.
摘要翻译：化学机械抛光机包括安装在工作台上的工作台，安装在工作台上的抛光台板，安装在工作台上并设置在抛光台板附近的浆料输送装置，以及安装在工作台上的抛光头支架，基板和支撑侧板。底板形成有“厚度”方向的凹槽。装载和卸载台安装在工作台上，设置在底板下方并与抛光台相对。抛光头可旋转地设置在抛光头支撑件上，可沿纵向方向移动，并通过凹槽向下延伸。机器人操纵器设置在工作台附近，用于将晶片放置在装载和卸载台上并将晶片远离它。化学机械抛光装置包括多个机器的阵列。

4. 发明申请

US20130000845A1 Device and Method for Measuring Thickness of Slurry and Chemical Mechanical Polishing Apparatus Comprising the Device 审中-公开
标题翻译：用于测量浆料厚度的装置和方法以及包括装置的化学机械抛光装置
公开(公告)号：US20130000845A1
公开(公告)日：2013-01-03
申请号：US13387964
申请日：2011-06-07
申请人： Xinchun Lu , Dewen Zhao , Yongyong He , Jianbin Luo
发明人： Xinchun Lu , Dewen Zhao , Yongyong He , Jianbin Luo
IPC分类号： G01B7/06 , B44C1/22
CPC分类号： G01B21/08 , G01B7/10
摘要： A device for measuring a thickness of a slurry used in a chemical mechanical polishing apparatus and a method using the same are provided. The chemical mechanical polishing apparatus comprises a polishing head (10), a rotary table (20), a polishing platen (30) and a polishing pad (40). The device for measuring the thickness of the slurry comprises: a distance sensor (50) disposed in the polishing platen (30) for measuring a distance between the distance sensor (50) and a wafer (11) in the polishing head (10); a processing unit (70) (60) disposed in the rotary table (20) and connected to the distance sensor (50) for converting a measuring signal from the distance sensor (50) into standard electrical signal; a processing unit (70) connected to distance converters (60) for acquiring the standard electrical signal to obtain a thickness of the slurry between the polishing head (10) and the polishing pad (40). A chemical mechanical polishing apparatus comprising the device for measuring the thickness of the slurry is also provided.
摘要翻译：提供了一种用于测量在化学机械抛光装置中使用的浆料的厚度的装置及其使用方法。化学机械抛光装置包括抛光头（10），旋转台（20），研磨台板（30）和抛光垫（40）。用于测量浆料厚度的装置包括：设置在抛光台板（30）中的距离传感器（50），用于测量抛光头（10）中的距离传感器（50）和晶片（11）之间的距离; 设置在旋转台（20）中并连接到距离传感器（50）的处理单元（70），用于将来自距离传感器（50）的测量信号转换成标准电信号; 连接到距离转换器（60）的处理单元（70），用于获取标准电信号以获得抛光头（10）和抛光垫（40）之间的浆料的厚度。还提供了一种包括用于测量浆料厚度的装置的化学机械抛光装置。

5. 发明申请

US20120315826A1 Device and Method for Measuring Physical Parameters of Slurry and Chemical Mechanical Polishing Apparatus Comprising the Device 审中-公开
标题翻译：用于测量包括装置的浆料和化学机械抛光装置的物理参数的装置和方法
公开(公告)号：US20120315826A1
公开(公告)日：2012-12-13
申请号：US13387941
申请日：2011-06-07
申请人： Xinchun Lu , Dewen Zhao , Yongyong He , Jianbin Luo
发明人： Xinchun Lu , Dewen Zhao , Yongyong He , Jianbin Luo
IPC分类号： B24B49/10 , B24B49/16 , B24B49/14 , B24B7/00 , B24B1/00
CPC分类号： B24B37/044
摘要： The present disclosure discloses a device for measuring physical parameters of a slurry used in a chemical mechanical polishing apparatus and measuring method using the same. The chemical mechanical polishing apparatus comprises a polishing head, a rotary table, a polishing platen and a polishing pad having a through-hole. The device for measuring physical parameters of slurry comprises: a sensor disposed in the polishing platen and adapted to contacted the slurry via the through-hole of the polishing pad for measuring the physical parameters of the slurry; a converter disposed in the rotary table and coupled to the sensor for converting a measuring signal of the sensor into a standard electrical signal; and a processing unit coupled to the converter for acquiring the standard electrical signal to calculate physical parameters of the slurry. According to the device for measuring the physical parameters of the slurry of an embodiment of the present disclosure, the physical parameters of slurry between the polishing head and the polishing pad may be in-suit measured and obtained. The present disclosure further discloses a chemical mechanical polishing apparatus having the device for measuring the physical parameters of the slurry.
摘要翻译：本公开公开了一种用于测量在化学机械抛光装置中使用的浆料的物理参数的装置和使用其的测量方法。化学机械抛光装置包括抛光头，旋转台，抛光台板和具有通孔的抛光垫。用于测量浆料物理参数的装置包括：传感器，设置在研磨台板中并适于经由抛光垫的通孔接触浆料，以测量浆料的物理参数; 转换器，设置在旋转台中并耦合到传感器，用于将传感器的测量信号转换成标准电信号; 以及处理单元，其耦合到所述转换器，用于获取所述标准电信号以计算所述浆料的物理参数。根据本公开的实施例的用于测量浆料的物理参数的装置，可以适当地测量和获得抛光头和抛光垫之间的浆料的物理参数。本公开还公开了一种具有用于测量浆料的物理参数的装置的化学机械抛光装置。

6. 发明申请

US20100078067A1 CARBON NANOTUBE FILM BASED SOLAR CELL AND FABRICATING METHOD THEREOF 审中-公开
标题翻译：碳纳米管薄膜基太阳能电池及其制备方法
公开(公告)号：US20100078067A1
公开(公告)日：2010-04-01
申请号：US12521691
申请日：2007-12-28
申请人： Yi Jia , Jinquan Wei , Qinke Shu , Kunlin Wang , Daming Zhuang , Gong Zhang , Wenjin Liu , Jianbin Luo , Zhicheng Wang , Dehai Wu
发明人： Yi Jia , Jinquan Wei , Qinke Shu , Kunlin Wang , Daming Zhuang , Gong Zhang , Wenjin Liu , Jianbin Luo , Zhicheng Wang , Dehai Wu
IPC分类号： H01L31/00 , H01L31/18
CPC分类号： H01L51/444 , B82Y10/00 , H01L31/022466 , H01L31/035281 , H01L31/072 , H01L31/1884 , H01L51/0048 , H01L51/4253 , Y02E10/549 , Y02P70/521
摘要： A carbon nanotube-based solar cell and fabricating method thereof are provided. The method is achieved by applying carbon nanotube film (1) photoelectric conversion material and an upper electrode simultaneously. The method improves photoelectric conversion efficiency and life time of the solar cell, the fabricating method of the solar cell is simple, and the fabricating cost is low.
摘要翻译：提供一种碳纳米管系太阳能电池及其制造方法。该方法通过同时施加碳纳米管膜（1）光电转换材料和上电极来实现。该方法提高了太阳能电池的光电转换效率和寿命，太阳能电池的制造方法简单，制造成本低。

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