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1. 发明申请

US20050077609A1 Circuit package and method of plating the same 失效
标题翻译：电路封装及其电镀方法
公开(公告)号：US20050077609A1
公开(公告)日：2005-04-14
申请号：US10674370
申请日：2003-09-30
申请人： Xiaowei Yao , Tam Nguyen , Marc Finot , Rickie Lake , Jeffrey Bennett , Robert Kohler
发明人： Xiaowei Yao , Tam Nguyen , Marc Finot , Rickie Lake , Jeffrey Bennett , Robert Kohler
IPC分类号： C25D5/02 , H01L21/48 , H01L23/10 , H01L23/15 , H01L23/36 , H01L23/373 , H01L23/498 , H01L23/66 , H05K1/03 , H05K1/11 , H05K3/24 , H01L23/52 , H01L21/44 , H01L23/48 , H01L29/40
CPC分类号： H01L23/498 , C25D5/02 , H01L21/4846 , H01L23/10 , H01L23/15 , H01L23/36 , H01L23/3731 , H01L23/66 , H01L2924/0002 , H01L2924/01079 , H01L2924/3011 , H05K1/0306 , H05K1/115 , H05K3/241 , H05K3/243 , H05K2201/09354 , H01L2924/00
摘要： A circuit package includes a base portion and a first metal pattern disposed on a substrate surface. Second and third metal patterns are disposed on another substrate surface, and electrically coupled to first and second vias. The third metal pattern forms a gap to electrically isolate it from the second metal pattern. A circuit package includes a substrate having an opening and a single heat sink positioned in the opening to expose top and bottom surfaces through top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.
摘要翻译：电路封装包括基部和设置在基板表面上的第一金属图案。第二和第三金属图案设置在另一基板表面上，并且电耦合到第一和第二通孔。第三金属图案形成间隙以将其与第二金属图案电隔离。电路封装包括具有开口的基板和位于开口中的单个散热器，以通过基板的顶表面和底表面露出顶表面和底表面。选择电镀包括将第一和第二金属图案施加到基板表面，产生第一金属图案和金属源之间的电压差，以及通过将第一金属类型吸引到第一金属图案的电压电位来镀覆第一金属图案。第一金属图案的电压电位小于金属源的电压电位。

2. 发明申请

US20060121732A1 Circuit package and method of plating the same 有权
标题翻译：电路封装及其电镀方法
公开(公告)号：US20060121732A1
公开(公告)日：2006-06-08
申请号：US11334172
申请日：2006-01-18
申请人： Xiaowei Yao , Tam Nguyen , Marc Finot , Rickie Lake , Jeffrey Bennett , Robert Kohler
发明人： Xiaowei Yao , Tam Nguyen , Marc Finot , Rickie Lake , Jeffrey Bennett , Robert Kohler
IPC分类号： H01L21/44 , H01L23/12 , H01L23/34 , H01L23/053
CPC分类号： H01L23/498 , C25D5/02 , H01L21/4846 , H01L23/10 , H01L23/15 , H01L23/36 , H01L23/3731 , H01L23/66 , H01L2924/0002 , H01L2924/01079 , H01L2924/3011 , H05K1/0306 , H05K1/115 , H05K3/241 , H05K3/243 , H05K2201/09354 , H01L2924/00
摘要： A circuit package includes a substrate having an opening and a single unitary heat sink adapted to effectively dissipate heat is positioned in the opening to expose top and bottom surfaces which are respectively coplanar with top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.
摘要翻译：电路封装包括具有开口的基板和适于有效散发热量的单个整体式散热器，其位于开口中以暴露与基板的顶表面和底表面共面的顶表面和底表面。选择性电镀包括将第一和第二金属图案施加到基板表面，产生第一金属图案和金属源之间的电位差，并且通过将第一金属类型吸引到第一金属图案的电压电位来镀覆第一金属图案。第一金属图案的电压电位小于金属源的电压电位。

3. 发明授权

US07405155B2 Circuit package and method of plating the same 有权
标题翻译：电路封装及其电镀方法
公开(公告)号：US07405155B2
公开(公告)日：2008-07-29
申请号：US11334172
申请日：2006-01-18
申请人： Xiaowei Yao , Tam Nguyen , Marc Finot , Rickie C. Lake , Jeffrey A. Bennett , Robert Kohler
发明人： Xiaowei Yao , Tam Nguyen , Marc Finot , Rickie C. Lake , Jeffrey A. Bennett , Robert Kohler
IPC分类号： H01L21/44 , C25D5/00
CPC分类号： H01L23/498 , C25D5/02 , H01L21/4846 , H01L23/10 , H01L23/15 , H01L23/36 , H01L23/3731 , H01L23/66 , H01L2924/0002 , H01L2924/01079 , H01L2924/3011 , H05K1/0306 , H05K1/115 , H05K3/241 , H05K3/243 , H05K2201/09354 , H01L2924/00
摘要： A circuit package includes a substrate having an opening and a single unitary heat sink adapted to effectively dissipate heat is positioned in the opening to expose top and bottom surfaces which are respectively coplanar with top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.
摘要翻译：电路封装包括具有开口的基板和适于有效散发热量的单个整体式散热器，其位于开口中以暴露与基板的顶表面和底表面共面的顶表面和底表面。选择性电镀包括将第一和第二金属图案施加到基板表面，产生第一金属图案和金属源之间的电位差，并且通过将第一金属类型吸引到第一金属图案的电压电位来镀覆第一金属图案。第一金属图案的电压电位小于金属源的电压电位。

4. 发明授权

US07019394B2 Circuit package and method of plating the same 失效
标题翻译：电路封装及其电镀方法
公开(公告)号：US07019394B2
公开(公告)日：2006-03-28
申请号：US10674370
申请日：2003-09-30
申请人： Xiaowei Yao , Tam Nguyen , Marc Finot , Rickie C. Lake , Jeffrey A. Bennett , Robert Kohler
发明人： Xiaowei Yao , Tam Nguyen , Marc Finot , Rickie C. Lake , Jeffrey A. Bennett , Robert Kohler
IPC分类号： H01L23/053
CPC分类号： H01L23/498 , C25D5/02 , H01L21/4846 , H01L23/10 , H01L23/15 , H01L23/36 , H01L23/3731 , H01L23/66 , H01L2924/0002 , H01L2924/01079 , H01L2924/3011 , H05K1/0306 , H05K1/115 , H05K3/241 , H05K3/243 , H05K2201/09354 , H01L2924/00
摘要： A circuit package includes a base portion and a first metal pattern disposed on a substrate surface. Second and third metal patterns are disposed on another substrate surface, and electrically coupled to first and second vias. The third metal pattern forms a gap to electrically isolate it from the second metal pattern. A circuit package includes a substrate having an opening and a single heat sink positioned in the opening to expose top and bottom surfaces through top and bottom surfaces of the substrate. Selective plating includes applying first and second metal patterns to a substrate surface, creating a potential voltage difference between the first metal pattern and a metal source, and plating the first metal pattern by attracting a first metal type to the voltage potential of the first metal pattern. The voltage potential of the first metal pattern is less than the voltage potential of the metal source.
摘要翻译：电路封装包括基部和设置在基板表面上的第一金属图案。第二和第三金属图案设置在另一基板表面上，并且电耦合到第一和第二通孔。第三金属图案形成间隙以将其与第二金属图案电隔离。电路封装包括具有开口的基板和位于开口中的单个散热器，以通过基板的顶表面和底表面露出顶表面和底表面。选择性电镀包括将第一和第二金属图案施加到基板表面，产生第一金属图案和金属源之间的电位差，并且通过将第一金属类型吸引到第一金属图案的电压电位来镀覆第一金属图案。第一金属图案的电压电位小于金属源的电压电位。

5. 发明申请

US20050058411A1 Hermetic sealing of optical module 有权
标题翻译：光学模块的密封
公开(公告)号：US20050058411A1
公开(公告)日：2005-03-17
申请号：US10663242
申请日：2003-09-15
申请人： Marc Finot , Rickie Lake
发明人： Marc Finot , Rickie Lake
IPC分类号： G02B6/42 , G02B6/36
CPC分类号： G02B6/4201 , G02B6/4248 , G02B6/4251 , G02B6/4265 , G02B6/4267 , G02B6/4271
摘要： A hermetically sealable package may be formed from a top portion and a bottom portion mated along a seam at or near a plane of an optical fiber. A completed pill assembly may be positioned directly into the enclosure base without requiring the fiber to be threaded through the feed through or “snout”. The top potion may then be mated with the bottom portion to form the package. A glass solder ring may be placed coaxial with the fiber in the feed through. The seam may be sealed by laser welding and the glass solder ring reflowed by laser heating, for example, with a same laser as used to weld the seam or by resistive or induction heating. In some embodiments a coupling tube around the fiber and snout or the snout itself may have holes to allow solder sealing within the snout and filling the remaining area with epoxy. Since the package is initially split in two pieces, module assembly may be facilitated without threading.
摘要翻译：可以由沿着光纤平面处或附近的接缝配合的顶部和底部形成气密密封的封装。完整的药丸组件可以直接定位到外壳基部中，而不需要将纤维穿过进料口或“鼻”。然后可以将顶部部分与底部配合以形成包装。玻璃焊环可以与进料通道中的纤维同轴放置。接缝可以通过激光焊接密封，并且玻璃焊接环通过激光加热回流，例如，与用于焊接接缝或通过电阻或感应加热相同的激光器。在一些实施例中，围绕纤维和鼻孔或鼻口本身的耦合管可具有孔，以允许焊缝在鼻孔内密封并用环氧树脂填充剩余区域。由于包装最初分成两部分，所以可以在没有穿线的情况下方便地组装模块。

6. 发明授权

US06585427B2 Flexure coupled to a substrate for maintaining the optical fibers in alignment 有权
标题翻译：挠曲耦合到基板，用于维持光纤对准
公开(公告)号：US06585427B2
公开(公告)日：2003-07-01
申请号：US09885240
申请日：2001-06-19
申请人： Marc Finot , Marc Epitaux , Jonas Webjorn , Jean-Marc Verdiell , Robert Kohler
发明人： Marc Finot , Marc Epitaux , Jonas Webjorn , Jean-Marc Verdiell , Robert Kohler
IPC分类号： G02B600
CPC分类号： G02B6/4237 , G02B6/4204 , G02B6/4225 , G02B6/4226 , G02B6/424 , G02B6/4244 , G02B6/4248 , G02B6/4251 , G02B6/4257 , G02B6/4265
摘要： A flexure and package including the same are provided. In one embodiment, the flexure is coupled to a second optical element and a substrate to maintain the second optical element in alignment with a first optical element. The flexure comprises a body, a pair of front and back legs. The attachment of the rear legs to the substrate causes the flexure to move from a first flexure position to a second flexure position, the distance between the first flexure position and the second flexure position equaling an offset distance. A specified length of the body is chosen such that the offset distance causes a second offset distance of the second optical component held by the flexure, and this second offset distance is within a specified range. The second offset distance is equal to the difference between a primary second optical component position and a secondary second optical component position.
摘要翻译：提供了包括其的挠曲和包装。在一个实施例中，挠曲件耦合到第二光学元件和基板，以保持第二光学元件与第一光学元件对准。挠曲件包括主体，一对前后腿。后腿附接到基底使得弯曲部从第一弯曲位置移动到第二弯曲位置，第一弯曲位置与第二挠曲位置之间的距离等于偏移距离。选择身体的指定长度，使得偏移距离导致由弯曲部保持的第二光学部件的第二偏移距离，并且该第二偏移距离在特定范围内。第二偏移距离等于初级第二光学部件位置和次级第二光学部件位置之间的差。

7. 发明申请

US20120000600A1 THERMAL CONTROL OF OPTICAL FILTER WITH LOCAL SILICON FRAME 有权
标题翻译：具有局部硅框架的光学过滤器的热控制
公开(公告)号：US20120000600A1
公开(公告)日：2012-01-05
申请号：US13232773
申请日：2011-09-14
申请人： Marc Finot , Mark McDonald , Andrew Daiber
发明人： Marc Finot , Mark McDonald , Andrew Daiber
IPC分类号： B32B38/10
CPC分类号： G02B7/008 , Y10S359/90
摘要： Briefly, in accordance with one or more embodiments, a thermally controlled optical filter comprises a frame coupled to an etalon where the frame includes a resistive thermal device disposed on the frame to obtain thermal measurements of the etalon during operation. The frame may be generally L-shaped or generally square-shaped. The frame may include a fillet that is generally planar, generally beveled or trapezoidal, or generally circular in shape. A heater may be additionally disposed on the frame. The etalon and frame subassembly may be bonded to a micro hot plate that is capable of heating the etalon to an operational temperature.
摘要翻译：简而言之，根据一个或多个实施例，热控制光学滤波器包括耦合到标准具的框架，其中框架包括布置在框架上的电阻热装置，以在操作期间获得标准具的热测量。框架可以是大致L形或大致正方形的。框架可以包括通常是平面的，大致倾斜的或梯形的或者大致圆形的圆角。可以在框架上另外设置加热器。标准具和框架子组件可以结合到能够将标准具加热到工作温度的微热板。

8. 发明申请

US20090026279A1 Environmental Control Enclosure 审中-公开
标题翻译：环境控制外壳
公开(公告)号：US20090026279A1
公开(公告)日：2009-01-29
申请号：US12245631
申请日：2008-10-03
申请人： Jeremy Dittmer , Marc Finot , Mark Spencer
发明人： Jeremy Dittmer , Marc Finot , Mark Spencer
IPC分类号： F24F13/26 , B21D47/00 , F24F7/00 , B01D53/28 , F24F13/02
CPC分类号： H01L31/0547 , H01L31/048 , Y02E10/52 , Y10T29/49623
摘要： The present invention provides an environmental control system for controlling moisture in a solar energy collector. The environmental control system facilitates the flow of air within and through the solar energy collector by using and enhancing a thermal gradient within the solar energy collector caused by exposure to sunlight. Two or more orifices are located in an enclosed solar energy system to permit air to enter, circulate and remove moisture from the system. The position of the two or more orifices and a thermal gradient generated by the solar energy collector facilitates this process.
摘要翻译：本发明提供一种用于控制太阳能收集器中的水分的环境控制系统。环境控制系统通过使用和增强太阳能收集器中暴露于阳光下的热梯度来促进太阳能收集器内部和穿过太阳能收集器的空气流动。两个或多个孔位于封闭的太阳能系统中，以允许空气进入，循环和从系统中除去水分。两个或更多个孔的位置和由太阳能收集器产生的热梯度有利于该过程。

9. 发明授权

US07061659B2 Thermally tuned filter having a pre-stressed membrane 失效
标题翻译：具有预应力膜的热调节过滤器
公开(公告)号：US07061659B2
公开(公告)日：2006-06-13
申请号：US10813956
申请日：2004-03-31
申请人： Wenhua Ling , Marc Finot , Ralph B. Bettman
发明人： Wenhua Ling , Marc Finot , Ralph B. Bettman
IPC分类号： G02B26/00
CPC分类号： H01S5/02248 , G02B6/4209 , G02F1/0147 , G02F2203/055 , H01S3/1062 , H01S5/005 , H01S5/0064 , H01S5/02284 , H01S5/02415 , H01S5/02446 , H01S5/141
摘要： A thermally tuned filter having a pre-stressed membrane. The thermally tuned filter includes a handle layer, a dielectric layer positioned proximate to the handle layer, and a device layer positioned proximate to the handle layer. The device layer includes an optical device. A pre-stressed membrane is positioned proximate to the device layer; a tensile prestress of the pre-stressed membrane increases the natural frequency of the thermally tuned filter.
摘要翻译：具有预应力膜的热调节过滤器。热调谐滤波器包括手柄层，靠近手柄层定位的电介质层和靠近手柄层定位的器件层。器件层包括光学器件。预应力膜位于装置层附近; 预应力膜的拉伸预应力增加了热调谐过滤器的固有频率。

10. 发明申请

US20050225823A1 THERMALLY TUNED FILTER HAVING A PRE-STRESSED MEMBRANE 失效
标题翻译：具有预应力膜的热调节过滤器
公开(公告)号：US20050225823A1
公开(公告)日：2005-10-13
申请号：US10813956
申请日：2004-03-31
申请人： Wenhua Ling , Marc Finot , Ralph Bettman
发明人： Wenhua Ling , Marc Finot , Ralph Bettman
IPC分类号： G02B6/26 , G02B6/42 , G02B26/00 , G02F1/00 , G02F1/01 , H01S5/00 , H01S5/02 , H01S5/024 , H01S5/14
CPC分类号： H01S5/02248 , G02B6/4209 , G02F1/0147 , G02F2203/055 , H01S3/1062 , H01S5/005 , H01S5/0064 , H01S5/02284 , H01S5/02415 , H01S5/02446 , H01S5/141
摘要： A thermally tuned filter having a pre-stressed membrane. The thermally tuned filter includes a handle layer, a dielectric layer positioned proximate to the handle layer, and a device layer positioned proximate to the handle layer. The device layer includes an optical device. A pre-stressed membrane is positioned proximate to the device layer; a tensile prestress of the pre-stressed membrane increases the natural frequency of the thermally tuned filter.
摘要翻译：具有预应力膜的热调节过滤器。热调谐滤波器包括手柄层，靠近手柄层定位的电介质层和靠近手柄层定位的器件层。器件层包括光学器件。预应力膜位于装置层附近; 预应力膜的拉伸预应力增加了热调谐过滤器的固有频率。

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