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    • 8. 发明申请
    • Status tool to expose metadata read and write queues
    • 暴露元数据读写队列的状态工具
    • US20070179973A1
    • 2007-08-02
    • US11341511
    • 2006-01-30
    • Alexander BrodieBenjamin PerryDavid ParlinJae ParkMichael GilmoreScott Dart
    • Alexander BrodieBenjamin PerryDavid ParlinJae ParkMichael GilmoreScott Dart
    • G06F17/00
    • G06F9/50G06F17/30038
    • A method to expose status information is provided. The status information is associated with metadata extracted from multimedia files and stored in a metadata database. The metadata information that is extracted from the multimedia files is stored in a read queue to allow a background thread to process the metadata and populate the metadata database. Additionally, the metadata database may be updated to include user-define metadata, which is written back to the multimedia files. The user-defined metadata is included in a write queue and is written to the multimedia files associated with the user-defined metadata. The status of the read and write queues are exposed to a user through a graphical user interface. The status may include the list of multimedia files included in the read and write queues, the priorities of each multimedia file, and the number of remaining multimedia files.
    • 提供了一种暴露状态信息的方法。 状态信息与从多媒体文件提取并存储在元数据数据库中的元数据相关联。 从多媒体文件提取的元数据信息被存储在读队列中,以允许后台线程处理元数据并填充元数据数据库。 此外,可以更新元数据数据库以包括被写回多媒体文件的用户定义的元数据。 用户定义的元数据包含在写入队列中,并被写入与用户定义的元数据相关联的多媒体文件。 读写队列的状态通过图形用户界面暴露给用户。 该状态可以包括包括在读取和写入队列中的多媒体文件的列表,每个多媒体文件的优先级以及剩余的多媒体文件的数量。
    • 10. 发明申请
    • Methods for detecting structure dependent process defects
    • 检测结构依赖过程缺陷的方法
    • US20070038325A1
    • 2007-02-15
    • US11204143
    • 2005-08-15
    • Richard GuldiJae ParkDeepak Ramappa
    • Richard GuldiJae ParkDeepak Ramappa
    • G06F19/00
    • G03F7/7065
    • Semiconductor devices formed on wafers are inspected using a master wafer. A subject wafer of a semiconductor design is provided. The subject wafer has dies wherein semiconductor devices of the semiconductor design are formed and at a stage of fabrication. A current layer of the subject wafer is scanned to obtain a scanned layer/image. A master wafer comprising individual wafer/layer maps is obtained. The scanned layer is compared with a corresponding layer map. Matching and non-matching defects are identified from repetitive defects within the corresponding layer map and defects within the scanned layer. The matching defects are reviewed to classify and or identify causality. The master wafer is then updated.
    • 使用母晶片检查在晶片上形成的半导体器件。 提供半导体设计的主题晶片。 主体晶片具有半导体设计的半导体器件形成并处于制造阶段的裸片。 扫描目标晶片的当前层以获得扫描图像/图像。 获得包括单独晶片/层映射的主晶片。 扫描层与对应的层图进行比较。 匹配和不匹配的缺陷是由相应层图中的重复缺陷和扫描层内的缺陷来识别的。 审查匹配的缺陷以分类和/或识别因果关系。 然后更新主晶片。