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    • 5. 发明授权
    • Method of fabricating MOS transistor having shallow source/drain junction regions
    • 制造具有浅源极/漏极结区域的MOS晶体管的方法
    • US06620668B2
    • 2003-09-16
    • US10117001
    • 2002-04-05
    • Seong-jae LeeWon-ju ChoKyoung-wan Park
    • Seong-jae LeeWon-ju ChoKyoung-wan Park
    • H01L218238
    • H01L29/6659H01L21/2255H01L21/26586H01L21/823814H01L29/7833
    • A method of fabricating a MOS transistor having shallow source/drain junction regions is provided. A diffusion source layer is formed on a semiconductor substrate on which gate patterns are formed. Same type or different type of impurities are implanted into the diffusion source layer several times in different directions. As a result, dislocation does not occur and the impurity concentration of the diffusion source layer can be nonuniformly controlled so that damage to the crystal structure of the semiconductor substrate does not occur. Also, the impurities nonuniformly contained in the diffusion source layer are diffused into the semiconductor substrate by a solid phase diffusion method to form shallow source/drain junction regions having LDD regions and highly doped source/drain regions by a self-alignment method.
    • 提供一种制造具有浅源极/漏极结区域的MOS晶体管的方法。 扩散源层形成在其上形成有栅极图案的半导体衬底上。 相同类型或不同类型的杂质在不同方向上多次注入扩散源层。 结果,不会发生位错,扩散源层的杂质浓度可能被不均匀地控制,从而不会发生对半导体衬底的晶体结构的损坏。 此外,扩散源层中不均匀地包含的杂质通过固相扩散法扩散到半导体衬底中,以通过自对准方法形成具有LDD区和高掺杂源极/漏极区的浅源极/漏极结区域。