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1. 发明申请

US20130032384A1 THIN FILM ELECTRODE CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：薄膜电极陶瓷基板及其制造方法
公开(公告)号：US20130032384A1
公开(公告)日：2013-02-07
申请号：US13565249
申请日：2012-08-02
申请人： Won Hee Yoo , Byeung Gyu Chang , Taek Jung Lee , Yun Hwi Park
发明人： Won Hee Yoo , Byeung Gyu Chang , Taek Jung Lee , Yun Hwi Park
IPC分类号： H05K1/03 , H05K3/22
CPC分类号： H05K3/243 , H05K1/0306 , H05K3/107 , H05K3/108 , H05K2201/0338
摘要： Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; a thin film electrode pattern formed on the ceramic substrate; and a plating layer formed on the thin film electrode pattern, wherein the plating layer is formed above the thin film electrode pattern and on both lateral surfaces of the thin film electrode pattern. According to the present invention, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented, by forming a plating layer above the thin film electrode pattern or on both lateral surfaces of the thin film electrode pattern, or forming an intaglio type anti-etching metal layer in the surface of the ceramic substrate.
摘要翻译：本文公开了一种薄膜电极陶瓷基板及其制造方法。薄膜电极陶瓷基板包括：陶瓷基板; 形成在陶瓷基板上的薄膜电极图案; 以及形成在所述薄膜电极图案上的镀层，其中所述镀层形成在所述薄膜电极图案的上方以及所述薄膜电极图案的两个侧面上。根据本发明，通过在薄膜电极图案上方形成镀层，可以防止在陶瓷基板的表面与薄膜电极图案之间以及由于蚀刻剂引起的薄膜电极图案之间发生的底切缺陷，或在薄膜电极图案的两个侧表面上，或在陶瓷基板的表面中形成凹版型的抗蚀刻金属层。

2. 发明授权

US09101064B2 Thin film electrode ceramic substrate and method for manufacturing the same 有权
标题翻译：薄膜电极陶瓷基板及其制造方法
公开(公告)号：US09101064B2
公开(公告)日：2015-08-04
申请号：US13548575
申请日：2012-07-13
申请人： Won Hee Yoo , Byeung Gyu Chang , Taek Jung Lee , Yun Hwi Park
发明人： Won Hee Yoo , Byeung Gyu Chang , Taek Jung Lee , Yun Hwi Park
IPC分类号： H05K1/03 , H05K1/09 , H05K3/02 , H05K3/06 , H05K3/10
CPC分类号： H05K3/06 , H05K1/03 , H05K1/0306 , H05K1/09 , H05K3/02 , H05K3/107 , H05K2201/0317 , H05K2203/025
摘要： Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; one or more anti-etching metal layers formed in a surface of the ceramic substrate; thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherein respective edge portions of the thin film electrode pattern are contacted with the anti-etching metal layer, and thus, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented and the binding strength of the entire thin film electrode pattern can be enhanced, resulting in securing durability and reliability of the thin film electrode patterns.
摘要翻译：本文公开了一种薄膜电极陶瓷基板及其制造方法。薄膜电极陶瓷基板包括：陶瓷基板; 形成在陶瓷基板的表面上的一个或多个抗蚀刻金属层; 在抗蚀刻金属层上形成的薄膜电极图案; 以及形成在薄膜电极图案上的镀层，其中薄膜电极图案的各个边缘部分与抗蚀刻金属层接触，因此在陶瓷基板的表面和薄膜之间发生切削缺陷可以防止由于蚀刻剂引起的薄膜电极图案之间的电极图案和薄膜电极图案之间的粘合强度，从而确保薄膜电极图案的耐久性和可靠性。

3. 发明申请

US20130032383A1 THIN FILM ELECTRODE CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：薄膜电极陶瓷基板及其制造方法
公开(公告)号：US20130032383A1
公开(公告)日：2013-02-07
申请号：US13548575
申请日：2012-07-13
申请人： Won Hee Yoo , Byeung Gyu Chang , Taek Jung Lee , Yun Hwi Park
发明人： Won Hee Yoo , Byeung Gyu Chang , Taek Jung Lee , Yun Hwi Park
IPC分类号： H05K1/03 , B05D3/10
CPC分类号： H05K3/06 , H05K1/03 , H05K1/0306 , H05K1/09 , H05K3/02 , H05K3/107 , H05K2201/0317 , H05K2203/025
摘要： Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; one or more anti-etching metal layers formed in a surface of the ceramic substrate; thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherein respective edge portions of the thin film electrode pattern are contacted with the anti-etching metal layer, and thus, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented and the binding strength of the entire thin film electrode pattern can be enhanced, resulting in securing durability and reliability of the thin film electrode patterns.
摘要翻译：本文公开了一种薄膜电极陶瓷基板及其制造方法。薄膜电极陶瓷基板包括：陶瓷基板; 形成在陶瓷基板的表面上的一个或多个抗蚀刻金属层; 在抗蚀刻金属层上形成的薄膜电极图案; 以及形成在薄膜电极图案上的镀层，其中薄膜电极图案的各个边缘部分与抗蚀刻金属层接触，因此在陶瓷基板的表面和薄膜之间发生切削缺陷可以防止由于蚀刻剂引起的薄膜电极图案之间的电极图案和薄膜电极图案之间的粘合强度，从而确保薄膜电极图案的耐久性和可靠性。

4. 发明授权

US08106306B2 Ceramic multi-layer circuit substrate and manufacturing method thereof 有权
标题翻译：陶瓷多层电路基板及其制造方法
公开(公告)号：US08106306B2
公开(公告)日：2012-01-31
申请号：US12405729
申请日：2009-03-17
申请人： Won Hee Yoo , Byeung Gyu Chang , Taek Jung Lee , Yong Suk Kim
发明人： Won Hee Yoo , Byeung Gyu Chang , Taek Jung Lee , Yong Suk Kim
IPC分类号： H05K1/00
CPC分类号： H05K3/4629 , B32B18/00 , C04B37/005 , C04B2237/04 , C04B2237/32 , C04B2237/52 , C04B2237/562 , C04B2237/565 , C04B2237/595 , C04B2237/62 , C04B2237/68 , C04B2237/704 , C04B2237/708 , H05K1/0306 , H05K3/1291 , H05K3/4617 , H05K2201/0195 , H05K2201/096 , H05K2201/10378 , H05K2203/1126 , H05K2203/1476
摘要： Provided is a method of manufacturing a ceramic multi-layer circuit substrate. A plurality of ceramic blocks, in each of which one or more ceramic green sheets having via-electrodes are layered one atop the other, are formed and are then fired. The fired ceramic blocks are aligned with each other. One or more bonding green sheets each having bonding electrodes in positions corresponding to the via-electrodes of the ceramic blocks are prepared. Each of the bonding green sheets is interposed between a pair of the ceramic blocks opposing each other. The ceramic blocks and the bonding green sheets are bonded and are then fired.
摘要翻译：提供一种制造陶瓷多层电路基板的方法。形成多个陶瓷块，每个陶瓷块中的一个或多个具有通孔电极的陶瓷生片分别彼此层叠，然后烧制。烧制的陶瓷块彼此对准。制备一个或多个接合生片，每个接合生片具有与陶瓷块的通孔电极对应的位置的接合电极。每个接合生片被插入在彼此相对的一对陶瓷块之间。陶瓷块和接合生片结合，然后烧制。

5. 发明授权

US07819995B2 Manufacturing method of multi-layer ceramic substrate 有权
标题翻译：多层陶瓷基板的制造方法
公开(公告)号：US07819995B2
公开(公告)日：2010-10-26
申请号：US12411156
申请日：2009-03-25
申请人： Yong Suk Kim , Byeung Gyu Chang , Taek Jung Lee
发明人： Yong Suk Kim , Byeung Gyu Chang , Taek Jung Lee
IPC分类号： C03B29/00 , C04B33/34
CPC分类号： H05K3/4611 , C04B33/32 , H05K3/4629 , H05K2203/0789 , H05K2203/308
摘要： There is provided a method of manufacturing a multilayer ceramic substrate, the method including: providing a non-sintered multilayer ceramic substrate having a plurality of low temperature sintering green sheets laminated therein; disposing a hard-to-sinter constraining green sheet on at least one of top and bottom surfaces of the non-sintered multilayer ceramic substrate; sintering the non-sintered multilayer ceramic substrate having the hard-to-sinter constraining layer disposed thereon; immersing the sintered multilayer ceramic substrate into an acidic solution; and activating a contact between the hard-to-sinter constraining layer and the acidic solution such that the hard-to-sinter constraining layer is removed.
摘要翻译：提供一种制造多层陶瓷基板的方法，该方法包括：提供层叠有多个低温烧结生片的非烧结多层陶瓷基板; 在非烧结多层陶瓷基板的顶表面和底表面中的至少一个上设置难以烧结的约束生片; 烧结其上设置有难烧结约束层的非烧结多层陶瓷衬底; 将烧结的多层陶瓷衬底浸入酸性溶液中; 并且激活硬烧结约束层和酸性溶液之间的接触，从而去除硬烧结约束层。

6. 发明申请

US20100051172A1 METHOD FOR MANUFACTURING CERAMIC GREEN SHEET AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CIRCUIT BOARD 审中-公开
标题翻译：制造陶瓷绿色板材的方法及制造多层陶瓷电路板的方法
公开(公告)号：US20100051172A1
公开(公告)日：2010-03-04
申请号：US12410013
申请日：2009-03-24
申请人： Yong Suk Kim , Yong Soo Oh , Byeung Gyu Chang , Yong Seok Choi , Hwan Soo Lee , Sang Moon Lee , Taek Jung Lee
发明人： Yong Suk Kim , Yong Soo Oh , Byeung Gyu Chang , Yong Seok Choi , Hwan Soo Lee , Sang Moon Lee , Taek Jung Lee
IPC分类号： B32B37/02 , B29C59/00
CPC分类号： B32B37/26 , B32B38/06 , B32B2037/268 , B32B2309/105 , B32B2315/02 , B32B2457/08 , H05K1/0306 , H05K3/0014 , H05K3/005 , H05K3/107 , H05K3/1258 , H05K3/4061 , H05K3/4614 , H05K3/4629 , H05K2203/0108
摘要： A method for manufacturing a ceramic green sheet includes providing a stamp having an imprinting surface on which a raised structure corresponding to a circuit pattern is formed, imprinting the stamp on the ceramic green sheet to form a depressed pattern in the ceramic green sheet, the depressed pattern being transferred from the raised structure, curing the ceramic green sheet with the stamp imprinted on the ceramic green sheet, separating the stamp from the ceramic green sheet, and providing the depressed pattern of the ceramic green sheet with the conductive material.
摘要翻译：一种陶瓷生片的制造方法，其特征在于，提供具有印刷面的印模，在其上形成与电路图案对应的凸起结构，将印模印在陶瓷生片上，在陶瓷生片中形成凹陷图案，图案从凸起结构转移，用印在陶瓷生片上的印模固化陶瓷生片，将印模与陶瓷生片分离，并将陶瓷生片的凹陷图形与导电材料一起提供。

7. 发明申请

US20070176302A1 Low temperature co-fired ceramic module and method of manufacturing the same 审中-公开
标题翻译：低温共烧陶瓷模块及其制造方法
公开(公告)号：US20070176302A1
公开(公告)日：2007-08-02
申请号：US11643693
申请日：2006-12-22
申请人： Tae Soo Lee , Yun Hwi Park , Taek Jung Lee
发明人： Tae Soo Lee , Yun Hwi Park , Taek Jung Lee
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H01L23/49811 , H01L23/15 , H01L24/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/09701 , H01L2924/14 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/0306 , H05K3/246 , H05K3/341 , H05K3/4611 , H05K3/4629 , H05K2201/0347 , H05K2201/10727 , H05K2201/10969 , Y02P70/613 , H01L2924/00
摘要： An LTCC module includes an LTCC substrate and a pad part formed on an undersurface of the LTCC substrate for mounting the LTCC substrate to an external substrate. The pad part includes a metal pad layer formed on an undersurface of the LTCC substrate and a solder layer formed on an undersurface of the metal pad layer.
摘要翻译： LTCC模块包括LTCC基板和形成在LTCC基板的下表面上的焊盘部分，用于将LTCC基板安装到外部基板。焊盘部分包括形成在LTCC衬底的下表面上的金属焊盘层和形成在金属焊盘层的下表面上的焊料层。

8. 发明授权

US08012778B2 LED package and fabricating method thereof 有权
标题翻译： LED封装及其制造方法
公开(公告)号：US08012778B2
公开(公告)日：2011-09-06
申请号：US12259576
申请日：2008-10-28
申请人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
发明人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
IPC分类号： H01L21/00
CPC分类号： H01L33/642 , H01L33/486 , H01L33/641 , H01L2224/16225
摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.
摘要翻译：本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。在LED封装中，准备在底面上具有至少一个沟槽的衬底。多个电极形成在基板的顶表面上。此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。此外，碳纳米管填料填充在基板的槽中。

9. 发明授权

US07453093B2 LED package and fabricating method thereof 有权
标题翻译： LED封装及其制造方法
公开(公告)号：US07453093B2
公开(公告)日：2008-11-18
申请号：US11489578
申请日：2006-07-20
申请人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
发明人： Yong Suk Kim , Young Soo Oh , Hyoung Ho Kim , Taek Jung Lee , Seog Moon Choi
IPC分类号： H01L27/15 , H01L23/34
CPC分类号： H01L33/642 , H01L33/486 , H01L33/641 , H01L2224/16225
摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.
摘要翻译：本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。在LED封装中，准备在底面上具有至少一个沟槽的衬底。多个电极形成在基板的顶表面上。此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。此外，碳纳米管填料填充在基板的槽中。

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