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    • 9. 发明申请
    • Electronic component
    • 电子元器件
    • US20090108253A1
    • 2009-04-30
    • US11989623
    • 2006-07-27
    • Andreas UllmannAlexander KnoblochMerlin WelkerWalter Fix
    • Andreas UllmannAlexander KnoblochMerlin WelkerWalter Fix
    • H01L51/10
    • H01L51/0002B82Y10/00H01L51/0036H01L51/0037H01L51/0047H01L51/0055H01L51/0097H01L51/0541H01L51/0545H01L2924/0002H01L2924/00
    • The invention relates to an electronic component comprising a flexible substrate, on the surface of which is arranged a layer stack composed of thin layers, containing at least one electrical functional layer composed of an electrically conductive or semiconducting material, wherein the component comprises at least a first material, a layered second material and a layered third material and wherein, as seen perpendicular to the surface of the substrate the first material is followed by the second material and the second material is followed by the third material, wherein a first adhesion force of the second material to the first material is lower than a second adhesion force of the third material to the first material and the second material has at least one opening, via which the third material is connected to the first material in order to increase the adhesion of the second material to the first material.
    • 本发明涉及一种电子部件,其包括柔性基板,其表面上布置有由薄层构成的层叠层,该堆叠层包含由导电或半导体材料构成的至少一个电功能层,其中所述部件包括至少一个 第一材料,层状第二材料和层状第三材料,并且其中,垂直于所述基材的表面观察所述第一材料后面是所述第二材料,所述第二材料之后是所述第三材料,其中第一粘合力 第一材料的第二材料低于第三材料与第一材料的第二粘附力,第二材料具有至少一个开口,第三材料通过该开口与第一材料连接,以增加第一材料的粘附力 第二种材料是第一种材料。