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    • 1. 发明申请
    • Pulse resonating device
    • 脉冲谐振装置
    • US20070114164A1
    • 2007-05-24
    • US11283655
    • 2005-11-21
    • Wilson BradleyJohn Lane
    • Wilson BradleyJohn Lane
    • C02F1/48
    • C02F1/487C02F2103/023C02F2201/483C02F2303/20C02F2303/22
    • A fluid treatment device including a source of electrical voltage having a first and second terminal, a pulse generator connected to the first terminal and the second terminal and outputting a pulsed voltage wave signal between a third terminal and a fourth terminal, at least one coil positioned adjacent at least one fluid conduit, being electrically connected to the third and fourth terminals and at least one capacitor also being electrically connected to the third and fourth terminals to form a first circuit with an inductance L, a capacitance C and a resonant frequency. The pulse generator is arranged to generate a pulsed voltage wave with a frequency approximately equal to the resonant frequency. A further circuit element is arranged to cause the voltage pulse reaching the coil to repeatedly, alternate between a period of pulsed voltage at the frequency and a period of zero voltage, with each period extending for a time in a range of approximately 2 to 33 milliseconds.
    • 一种流体处理装置,包括具有第一和第二端子的电压源,连接到第一端子和第二端子的脉冲发生器,并且在第三端子和第四端子之间输出脉冲电压波信号,至少一个线圈定位 相邻的至少一个流体导管,电连接到第三和第四端子,并且至少一个电容器还电连接到第三和第四端子,以形成具有电感L,电容C和谐振频率的第一电路。 脉冲发生器被布置成产生频率近似于谐振频率的脉冲电压波。 另外的电路元件被布置成使得电压脉冲重复到达线圈,在频率的一段脉冲电压和零电压周期之间交替,每个周期在大约2到33毫秒的范围内延长一段时间 。
    • 5. 发明授权
    • Method and apparatus for pressure control and flow measurement
    • 用于压力控制和流量测量的方法和装置
    • US07204155B2
    • 2007-04-17
    • US11475805
    • 2006-06-27
    • John LaneRalph H. M. StraubeChris Melcer
    • John LaneRalph H. M. StraubeChris Melcer
    • G01F1/00
    • H01J37/32449C23C16/45557C23C16/466H01J37/3244
    • A method and apparatus for gas control is provided. The apparatus may be used for controlling gases delivered to a chamber, controlling the chamber pressure, controlling the delivery of backside gas between a substrate and substrate support and the like. In one embodiment, an apparatus for controlling gas control includes at least a first flow sensor having a control valve, a first pressure sensor and at least a second pressure sensor. An inlet of the first flow sensor is adapted for coupling to a gas supply. A control valve is coupled to an outlet of the flow sensor. The first pressure sensor is adapted to sense a metric indicative of the pressure upstream of the first flow sensor. The second pressure sensor is adapted to sense a metric indicative of the pressure downstream of the control valve.
    • 提供了一种用于气体控制的方法和装置。 该装置可以用于控制输送到室的气体,控制室压力,控制衬底和衬底支撑件之间的背面气体的传送等。 在一个实施例中,用于控制气体控制的装置包括至少第一流量传感器,其具有控制阀,第一压力传感器和至少第二压力传感器。 第一流量传感器的入口适于联接到气体供应。 控制阀联接到流量传感器的出口。 第一压力传感器适于感测指示第一流量传感器上游的压力的度量。 第二压力传感器适于感测指示控制阀下游的压力的量度。
    • 6. 发明申请
    • Method and apparatus for treating fluids
    • 用于处理流体的方法和装置
    • US20070051685A1
    • 2007-03-08
    • US11304348
    • 2005-12-15
    • Kenneth WittmerWalter CrewsonJohn Lane
    • Kenneth WittmerWalter CrewsonJohn Lane
    • C02F1/48
    • C02F1/484C02F2201/4613C02F2201/483C02F2209/005C02F2303/22H03K3/57H03K17/79
    • A method and apparatus for treating a fluid to destroy, remove, or reduce undesirable agents, such as microorganisms, particles or ions, contained in the fluid and/or to inhibit the formation of scale are disclosed. The invention includes an apparatus for treating a fluid to destroy, remove, or reduce undesirable agents, such as microorganisms, particles, or ions, contained in the fluid and/or to inhibit the formation of scale. The apparatus can include an open fluid directional means or conduit. The preferred open fluid directional means is a conduit manufactured of resilient, corrosion-resistant material. The apparatus is attached to a power source and has a controller means. The controller means is desirably a microprocessor and can include a switching means for regulating the current to the apparatus. However, simpler circuits and components can be used for the controller means. The apparatus includes a field generating means. The field generating means forms a treatment field. The treatment field is a magnetic field and/or an electrical field in an effective dose sufficient to treat the fluid. The effective dose is determined by the exposure time(s) and strength(s) of the treatment field(s) and the concentration of contaminants present in the fluid subjected to the treatment.
    • 公开了一种用于处理流体以破坏,去除或减少包含在流体中的不期望的试剂,例如微生物,颗粒或离子和/或抑制水垢形成的方法和装置。 本发明包括一种用于处理流体以破坏,去除或减少包含在流体中的不期望的物质,例如微生物,颗粒或离子和/或抑制水垢形成的装置。 该装置可以包括开放的流体定向装置或导管。 优选的开放流体定向装置是由弹性的耐腐蚀材料制成的导管。 该装置附接到电源并具有控制装置。 控制器装置理想地是微处理器,并且可以包括用于调节到设备的电流的开关装置。 然而,更简单的电路和组件可以用于控制器装置。 该装置包括场产生装置。 场产生装置形成治疗场。 治疗场是具有足以治疗流体的有效剂量的磁场和/或电场。 有效剂量由处理场的暴露时间和强度以及存在于经受处理的流体中的污染物的浓度决定。
    • 10. 发明授权
    • Method and apparatus for enhancing a sputtering target's lifetime
    • 提高溅射靶的寿命的方法和装置
    • US06340415B1
    • 2002-01-22
    • US09002819
    • 1998-01-05
    • Ivo J. RaaijmakersRobert S. BusaccaJohn Lane
    • Ivo J. RaaijmakersRobert S. BusaccaJohn Lane
    • C23C1434
    • H01J37/3423C23C14/3407F28F3/12H01J37/3497
    • Sputtering target lifetime is enhanced by providing a sputtering target assembly wherein a sputtering target is mounted to a substantially compliant cooling cover plate. The cooling cover plate is preferably fabricated from a plastic, a polymer, or a composite polymer and is provided with a plurality of grooves which form cooling fluid passages when the sputtering target is mounted to the cooling cover plate. These cooling fluid passages may be used to cool the target during sputtering. Because the cooling cover plate is substantially compliant, the sputtering target is free to bow in order to relieve any thermally induced strain produced within the sputtering target during sputtering. The lifetime of the sputtering target is thereby enhanced as both strain induced defect propagation/migration within the sputtering target, and the likelihood of sputtering target/cooling cover plate delamination are reduced.
    • 通过提供溅射靶组件来增强溅射靶寿命,其中将溅射靶安装到基本顺从的冷却盖板上。 冷却盖板优选由塑料,聚合物或复合聚合物制成,并且当溅射靶安装到冷却盖板上时,设置有形成冷却流体通道的多个槽。 这些冷却流体通道可用于在溅射期间冷却靶。 由于冷却盖板基本上是顺从的,所以溅射靶是自由的,以便在溅射期间减轻在溅射靶内产生的任何热诱导应变。 由于溅射靶内的应变引起的缺陷传播/迁移以及溅射靶/冷却盖板分层的可能性都降低,溅射靶的寿命因此得到提高。