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    • 10. 发明授权
    • Method for making ferroelectric semiconductor device
    • 制造铁电半导体器件的方法
    • US6020213A
    • 2000-02-01
    • US69244
    • 1998-04-29
    • William J. OomsJerald A. HallmarkDaniel S. Marshall
    • William J. OomsJerald A. HallmarkDaniel S. Marshall
    • H01L29/78H01L21/00
    • H01L29/78391
    • A ferroelectric semiconductor device (10) and a method of manufacturing the ferroelectric semiconductor device (10). The ferroelectric semiconductor device (10) has a layer (13) of ferroelectric material disposed on a semiconductor substrate (11) and a gate electrode (17) formed on a portion (26) of the layer (13) of ferroelectric material. The portion (26) of the layer (13) of ferroelectric material sandwiched between a semiconductor substrate (11) and a gate electrode (17) retains its ferroelectric activity. The portions (21, 22) of the layer (13) of ferroelectric material adjacent the portion (26) are damaged and thereby rendered ferroelectrically inactive. A source contact (31) and a drain contact (32) are formed through the damaged portions (21, 22) of the layer (13) of ferroelectric material.
    • 铁电半导体器件(10)和制造铁电半导体器件(10)的方法。 铁电半导体装置(10)具有设置在半导体基板(11)上的铁电体层(13)和形成在铁电体层(13)的部分(26)上的栅电极(17)。 夹在半导体衬底(11)和栅电极(17)之间的铁电材料层(13)的部分(26)保持其铁电活性。 邻近部分(26)的铁电材料层(13)的部分(21,22)被损坏,从而变成铁电非活性的。 通过铁电材料层(13)的损坏部分(21,22)形成源极触点(31)和漏极触点(32)。