专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09337054B2 Precursors for silicon dioxide gap fill 有权
标题翻译：二氧化硅填充前体
公开(公告)号：US09337054B2
公开(公告)日：2016-05-10
申请号：US12665929
申请日：2008-06-27
申请人： William Hunks , Chongying Xu , Bryan C. Hendrix , Jeffrey F. Roeder , Steven M. Bilodeau , Weimin Li
发明人： William Hunks , Chongying Xu , Bryan C. Hendrix , Jeffrey F. Roeder , Steven M. Bilodeau , Weimin Li
IPC分类号： H01L21/316 , H01L21/02
CPC分类号： H01L21/02211 , H01L21/02123 , H01L21/02164 , H01L21/02216 , H01L21/02222 , H01L21/02263 , H01L21/31604 , H01L21/31608 , H01L29/0649
摘要： A full fill trench structure is described, including a microelectronic device substrate having a high aspect ratio trench therein and filled with silicon dioxide of a substantially void-free character and substantially uniform density throughout its bulk mass. A method of manufacturing a semiconductor product also is described, involving use of specific silicon precursor compositions for forming substantially void-free and substantially uniform density silicon dioxide material in the trench. The precursor fill composition may include silicon and germanium, to produce a microelectronic device structure including a GeO2/SiO2 trench fill material. A suppressor component may be employed in the precursor fill composition, to eliminate or minimize seam formation in the cured trench fill material.
摘要翻译：描述了一种全填充沟槽结构，其包括其中具有高纵横比沟槽的微电子器件衬底，并填充了其整个整体质量基本上无空隙特征和基本均匀密度的二氧化硅。还描述了制造半导体产品的方法，其涉及使用特定的硅前体组合物，用于在沟槽中形成基本上无空隙且基本均匀的密度二氧化硅材料。前体填充组合物可以包括硅和锗，以产生包括GeO 2 / SiO 2沟槽填充材料的微电子器件结构。可以在前体填充组合物中使用抑制剂组分，以消除或最小化固化沟槽填充材料中的接缝形成。

2. 发明申请

US20100164057A1 PRECURSORS FOR SILICON DIOXIDE GAP FILL 有权
标题翻译：硅二氧化硅填料的前身
公开(公告)号：US20100164057A1
公开(公告)日：2010-07-01
申请号：US12665929
申请日：2008-06-27
申请人： William Hunks , Chongying Xu , Bryan C. Hendrix , Jeffrey F. Roeder , Steven M. Bilodeau , Weimin Li
发明人： William Hunks , Chongying Xu , Bryan C. Hendrix , Jeffrey F. Roeder , Steven M. Bilodeau , Weimin Li
IPC分类号： H01L29/06 , C09D7/00 , H01L21/762
CPC分类号： H01L21/02211 , H01L21/02123 , H01L21/02164 , H01L21/02216 , H01L21/02222 , H01L21/02263 , H01L21/31604 , H01L21/31608 , H01L29/0649
摘要： A full fill trench structure comprising a microelectronic device substrate having a high aspect ratio trench therein and a full filled mass of silicon dioxide in the trench, wherein the silicon dioxide is of a substantially void-free character and has a substantially uniform density throughout its bulk mass. A corresponding method of manufacturing a semiconductor product is described, involving use of specific silicon precursor compositions for use in full filling a trench of a microelectronic device substrate, in which the silicon dioxide precursor composition is processed to conduct hydrolysis and condensation reactions for forming the substantially void-free and substantially uniform density silicon dioxide material in the trench. The fill process may be carried out with a precursor fill composition including silicon and germanium, to produce a microelectronic device structure including a GeO2/SiO2 trench fill material. A suppressor component, e.g., methanol, may be employed in the precursor fill composition, to eliminate or minimize seam formation in the cured trench fill material.
摘要翻译：一种全填充沟槽结构，其包括其中具有高纵横比沟槽的微电子器件衬底和沟槽中的完整填充质量的二氧化硅，其中二氧化硅具有基本上无空隙的特性，并且在其整个体积中具有基本均匀的密度质量描述了制造半导体产品的相应方法，其涉及使用特定的硅前体组合物，用于完全填充微电子器件衬底的沟槽，其中二氧化硅前体组合物被处理以进行水解和缩合反应，以形成基本上在沟槽中的无空隙和基本均匀的密度二氧化硅材料。填充过程可以用包括硅和锗的前体填充组合物进行，以产生包括GeO 2 / SiO 2沟槽填充材料的微电子器件结构。可以在前体填充组合物中使用抑制剂组分，例如甲醇，以消除或最小化固化沟槽填充材料中的接缝形成。

3. 发明授权

US08268665B2 Antimony and germanium complexes useful for CVD/ALD of metal thin films 有权
标题翻译：用于金属薄膜的CVD / ALD的锑和锗络合物
公开(公告)号：US08268665B2
公开(公告)日：2012-09-18
申请号：US13168979
申请日：2011-06-26
申请人： William Hunks , Tianniu Chen , Chongying Xu , Jeffrey F. Roeder , Thomas H. Baum , Matthias Stender , Philip S. H. Chen , Gregory T. Stauf , Bryan C. Hendrix
发明人： William Hunks , Tianniu Chen , Chongying Xu , Jeffrey F. Roeder , Thomas H. Baum , Matthias Stender , Philip S. H. Chen , Gregory T. Stauf , Bryan C. Hendrix
IPC分类号： H01L21/06
CPC分类号： H01L45/1616 , C07C251/08 , C07F7/003 , C07F7/10 , C07F7/28 , C07F9/90 , C07F9/902 , C07F17/00 , C23C16/18 , C23C16/305 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/1683
摘要： Antimony, germanium and tellurium precursors useful for CVD/ALD of corresponding metal-containing thin films are described, along with compositions including such precursors, methods of making such precursors, and films and microelectronic device products manufactured using such precursors, as well as corresponding manufacturing methods. The precursors of the invention are useful for forming germanium-antimony-tellurium (GST) films and microelectronic device products, such as phase change memory devices, including such films.
摘要翻译：描述了可用于相应的含金属薄膜的CVD / ALD的锑，锗和碲前体，以及包含这些前体的组合物，制备这些前体的方法，以及使用这种前体制备的膜和微电子器件产品，以及相应的制造方法。本发明的前体可用于形成锗 - 锑 - 碲（GST）膜和微电子器件产品，例如包括这种膜的相变存储器件。

4. 发明授权

US08008117B2 Antimony and germanium complexes useful for CVD/ALD of metal thin films 有权
标题翻译：用于金属薄膜的CVD / ALD的锑和锗络合物
公开(公告)号：US08008117B2
公开(公告)日：2011-08-30
申请号：US12860906
申请日：2010-08-22
申请人： William Hunks , Tianniu Chen , Chongying Xu , Jeffrey F. Roeder , Thomas H. Baum , Melissa A. Petruska , Matthias Stender , Philip S. H. Chen , Gregory T. Stauf , Bryan C. Hendrix
发明人： William Hunks , Tianniu Chen , Chongying Xu , Jeffrey F. Roeder , Thomas H. Baum , Melissa A. Petruska , Matthias Stender , Philip S. H. Chen , Gregory T. Stauf , Bryan C. Hendrix
IPC分类号： H01L21/06
CPC分类号： H01L45/1616 , C07C251/08 , C07F7/003 , C07F7/10 , C07F7/28 , C07F9/90 , C07F9/902 , C07F17/00 , C23C16/18 , C23C16/305 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/1683
摘要： Antimony, germanium and tellurium precursors useful for CVD/ALD of corresponding metal-containing thin films are described, along with compositions including such precursors, methods of making such precursors, and films and microelectronic device products manufactured using such precursors, as well as corresponding manufacturing methods. The precursors of the invention are useful for forming germanium-antimony-tellurium (GST) films and microelectronic device products, such as phase change memory devices, including such films.
摘要翻译：描述了可用于相应的含金属薄膜的CVD / ALD的锑，锗和碲前体，以及包含这些前体的组合物，制备这些前体的方法，以及使用这种前体制备的膜和微电子器件产品，以及相应的制造方法。本发明的前体可用于形成锗 - 锑 - 碲（GST）膜和微电子器件产品，例如包括这种膜的相变存储器件。

5. 发明申请

US20100279011A1 NOVEL BISMUTH PRECURSORS FOR CVD/ALD OF THIN FILMS 审中-公开
标题翻译：用于薄膜CVD / ALD的新型双面前驱物
公开(公告)号：US20100279011A1
公开(公告)日：2010-11-04
申请号：US12740992
申请日：2008-10-31
申请人： Tianniu Chen , Chongying Xu , Bryan C. Hendrix , William Hunks , Thomas M. Cameron , Matthias Stender , Gregory T. Stauf , Jeffrey F. Roeder
发明人： Tianniu Chen , Chongying Xu , Bryan C. Hendrix , William Hunks , Thomas M. Cameron , Matthias Stender , Gregory T. Stauf , Jeffrey F. Roeder
IPC分类号： C23C16/18 , C07F9/94 , C07F7/08 , C09D4/00
CPC分类号： C07F9/94
摘要： Bismuth precursors having utility for forming highly conformal bismuth-containing films by low temperature (
摘要翻译：铋前体可用于通过低温（<300℃）气相沉积方法如CVD和ALD形成高保形含铋的膜，包括氨基铋，胍铋酸盐，异钌酸铋，氨基甲酸铋和硫代氨基甲酸铋，铋β- 二酮酸酯，二酮基铋，二酮亚胺铋，铋烯丙基酯，环戊二烯基铋，烷基铋，醇铋，铋配合物的铋甲硅烷基，铋甲硅烷基酰胺，铋螯合酰胺和铋二碲酰亚氨基二膦酸铋。还描述了制备这种前体的方法，以及适用于制造微电子器件产品的这种前体的包装形式。这些铋前体有利地用于形成含铋的膜，例如GBT，Bi2Te3，Bi4Ti3O12，SrBi2Ta2O9，Bi-Ta-O，BiP和含有铋的含铋膜的膜。

6. 发明申请

US20130029456A1 ANTIMONY AND GERMANIUM COMPLEXES USEFUL FOR CVD/ALD OF METAL THIN FILMS 有权
公开(公告)号：US20130029456A1
公开(公告)日：2013-01-31
申请号：US13622233
申请日：2012-09-18
申请人： William Hunks , Tianniu Chen , Chongying Xu , Jeffrey F. Roeder , Thomas H. Baum , Matthias Stender , Philip S.H. Chen , Gregory T. Stauf , Bryan C. Hendrix
发明人： William Hunks , Tianniu Chen , Chongying Xu , Jeffrey F. Roeder , Thomas H. Baum , Matthias Stender , Philip S.H. Chen , Gregory T. Stauf , Bryan C. Hendrix
IPC分类号： H01L45/00
CPC分类号： H01L45/1616 , C07C251/08 , C07F7/003 , C07F7/10 , C07F7/28 , C07F9/90 , C07F9/902 , C07F17/00 , C23C16/18 , C23C16/305 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/1683
摘要： Antimony, germanium and tellurium precursors useful for CVD/ALD of corresponding metal-containing thin films are described, along with compositions including such precursors, methods of making such precursors, and films and microelectronic device products manufactured using such precursors, as well as corresponding manufacturing methods. The precursors of the invention are useful for forming germanium-antimony-tellurium (GST) films and microelectronic device products, such as phase change memory devices, including such films.

7. 发明授权

US07838329B2 Antimony and germanium complexes useful for CVD/ALD of metal thin films 有权
标题翻译：用于金属薄膜的CVD / ALD的锑和锗络合物
公开(公告)号：US07838329B2
公开(公告)日：2010-11-23
申请号：US12307101
申请日：2007-05-12
申请人： William Hunks , Tianniu Chen , Chongying Xu , Jeffrey F. Roeder , Thomas H. Baum , Melissa A. Petruska , Matthias Stender , Philip S. H. Chen , Gregory T. Stauf , Bryan C. Hendrix
发明人： William Hunks , Tianniu Chen , Chongying Xu , Jeffrey F. Roeder , Thomas H. Baum , Melissa A. Petruska , Matthias Stender , Philip S. H. Chen , Gregory T. Stauf , Bryan C. Hendrix
IPC分类号： H01L21/06
CPC分类号： H01L45/1616 , C07C251/08 , C07F7/003 , C07F7/10 , C07F7/28 , C07F9/90 , C07F9/902 , C07F17/00 , C23C16/18 , C23C16/305 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/1683
摘要： Antimony, germanium and tellurium precursors useful for CVD/ALD of corresponding metal-containing thin films are described, along with compositions including such precursors, methods of making such precursors, and films and microelectronic device products manufactured using such precursors, as well as corresponding manufacturing methods. The precursors of the invention are useful for forming germanium-antimony-tellurium (GST) films and microelectronic device products, such as phase change memory devices, including such films.
摘要翻译：描述了可用于相应的含金属薄膜的CVD / ALD的锑，锗和碲前体，以及包含这些前体的组合物，制备这些前体的方法，以及使用这种前体制备的膜和微电子器件产品，以及相应的制造方法。本发明的前体可用于形成锗 - 锑 - 碲（GST）膜和微电子器件产品，例如包括这种膜的相变存储器件。

8. 发明申请

US20090124039A1 LOW TEMPERATURE DEPOSITION OF PHASE CHANGE MEMORY MATERIALS 有权
标题翻译：相变记忆材料的低温沉积
公开(公告)号：US20090124039A1
公开(公告)日：2009-05-14
申请号：US12300459
申请日：2007-03-12
申请人： Jeffrey F. Roeder , Thomas H. Baum , Bryan C. Hendrix , Gregory T. Stauf , Chongying Xu , William Hunks , Tianniu Chen , Matthias Stender
发明人： Jeffrey F. Roeder , Thomas H. Baum , Bryan C. Hendrix , Gregory T. Stauf , Chongying Xu , William Hunks , Tianniu Chen , Matthias Stender
IPC分类号： H01L51/30 , H01L21/06 , C07D401/02 , C07F7/30 , C07F7/08
CPC分类号： H01L51/0002 , C07F7/30 , C23C16/305 , C23C16/45553
摘要： A system and method for forming a phase change memory material on a substrate, in which the substrate is contacted with precursors for a phase change memory chalcogenide alloy under conditions producing deposition of the chalcogenide alloy on the substrate, at temperature below 350° C. with the contacting being carried out via chemical vapor deposition or atomic layer deposition. Various tellurium, germanium and germanium-tellurium precursors are described, which are useful for forming GST phase change memory films on substrates.
摘要翻译：一种用于在基板上形成相变记忆材料的系统和方法，其中在温度低于350℃的条件下，在产生硫属化物合金沉积的条件下，在温度低于350℃的条件下，基板与相变存储器硫族化合物的前体接触，通过化学气相沉积或原子层沉积进行接触。描述了各种碲，锗和锗 - 碲前体，其可用于在基底上形成GST相变记忆膜。

9. 发明申请

US20090305458A1 ANTIMONY AND GERMANIUM COMPLEXES USEFUL FOR CVD/ALD OF METAL THIN FILMS 有权
标题翻译：用于金属薄膜CVD / ALD的抗反应和锗复合物
公开(公告)号：US20090305458A1
公开(公告)日：2009-12-10
申请号：US12307101
申请日：2007-03-12
申请人： William Hunks , Tianniu Chen , Chongying Xu , Jeffrey F. Roeder , Thomas H. Baum , Melissa A. Petruska , Matthias Stender , Philip S.H. Chen , Gregory T. Stauf , Bryan C. Hendrix
发明人： William Hunks , Tianniu Chen , Chongying Xu , Jeffrey F. Roeder , Thomas H. Baum , Melissa A. Petruska , Matthias Stender , Philip S.H. Chen , Gregory T. Stauf , Bryan C. Hendrix
IPC分类号： H01L21/06 , C07F7/30 , C09D5/00
CPC分类号： H01L45/1616 , C07C251/08 , C07F7/003 , C07F7/10 , C07F7/28 , C07F9/90 , C07F9/902 , C07F17/00 , C23C16/18 , C23C16/305 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/1683
摘要： Antimony, germanium and tellurium precursors useful for CVD/ALD of corresponding metal-containing thin films are described, along with compositions including such precursors, methods of making such precursors, and films and microelectronic device products manufactured using such precursors, as well as corresponding manufacturing methods. The precursors of the invention are useful for forming germanium-antimony-tellurium (GST) films and microelectronic device products, such as phase change memory devices, including such films.
摘要翻译：描述了可用于相应的含金属薄膜的CVD / ALD的锑，锗和碲前体，以及包含这些前体的组合物，制备这些前体的方法，以及使用这种前体制备的膜和微电子器件产品，以及相应的制造方法。本发明的前体可用于形成锗 - 锑 - 碲（GST）膜和微电子器件产品，例如包括这种膜的相变存储器件。

10. 发明授权

US08679894B2 Low temperature deposition of phase change memory materials 失效
公开(公告)号：US08679894B2
公开(公告)日：2014-03-25
申请号：US13610928
申请日：2012-09-12
申请人： Jeffrey F. Roeder , Thomas H. Baum , Bryan C. Hendrix , Gregory T. Stauf , Chongying Xu , William Hunks , Tianniu Chen , Matthias Stender
发明人： Jeffrey F. Roeder , Thomas H. Baum , Bryan C. Hendrix , Gregory T. Stauf , Chongying Xu , William Hunks , Tianniu Chen , Matthias Stender
IPC分类号： H01L51/40
CPC分类号： H01L51/0002 , C07F7/30 , C23C16/305 , C23C16/45553
摘要： A system and method for forming a phase change memory material on a substrate, in which the substrate is contacted with precursors for a phase change memory chalcogenide alloy under conditions producing deposition of the chalcogenide alloy on the substrate, at temperature below 350° C., with the contacting being carried out via chemical vapor deposition or atomic layer deposition. Various tellurium, germanium and germanium-tellurium precursors are described, which are useful for forming GST phase change memory films on substrates.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式