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1. 发明授权

US07719108B2 Enhanced reliability semiconductor package 有权
标题翻译：增强可靠性半导体封装
公开(公告)号：US07719108B2
公开(公告)日：2010-05-18
申请号：US11032526
申请日：2005-01-10
申请人： William E. Murphy , Ryan S. Riegle , Richard Shields , David L. Vos
发明人： William E. Murphy , Ryan S. Riegle , Richard Shields , David L. Vos
IPC分类号： H01L27/00
CPC分类号： H05K1/0209 , B23K1/0016 , B23K2101/40 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K3/341 , H05K2201/09781 , H05K2201/10689 , H05K2201/10734 , H05K2201/10969 , Y02P70/613 , H01L2224/0401
摘要： A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.
摘要翻译：公开了一种用印刷线路板封装半导体部件的方法。该方法包括确定第一距离，将薄膜施加到半导体部件的表面上，使得薄膜与半导体的支撑体间隔开，将焊盘焊接到印刷线路板上，将半导体部件放置在将薄膜贴到印刷电路板上，并将薄膜定位在焊盘附近。

2. 发明授权

US07670877B2 Reliability enhancement process 有权
标题翻译：可靠性增强过程
公开(公告)号：US07670877B2
公开(公告)日：2010-03-02
申请号：US11873146
申请日：2007-10-16
申请人： William E. Murphy , Ryan S. Riegle , Richard W. Shields , David L. Vos
发明人： William E. Murphy , Ryan S. Riegle , Richard W. Shields , David L. Vos
IPC分类号： H01L21/00
CPC分类号： H05K1/0209 , B23K1/0016 , B23K2101/40 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K3/341 , H05K2201/09781 , H05K2201/10689 , H05K2201/10734 , H05K2201/10969 , Y02P70/613 , H01L2224/0401
摘要： A method of packaging a semiconductor component with a printed wiring board is disclosed. The method includes determining a first distance, applying a thin film onto a surface of the semiconductor component such that the thin film is spaced apart from a support of the semiconductor, applying a solder pad onto the printed wiring board, placing the semiconductor component with the thin film onto the printed wiring board, and positioning the thin film adjacent the solder pad.
摘要翻译：公开了一种用印刷线路板封装半导体部件的方法。该方法包括确定第一距离，将薄膜施加到半导体部件的表面上，使得薄膜与半导体的支撑体间隔开，将焊盘焊接到印刷线路板上，将半导体部件放置在将薄膜贴到印刷电路板上，并将薄膜定位在焊盘附近。

3. 发明授权

US07719828B2 Rugged hard disk drive storage assembly 有权
标题翻译：坚固的硬盘驱动器存储组件
公开(公告)号：US07719828B2
公开(公告)日：2010-05-18
申请号：US11491296
申请日：2006-07-22
申请人： Jonathan M. Brown , Gary Deaton , Ryan S. Riegle
发明人： Jonathan M. Brown , Gary Deaton , Ryan S. Riegle
IPC分类号： H05K5/00 , H05K7/00
CPC分类号： G11B33/08 , G06F1/187
摘要： A rugged hard disk drive storage assembly is disclosed. The rugged hard disk drive storage assembly includes an enclosure capable of containing multiple hard disk drives. The enclosure also contains multiple shock and vibration absorbers that are configured to elastically support all the hard disk drives contained within the enclosure. The multiple shock absorbers protect the delicate electronic hard disk drives and their sensitive information from shock and vibration damage, even when the enclosure has been removed from the drive container, and is being carried away by personal in a harsh combat environment. In addition, the enclosure is hermetically sealed such that the hard disk drives are isolated from external environment.
摘要翻译：公开了一种坚固的硬盘驱动器存储组件。坚固的硬盘驱动器存储组件包括能够容纳多个硬盘驱动器的机箱。外壳还包含多个冲击和振动吸收器，其配置为弹性地支撑包含在外壳内的所有硬盘驱动器。多个减震器可保护精密的电子硬盘驱动器及其敏感信息免受冲击和振动损坏，即使外壳已从驱动器容器中取出，并在恶劣的作战环境中被个人携带。此外，外壳是密封的，使得硬盘驱动器与外部环境隔离。

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