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1. 发明申请

US20050151268A1 Wafer-level assembly method for chip-size devices having flipped chips 审中-公开
标题翻译：具有翻转芯片的芯片尺寸器件的晶片级组装方法
公开(公告)号：US20050151268A1
公开(公告)日：2005-07-14
申请号：US10826713
申请日：2004-04-16
申请人： William Boyd , Chris Haga , Anthony Coyle , Leland Swanson , Quang Mai
发明人： William Boyd , Chris Haga , Anthony Coyle , Leland Swanson , Quang Mai
IPC分类号： H01L23/31 , H01L23/495 , H01L21/48 , H01L29/40
CPC分类号： H01L23/3114 , H01L23/4951 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/94 , H01L2224/05001 , H01L2224/05022 , H01L2224/05027 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05181 , H01L2224/05184 , H01L2224/05572 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/05671 , H01L2224/05681 , H01L2224/05684 , H01L2224/13019 , H01L2224/13082 , H01L2224/13099 , H01L2224/16245 , H01L2224/73253 , H01L2224/81193 , H01L2224/94 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2224/81 , H01L2924/00 , H01L2924/00014
摘要： A method for assembling a whole semiconductor wafer (101) with a plurality of device units (120) having metal contact pads. Each contact pad has a patterned barrier metal layer and a metal stud (103, preferably copper or nickel) with an outer surface suitable to form metallurgical bonds without melting. A leadframe suitable for the whole wafer is provided, which has a plurality of segments groups (102), each group suitable for one device unit; each segment has first (102a) and second ends (102b) covered by solderable metal. A predetermined amount of solder paste (104) is placed on each of the first segment ends. The leadframe is then aligned with the wafer so that each of the paste-covered segment ends is aligned with the corresponding metal stud of the respective device unit. The leadframe is connected to the wafer and the whole wafer is encapsulated (105) so that the device units and the first segment ends are covered, while the second segment ends remain exposed. The encapsulated wafer is separated (110) into individual device units (120).
摘要翻译：一种用于将整个半导体晶片（101）与具有金属接触焊盘的多个器件单元（120）组装的方法。每个接触垫具有图案化的阻挡金属层和金属螺柱（103，优选铜或镍），其外表面适于形成冶金结合而不熔化。提供了适用于整个晶片的引线框架，其具有多个段组（102），每个组适合于一个设备单元; 每个段具有由可焊接金属覆盖的第一（102a）和第二端（102b）。将预定量的焊膏（104）放置在每个第一段末端上。然后将引线框架与晶片对准，使得每个糊状覆盖的段端部与相应的器件单元的相应的金属钉对准。引线框架连接到晶片，并且整个晶片被封装（105），使得器件单元和第一段端部被覆盖，而第二段端部保持暴露。将封装的晶片分离成单独的器件单元（120）。

2. 发明申请

US20050280124A1 Semiconductor package having integrated metal parts for thermal enhancement 失效
标题翻译：具有用于热增强的集成金属部件的半导体封装
公开(公告)号：US20050280124A1
公开(公告)日：2005-12-22
申请号：US10871645
申请日：2004-06-18
申请人： Anthony Coyle , William Boyd , Chris Haga , Leland Swanson
发明人： Anthony Coyle , William Boyd , Chris Haga , Leland Swanson
IPC分类号： H01L23/433 , H01L23/495
CPC分类号： H01L23/4334 , H01L24/48 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device comprising a metallic leadframe (103) with a first surface (103a) and a second surface (103b). The leadframe includes a chip pad (104) and a plurality of segments (107); the chip pad is held by a plurality of straps (105), wherein each strap has a groove (106). A chip (101) is mounted on the chip pad and electrically connected to the segments. A heat spreader (110) is disposed on the first surface of the leadframe; the heat spreader has its central portion (110a) spaced above the chip connections (108), and also has positioning members (110b) extending outwardly from the edges of the central portion so that they rest in the grooves of the straps. Encapsulation material surrounds the chip, the electrical connections, and the spreader positioning members, and fills the space between the spreader and the chip, while leaving the second leadframe surface and the central spreader portion exposed.
摘要翻译：一种半导体器件，包括具有第一表面（103a）和第二表面（103b）的金属引线框架（103）。引线框架包括芯片焊盘（104）和多个段（107）; 芯片垫由多个带（105）保持，其中每个带具有凹槽（106）。芯片（101）安装在芯片焊盘上并电连接到段上。散热器（110）设置在引线框架的第一表面上; 散热器具有在芯片连接件（108）上方间隔开的中心部分（110a），并且还具有从中心部分的边缘向外延伸的定位构件（110b），使得它们搁置在带的凹槽中。封装材料围绕芯片，电连接和扩展器定位构件，并且填充扩展器和芯片之间的空间，同时使第二引线框表面和中心扩展器部分露出。

3. 发明申请

US20060226521A1 Semiconductor Package Having Integrated Metal Parts for Thermal Enhancement 审中-公开
标题翻译：具有集成金属部件用于热增强的半导体封装
公开(公告)号：US20060226521A1
公开(公告)日：2006-10-12
申请号：US11426166
申请日：2006-06-23
申请人： Anthony Coyle , William Boyd , Chris Haga , Leland Swanson
发明人： Anthony Coyle , William Boyd , Chris Haga , Leland Swanson
IPC分类号： H01L23/495
CPC分类号： H01L23/4334 , H01L24/48 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device comprising a metallic leadframe (103) with a first surface (103a) and a second surface (103b). The leadframe includes a chip pad (104) and a plurality of segments (107); the chip pad is held by a plurality of straps (105), wherein each strap has a groove (106). A chip (101) is mounted on the chip pad and electrically connected to the segments. A heat spreader (110) is disposed on the first surface of the leadframe; the heat spreader has its central portion (110a) spaced above the chip connections (108), and also has positioning members (110b) extending outwardly from the edges of the central portion so that they rest in the grooves of the straps. Encapsulation material surrounds the chip, the electrical connections, and the spreader positioning members, and fills the space between the spreader and the chip, while leaving the second leadframe surface and the central spreader portion exposed.
摘要翻译：一种半导体器件，包括具有第一表面（103a）和第二表面（103b）的金属引线框架（103）。引线框架包括芯片焊盘（104）和多个段（107）; 芯片垫由多个带（105）保持，其中每个带具有凹槽（106）。芯片（101）安装在芯片焊盘上并电连接到段上。散热器（110）设置在引线框架的第一表面上; 散热器具有在芯片连接件（108）上方间隔开的中心部分（110a），并且还具有从中心部分的边缘向外延伸的定位构件（110b），使得它们搁置在带的凹槽中。封装材料围绕芯片，电连接和扩展器定位构件，并且填充扩展器和芯片之间的空间，同时使第二引线框表面和中心扩展器部分露出。

4. 发明申请

US20050230842A1 Multi-chip flip package with substrate for inter-die coupling 审中-公开
标题翻译：具有用于晶片间耦合的衬底的多芯片翻转封装
公开(公告)号：US20050230842A1
公开(公告)日：2005-10-20
申请号：US10827836
申请日：2004-04-20
申请人： Leland Swanson , William Boyd
发明人： Leland Swanson , William Boyd
IPC分类号： H01L23/48 , H01L23/495 , H01L23/498 , H01L25/065 , H01L25/16
CPC分类号： H01L25/0655 , H01L23/49575 , H01L23/49861 , H01L25/162 , H01L2224/16145 , H01L2224/16227 , H01L2224/16245 , H01L2224/32245 , H01L2224/73253 , H01L2924/15153 , H01L2924/15192
摘要： A method comprising coupling a substrate interconnect to a substrate pad, attaching at least two flip chips to said substrate interconnect to electrically connect together said chips, and coupling at least one lead to each of the chips.
摘要翻译：一种方法，包括将衬底互连件耦合到衬底焊盘，将至少两个倒装芯片附接到所述衬底互连以将所述芯片电连接在一起，以及将至少一个引线耦合到每个芯片。

5. 发明申请

US20070168567A1 System and method for file based I/O directly between an application instance and an I/O adapter 审中-公开
标题翻译：应用程序实例和I / O适配器之间的基于文件的I / O的系统和方法
公开(公告)号：US20070168567A1
公开(公告)日：2007-07-19
申请号：US11216736
申请日：2005-08-31
申请人： William Boyd , John Hufferd , Agustin Mena, , Renato Recio , Madeline Vega
发明人： William Boyd , John Hufferd , Agustin Mena, , Renato Recio , Madeline Vega
IPC分类号： G06F3/00
CPC分类号： G06F9/544 , G06F9/546 , G06F2209/548
摘要： A system, method, and computer program product that enables user space middleware or applications to pass file name based storage requests directly to a physical I/O adapter without run-time involvement from the local Operating System (OS) are provided. A mechanism is provided for using a file protection table (FPT) data structure, which may include a file name protection table (FNPT) and file extension protection table (FEPT), to control user space and out of user space Input/Output (I/O) operations. In addition, a doorbell message and processing queue mechanism are provided for notifying the I/O adapter of work requests to be processed by the I/O adapter.
摘要翻译：提供了一种系统，方法和计算机程序产品，可使用户空间中间件或应用程序将基于文件名的存储请求直接传递到物理I / O适配器，而无需本地操作系统（OS）的运行时间参与。提供了一种用于使用文件保护表（FPT）数据结构的机制，其可以包括文件名保护表（FNPT）和文件扩展保护表（FEPT），以控制用户空间和用户空间输入/输出（I / O）操作。另外，提供了门铃消息和处理队列机制，用于通知I / O适配器要由I / O适配器处理的工作请求。

6. 发明申请

US20070165596A1 Creation and management of routing table for PCI bus address based routing with integrated DID 审中-公开
标题翻译：基于PCI总线地址的路由表的创建和管理，集成了DID
公开(公告)号：US20070165596A1
公开(公告)日：2007-07-19
申请号：US11334678
申请日：2006-01-18
申请人： William Boyd , Douglas Freimuth , William Holland , Steven Hunter , Renato Recio , Steven Thurber , Madeline Vega
发明人： William Boyd , Douglas Freimuth , William Holland , Steven Hunter , Renato Recio , Steven Thurber , Madeline Vega
IPC分类号： H04L12/28 , H04L12/56
CPC分类号： G06F13/4022 , H04L45/00 , H04L45/54
摘要： A method is provided for creating and managing tables for routing packets through an environment that includes multiple hosts and shared PCI switches and adapters. A Destination Identification (DID) field in the PBA is appended to a transaction packet dispatched through the PCI switches, wherein a particular DID is associated with a particular host or system image, and thus identifies the physical or virtual end point of its packet. In one embodiment, packets are routed through PCI switches in a distributed computer system comprising multiple root nodes, wherein each root node includes one or more hosts. The embodiment includes the step of creating a table or like data structure in a specified one of the switches. When a particular host of one of the root nodes becomes connected to the specified switch, a PCI Configuration Master (PCM), residing in one of the root nodes, is operated to enter a destination identifier or DID into the table. The DID is then appended as an address component, to packets directed through the specified switch from the particular host to one of the adapters. The destination identifier is also used to determine that a PCI packet, routed through the specified switch from one of the adapters, is intended for the particular root node.
摘要翻译：提供了一种创建和管理表以通过包括多个主机和共享PCI交换机和适配器的环境路由数据包的方法。 PBA中的目的地标识（DID）字段附加到通过PCI交换机分派的事务分组，其中特定的DID与特定主机或系统映像相关联，并且因此标识其分组的物理或虚拟终点。在一个实施例中，分组通过包括多个根节点的分布式计算机系统中的PCI交换机路由，其中每个根节点包括一个或多个主机。该实施例包括在指定的一个开关中创建表或类似数据结构的步骤。当一个根节点的特定主机连接到指定的交换机时，驻留在其中一个根节点的PCI配置主机（PCM）被操作以在表中输入目的地标识符或DID。然后，将DID作为地址组件附加到通过指定的交换机从特定主机引导到其中一个适配器的数据包。目的地标识符还用于确定通过指定交换机从其中一个适配器路由的PCI数据包是针对特定根节点的。

7. 发明申请

US20070078892A1 System and method for processing user space operations directly between an application instance and an I/O adapter 失效
标题翻译：用于在应用程序实例和I / O适配器之间直接处理用户空间操作的系统和方法
公开(公告)号：US20070078892A1
公开(公告)日：2007-04-05
申请号：US11216712
申请日：2005-08-31
申请人： William Boyd , John Hufferd , Agustin Mena , Renato Recio , Madeline Vega
发明人： William Boyd , John Hufferd , Agustin Mena , Renato Recio , Madeline Vega
IPC分类号： G06F17/00
CPC分类号： G06F21/85 , G06F21/78
摘要： A system, method, and computer program product that enables user space middleware or applications to pass file name based storage requests directly to a physical I/O Adapter without run-time involvement from the local Operating System (OS) are provided. A mechanism is provided for using a file protection table (FPT) data structure, which may include a file name protection table (FNPT) and file extension protection table (FEPT), to control user space and out of user space Input/Output (I/O) operations. In addition, a mechanism is provided for managing the FPT based on user space operations to create, query, modify and delete entries in the FPT.
摘要翻译：提供了一种使用户空间中间件或应用程序可以将基于文件名的存储请求直接传递到物理I / O适配器的系统，方法和计算机程序产品，而无需本地操作系统（OS）的运行时参与。提供了一种用于使用文件保护表（FPT）数据结构的机制，其可以包括文件名保护表（FNPT）和文件扩展保护表（FEPT），以控制用户空间和用户空间输入/输出（I / O）操作。另外，提供了一种基于用户空间操作来管理FPT以在FPT中创建，查询，修改和删除条目的机制。

8. 发明申请

US20070057361A1 INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURE THEREOF 有权
标题翻译：集成电路封装及其制造方法
公开(公告)号：US20070057361A1
公开(公告)日：2007-03-15
申请号：US11552803
申请日：2006-10-25
申请人： Bernhard Lange , William Boyd
发明人： Bernhard Lange , William Boyd
IPC分类号： H01L23/48 , H01L21/00
CPC分类号： H05K3/308 , H01L23/49555 , H01L24/49 , H01L2224/49175 , H01L2924/00014 , H01L2924/01046 , H01L2924/01079 , H01L2924/14 , H05K2201/10689 , H05K2201/10787 , H05K2201/10871 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit (IC) package that comprises a lead frame. The lead frame has a downset portion and leads. The downset portion has an exterior surface that is configured to face away from a mounting board, and an interior surface that is configured to face towards the mounting board. The leads are bent away from the exterior surface, and each of the leads have a first end coupled to an IC and a second end configured to pass through one of a plurality of mounting holes extending through the mounting board. The IC is coupled to the interior surface.
摘要翻译：一种包括引线框架的集成电路（IC）封装。引线框架具有欠压部分和引线。凹陷部分具有被配置为远离安装板的外表面和被配置为面向安装板的内表面。引线从外表面弯曲，并且每个引线具有联接到IC的第一端和被配置为穿过延伸穿过安装板的多个安装孔中的一个的第二端。 IC耦合到内表面。

9. 发明申请

US20070050591A1 System and method for out of user space I/O with server authentication 失效
标题翻译：用户空间的系统和方法I / O与服务器认证
公开(公告)号：US20070050591A1
公开(公告)日：2007-03-01
申请号：US11216879
申请日：2005-08-31
申请人： William Boyd , John Hufferd , Agustin Mena , Renato Recio , Madeline Vega
发明人： William Boyd , John Hufferd , Agustin Mena , Renato Recio , Madeline Vega
IPC分类号： G06F12/00
CPC分类号： G06F9/461 , G06F3/0622 , G06F3/0637 , G06F3/0659 , G06F3/067 , G06F9/468 , G06F9/485 , G06F21/78
摘要： A system, method, and computer program product that enables user space middleware or applications to pass I/O storage requests directly to a network attached storage device via a storage server that performs authentication are provided. A mechanism is provided for using a translation protection table (TPT) data structure, which may include a file name protection table (FNPT) and file extension protection table (FEPT), or logical volume protection table (LVPT), to control user space and out of user space Input/Output (I/O) operations. The storage server performs authentication of an application instance's request to open an operating system logical volume and, upon being authenticated, permits the application instance to submit I/O storage requests via the TPT to the opened OS logical volume. I/O storage requests are translated into storage commands using the TPT and the storage commands are encapsulated for transmission via one or more networks to the storage server.
摘要翻译：提供了一种使用户空间中间件或应用程序通过执行认证的存储服务器将I / O存储请求直接传递到网络连接的存储设备的系统，方法和计算机程序产品。提供了一种用于使用翻译保护表（TPT）数据结构的机制，其可以包括文件名保护表（FNPT）和文件扩展保护表（FEPT）或逻辑卷保护表（LVPT），以控制用户空间和用户空间输入/输出（I / O）操作。存储服务器执行应用程序实例的打开操作系统逻辑卷的请求的认证，并且在被认证后允许应用实例经由TPT将I / O存储请求提交到打开的OS逻辑卷。使用TPT将I / O存储请求转换为存储命令，并且存储命令被封装以经由一个或多个网络传输到存储服务器。

10. 发明申请

US20070005815A1 System and method for processing block mode I/O operations using a linear block address translation protection table 审中-公开
标题翻译：使用线性块地址转换保护表处理块模式I / O操作的系统和方法
公开(公告)号：US20070005815A1
公开(公告)日：2007-01-04
申请号：US11135257
申请日：2005-05-23
申请人： William Boyd , John Hufferd , Agustin Mena , Renato Recio , Madeline Vega
发明人： William Boyd , John Hufferd , Agustin Mena , Renato Recio , Madeline Vega
IPC分类号： G06F3/00
CPC分类号： G06F3/064 , G06F3/0619 , G06F3/0622 , G06F3/067 , G06F12/145
摘要： The present invention provides a system, method, and computer program product that enables application instances to pass block mode storage requests directly to a physical I/O adapter without run-time involvement from the local operating system or hypervisor. Specifically, a mechanism for providing and using a linear block address (LBA) translation protection table (TPT) to control out of user space I/O operations is provided. In one aspect of the present invention, the LBATPT includes an adapter protection table that has entries for each portion of a storage device and a corresponding LBA table having entries for identifying the linear block addresses associated with an adapter protection table entry. Table entries are correlated with one another using an LBA table pointer. Adapter protection table entries are associated with application instances using a key instance.
摘要翻译：本发明提供一种系统，方法和计算机程序产品，其使得应用程序实例能够将块模式存储请求直接传递到物理I / O适配器，而无需本地操作系统或管理程序的运行时间。具体地，提供了用于提供和使用线性块地址（LBA）转换保护表（TPT）以控制用户空间I / O操作的机制。在本发明的一个方面，LBATPT包括适配器保护表，其具有用于存储设备的每个部分的条目以及具有用于标识与适配器保护表条目相关联的线性块地址的条目的相应LBA表。表条目使用LBA表指针彼此相关。适配器保护表条目与使用密钥实例的应用程序实例相关联。

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