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1. 发明申请

US20070247812A1 Ceramic foam cold plate 有权
标题翻译：陶瓷泡沫冷板
公开(公告)号：US20070247812A1
公开(公告)日：2007-10-25
申请号：US11407438
申请日：2006-04-20
申请人： William Behrens , Andrew Tucker
发明人： William Behrens , Andrew Tucker
IPC分类号： H05K7/20
CPC分类号： F28F3/12 , B64D2013/0614 , F28F13/003 , H05K7/20254 , H05K7/205
摘要： An exemplary cold plate housing defines an inlet port and an outlet port. A plurality of foam strips are disposed in the housing. Each foam strip suitably has pore size of no more than around 50 micrometers and porosity of at least around 80 percent. The foam strips are arranged within the housing so coolant is flowable through a width of the foam strips. Pore size may be around 35 micrometers and porosity may be around ninety percent. Foam may be a ceramic foam that includes silica, aluminum oxide, and aluminum borosilicate fibers. A plurality of plenums may be disposed within the housing. In an application, at least one exemplary cold plate is disposed within a heat exchanger housing intermediate a heat exchanger inlet port and a heat exchanger outlet port such that heat exchanger fluid flows directly over both sides of the cold plate.
摘要翻译：示例性的冷板壳体限定入口和出口。多个泡沫条设置在壳体中。每个泡沫条适当地具有不超过约50微米的孔径和至少约80％的孔隙率。泡沫条布置在壳体内，使得冷却剂可以通过泡沫条的宽度流动。孔径可以在35微米左右，孔隙率可以在百分之九十左右。泡沫可以是包括二氧化硅，氧化铝和硼硅酸铝纤维的陶瓷泡沫。多个增压室可以设置在壳体内。在一个应用中，至少一个示例性的冷板设置在热交换器入口和热交换器出口端口中间的热交换器壳体内，使得热交换器流体直接流过冷板的两侧。

2. 发明申请

US20070247808A1 Ceramic foam electronic component cooling 有权
标题翻译：陶瓷泡沫电子元件冷却
公开(公告)号：US20070247808A1
公开(公告)日：2007-10-25
申请号：US11407433
申请日：2006-04-20
申请人： William Behrens , Andrew Tucker
发明人： William Behrens , Andrew Tucker
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , F28F13/003 , H01L23/3733 , H01L2924/0002 , H01L2924/00
摘要： In an exemplary apparatus for cooling an electronic component, a housing defines an inlet port and an exhaust port and a foam member is disposed within the housing. The foam member has a shape that conforms to a shape of at least one surface of an electronic component such that the foam member is receivable thereon in thermal communication. The foam member has a pore size of no more than around 50 micrometers and a porosity of at least around 80 percent. The foam member is arranged within the housing such that coolant is flowable through the foam member. Pore size may be around 35 micrometers and porosity may be around 90 percent. Foam may be a ceramic foam that includes silica, aluminum oxide, and aluminum borosilicate fibers. In an application, at least one exemplary apparatus may be received in thermal communication on an upper case of an electronic chip.
摘要翻译：在用于冷却电子部件的示例性装置中，壳体限定入口端口和排气口，并且泡沫构件设置在壳体内。泡沫构件具有与电子部件的至少一个表面的形状一致的形状，使得泡沫构件能够以热连通的方式接纳在其上。泡沫构件具有不超过约50微米的孔径和至少约80％的孔隙率。泡沫构件布置在壳体内，使得冷却剂可流过泡沫构件。孔径可以在35微米左右，孔隙率可以在90％左右。泡沫可以是包括二氧化硅，氧化铝和硼硅酸铝纤维的陶瓷泡沫。在应用中，可以在电子芯片的上壳体上以热通信方式接收至少一个示例性装置。

3. 发明申请

US20060060702A1 Cooled insulation surface temperature control system 有权
标题翻译：冷却绝缘表面温度控制系统
公开(公告)号：US20060060702A1
公开(公告)日：2006-03-23
申请号：US11271600
申请日：2005-11-10
申请人： William Behrens , Andrew Tucker , James French , Gayl Miller
发明人： William Behrens , Andrew Tucker , James French , Gayl Miller
IPC分类号： B64C1/38
CPC分类号： F28F13/003 , B64C1/38 , B64G1/58 , F28D2021/0078
摘要： An apparatus and method for surface temperature control is provided. Surface temperature control is achieved by flowing coolant in and then out of a low strength porous layer attached to a structural plenum. A semi-permeable layer may be attached to the outer surface of the porous layer to prevent erosion of the porous layer and to facilitate surface film cooling.
摘要翻译：提供了表面温度控制的装置和方法。表面温度控制是通过将冷却剂流入并连接到结构气室附近的低强度多孔层而实现的。半透层可以附着在多孔层的外表面上，以防止多孔层的腐蚀并促进表面膜冷却。

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