会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 3. 发明授权
    • Method for manufacturing semiconductor memory device having a stacked
type capacitor
    • 具有层叠型电容器的半导体存储器件的制造方法
    • US5219781A
    • 1993-06-15
    • US959572
    • 1992-10-13
    • Masahiro Yoneda
    • Masahiro Yoneda
    • H01L27/108
    • H01L27/10817
    • A capacitor of a semiconductor memory device includes a planar type capacitor portion formed on a surface of an impurity region and a stacked type capacitor portion extending above the gate electrode. The stacked capacitor portion has a three-layer structure of polycrystalline silicon in which upper, lower and side surfaces of a lower electrode are surrounded by a dielectric layer and the upper electrode. A portion of a dielectric layer in the stacked capacitor portion is coupled to another dielectric layer formed on the surface of one impurity region. The capacitor has a planar type capacitor provided in the planar area of occupation of the stacked capacitor portion, whereby the capacitance of the capacitor can be increased without increasing the planar area of occupation.
    • 半导体存储器件的电容器包括形成在杂质区域的表面上的平面型电容器部分和在栅电极上方延伸的层叠型电容器部分。 叠层电容器部分具有多层硅的三层结构,其中下电极的上,下和侧表面被电介质层和上电极包围。 层叠电容器部分中的介电层的一部分耦合到形成在一个杂质区域的表面上的另一电介质层。 电容器具有设置在层叠电容器部分的占用的平面区域中的平面型电容器,由此可以增加电容器的电容,而不增加占用的平面面积。
    • 7. 发明授权
    • Method of forming minute patterns using chemically amplifying type resist
    • 使用化学放大型抗蚀剂形成微小图案的方法
    • US5158861A
    • 1992-10-27
    • US501568
    • 1990-03-30
    • Akira TokuiMasahiro Yoneda
    • Akira TokuiMasahiro Yoneda
    • G03F7/26G03F7/38H01L21/027
    • G03F7/38
    • A method of forming a minute pattern with controlled resist profile uses a chemically amplifying type resist and deep UV rays. Microposit SAL601-ER7 is applied on a silicon substrate, to form a resist film of the resist on the silicon substrate. The resist film is selectively irradiated with KrF excimer laser beam by using a photomask. Thereafter, an electric field directed vertically downward is applied to the resist film while the resist film is heated. According to this method, H.sup.+ ions which are a catalyst for cross linking generated in the resist film move vertically downward, so that diffusion of the H.sup.+ ions in the lateral direction during heating can be prevented. Consequently, negative minute patterns having sidewalls formed vertical to the substrate can be provided.
    • 用受控抗蚀剂轮廓形成微小图案的方法使用化学放大型抗蚀剂和深紫外线。 将微孔SAL601-ER7施加在硅衬底上,以在硅衬底上形成抗蚀剂的抗蚀剂膜。 通过使用光掩模,用KrF准分子激光束选择性地照射抗蚀剂膜。 此后,在抗蚀剂膜被加热的同时,向抗蚀剂膜施加垂直向下的电场。 根据该方法,作为在抗蚀剂膜中产生的交联催化剂的H +离子垂直向下移动,从而可以防止在加热期间H +离子在横向上的扩散。 因此,可以提供具有垂直于衬底的侧壁的负微小图案。
    • 8. 发明授权
    • Multiple layer electrode structure for semiconductor device and method
of manufacturing thereof
    • 用于半导体器件的多层电极结构及其制造方法
    • US5079617A
    • 1992-01-07
    • US405283
    • 1989-09-11
    • Masahiro Yoneda
    • Masahiro Yoneda
    • H01L21/3205H01L21/285H01L21/336H01L21/60H01L23/485H01L23/52H01L29/423H01L29/45H01L29/78
    • H01L21/76897H01L21/28525H01L23/485H01L29/4232H01L29/456H01L29/66606H01L2924/0002
    • A MOS FET comprises a gate electrode and source and drain regions. Conductive layers for electrode are formed on surfaces of the source and drain regions. The conductive layers for electrode are formed by a multilayer structure including a high melting point metal silicide film in contact with the source and drain regions and a polycrystalline silicon layer formed thereon. The gate electrode is formed of polysilicon. The gate electrode has a structure in which part of the gate electrode extends over the conductive layers for electrode formed on the source and drain regions. Such structure reduces the resistance of the interconnection layers for electrodes and realizes reduction in width of the gate electrode. In the manufacturing method, the patterning of the conductive layers for electrodes on the surface of the source/drain regions comprises the steps of etching the polycrystalline silicon layer by dry etching, and etching the high melting point metal silicide layer by wet etching. The wet etching enables etching process without damaging the silicon substrate surface.
    • MOS FET包括栅极电极和源极和漏极区域。 用于电极的导电层形成在源区和漏区的表面上。 用于电极的导电层由包括与源极和漏极区域接触的高熔点金属硅化物膜和形成在其上的多晶硅层的多层结构形成。 栅电极由多晶硅形成。 栅极电极具有其中部分栅电极在形成于源区和漏区上的电极导电层延伸的结构。 这种结构降低了用于电极的互连层的电阻,并实现了栅电极的宽度的减小。 在制造方法中,在源极/漏极区域的表面上的电极用导电层的图案化包括通过干蚀刻蚀刻多晶硅层,并通过湿法蚀刻蚀刻高熔点金属硅化物层的步骤。 湿式蚀刻可以蚀刻工艺而不会损坏硅衬底表面。
    • 9. 发明授权
    • Method of forming minute patterns using positive chemically amplifying
type resist
    • 使用正化学放大型抗蚀剂形成微小图案的方法
    • US5258266A
    • 1993-11-02
    • US925146
    • 1992-08-06
    • Akira TokuiMasahiro Yoneda
    • Akira TokuiMasahiro Yoneda
    • G03F7/38G03F7/32
    • G03F7/38Y10S430/146
    • A method of forming a minute pattern with controlled resist profile by using chemically amplifying type resist and deep UV ray is disclosed. A positive chemically amplifying type resist is applied on a silicon substrate, to form a resist film of the resist on the silicon substrate. The resist film is selectively irradiated with KrF excimer laser beam by using a photomask. Thereafter, an electric field directed vertically downward is applied to the resist film while the resist film is heated. According to this method, H.sup.+ ions which are catalyst for destroying the dissolution inhibiting capability of the dissolution inhibitor generated in the resist film move vertically downward, so that diffusion of the H.sup.+ ions in the lateral direction during heating can be prevented. Consequently, a positive minute pattern having sidewall formed vertical to the substrate can be provided.
    • 公开了通过使用化学放大型抗蚀剂和深紫外线形成具有受控抗蚀剂轮廓的微小图案的方法。 在硅衬底上施加正性化学放大型抗蚀剂,以在硅衬底上形成抗蚀剂的抗蚀剂膜。 通过使用光掩模,用KrF准分子激光束选择性地照射抗蚀剂膜。 此后,在抗蚀剂膜被加热的同时,向抗蚀剂膜施加垂直向下的电场。 根据该方法,用于破坏在抗蚀剂膜中产生的溶解抑制能力的催化剂的H +离子垂直向下移动,从而可以防止在加热期间H +离子在横向上的扩散。 因此,可以提供具有垂直于衬底的侧壁的正微小图案。
    • 10. 发明授权
    • Semiconductor memory device having a stacked type capacitor and
manufacturing method therefor
    • 具有堆叠式电容器的半导体存储器件及其制造方法
    • US5177574A
    • 1993-01-05
    • US446744
    • 1989-12-06
    • Masahiro Yoneda
    • Masahiro Yoneda
    • H01L27/04H01L21/822H01L21/8242H01L27/10H01L27/108
    • H01L27/10817
    • A capacitor of a semiconductor memory device includes a planar type capacitor portion formed on a surface of an impurity region and a stacked type capacitor portion extending above the gate electrode. The stacked capacitor portion has a three-layer structure of polycrystalline silicon in which upper, lower and side surfaces of a lower electrode are surrounded by a dielectric layer and the upper electrode. A portion of a dielectric layer in the stacked capacitor portion is coupled to another dielectric layer formed on the surface of one impurity region. The capacitor has a planar type capacitor provided in the planar area of occupation of the stacked capacitor portion, whereby the capacitance of the capacitor can be increased without increasing the planar area of occupation.
    • 半导体存储器件的电容器包括形成在杂质区域的表面上的平面型电容器部分和在栅电极上方延伸的层叠型电容器部分。 叠层电容器部分具有多层硅的三层结构,其中下电极的上,下和侧表面被电介质层和上电极包围。 层叠电容器部分中的介电层的一部分耦合到形成在一个杂质区域的表面上的另一电介质层。 电容器具有设置在层叠电容器部分的占用的平面区域中的平面型电容器,由此可以增加电容器的电容,而不增加占用的平面面积。