会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明申请
    • RETAINING RING FOR HOLDING SEMICONDUCTOR WAFERS IN A CHEMICAL MECHANICAL POLISHING APPARATUS
    • 用于在化学机械抛光装置中保持半导体晶体管的保持环
    • US20090277583A1
    • 2009-11-12
    • US12503880
    • 2009-07-16
    • Wilfried EnsingerLawrence G. Savage
    • Wilfried EnsingerLawrence G. Savage
    • H01L21/306
    • B24B37/32
    • A retaining ring to be fitted on a chemical mechanical polishing apparatus for semiconductor wafers is disclosed, the retaining ring comprising a carrier ring made of a first material and having fitting elements for fitting the carrier ring on the polishing apparatus; and a bearing ring comprising a plastic material, arranged concentrically on the carrier ring, the bearing ring resting with a first front side on a polishing surface of the polishing apparatus and being held on its side axially opposed to the first front side releasably, non-rotatably, with a positive and/or frictional connection and without adhesive on the carrier ring; wherein the first material has a higher rigidity than the plastic material of the bearing ring.
    • 公开了一种安装在用于半导体晶片的化学机械抛光装置上的保持环,该保持环包括由第一材料制成的载体环并具有用于将载体环安装在抛光装置上的装配元件; 以及轴承环,其包括同心地布置在所述承载环上的塑料材料,所述轴承环在所述抛光装置的抛光表面上保持第一前侧并且被保持在其与所述第一前侧轴向相对的一侧, 可旋转地具有正和/或摩擦连接并且在载体环上没有粘合剂; 其中所述第一材料具有比所述轴承环的塑料材料更高的刚性。
    • 2. 发明授权
    • Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
    • 用于将半导体晶片保持在化学机械抛光装置中的保持环
    • US06913669B2
    • 2005-07-05
    • US10322427
    • 2002-12-19
    • Wilfried Ensinger
    • Wilfried Ensinger
    • B24B37/32B24B47/02H01L21/302H01L21/304H01L21/306H01L21/68
    • B24B37/32
    • A retaining ring to be fitted on a chemical mechanical polishing apparatus for semiconductor wafers is disclosed, the retaining ring comprising a carrier ring made of a first material and having fitting elements for fitting the carrier ring on the polishing apparatus; and a bearing ring comprising a plastic material, arranged concentrically on the carrier ring, the bearing ring resting with a first front side on a polishing surface of the polishing apparatus and being held on its side axially opposed to the first front side releasably, non-rotatably, with a positive and/or frictional connection and without adhesive on the carrier ring; wherein the first material has a higher rigidity than the plastic material of the bearing ring.
    • 公开了一种安装在用于半导体晶片的化学机械抛光装置上的保持环,该保持环包括由第一材料制成的载体环并具有用于将载体环安装在抛光装置上的装配元件; 以及轴承环,其包括同心地布置在所述承载环上的塑料材料,所述轴承环在所述抛光装置的抛光表面上保持第一前侧并且被保持在其与所述第一前侧轴向相对的一侧, 可旋转地具有正和/或摩擦连接并且在载体环上没有粘合剂; 其中所述第一材料具有比所述轴承环的塑料材料更高的刚性。