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1. 发明授权

US07013088B1 Method and apparatus for parallel optical interconnection of fiber optic transmitters, receivers and transceivers 有权
标题翻译：用于光纤发射器，接收器和收发器的并行光互连的方法和装置
公开(公告)号：US07013088B1
公开(公告)日：2006-03-14
申请号：US09651140
申请日：2000-08-30
申请人： Wenbin Jiang , Hsing-Chung Lee , Min-Wen Cheng , Chan-Long Shieh , Cheng Ping Wei , Edwin D. Dair
发明人： Wenbin Jiang , Hsing-Chung Lee , Min-Wen Cheng , Chan-Long Shieh , Cheng Ping Wei , Edwin D. Dair
IPC分类号： H04B10/00
CPC分类号： G02B6/4204 , G02B6/4214 , G02B6/4244 , G02B6/4245 , G02B6/4246 , G02B6/4261 , G02B6/4277 , G02B6/428 , G02B6/4284 , G02B6/4292 , H04B10/801 , H05K1/0274 , H05K1/14
摘要： A multichannel fiber optic module has an electromagnetic shield surrounding high frequency electrical components which is electrically and mechanically coupled to one or more guide rails near edges of a printed circuit board. The one or more guide rails of the printed circuit board include a ground trace on the top and/or bottom surfaces of the printed circuit board. The fiber optic module can be hot inserted into a module cage which has guide rail slots for mating with the guide rails of the fiber optic module. Through the guide rail slots, electromagnetic radiation from the fiber optic module is shunted to a ground plane to which the module cage is coupled on a host chassis ground. Standard singular fiber receptacles are used for the parallel data link modules to allow field cable termination.
摘要翻译：多通道光纤模块具有围绕高频电气部件的电磁屏蔽，其电连接和机械耦合到印刷电路板的边缘附近的一个或多个导轨。印刷电路板的一个或多个导轨包括在印刷电路板的顶部和/或底部表面上的接地迹线。光纤模块可以热插入到具有用于与光纤模块的导轨配合的导轨槽的模块保持架中。通过导轨槽，来自光纤模块的电磁辐射被分流到模块笼耦合到主机箱地面上的接地平面上。标准的单个光纤插座用于并行数据链路模块，以允许现场电缆终端。

2. 发明授权

US06632030B2 Light bending optical block for fiber optic modules 有权
标题翻译：用于光纤模块的光弯曲光学块
公开(公告)号：US06632030B2
公开(公告)日：2003-10-14
申请号：US09860930
申请日：2001-05-17
申请人： Wenbin Jiang , Edwin D. Dair , Cheng Ping Wei
发明人： Wenbin Jiang , Edwin D. Dair , Cheng Ping Wei
IPC分类号： G02B636
CPC分类号： G02B6/4214 , G02B6/4204 , G02B6/4246 , G02B6/4255 , G02B6/4259 , G02B6/4263 , G02B6/4277 , G02B6/4284 , G02B6/4292
摘要： A method, apparatus, and system to couple photons between optoelectronic devices and small form factor fiber connectors. An optical block includes refraction surfaces to narrow the distance between two or more light transmission paths through the optical block thereby enabling a module to be coupled to closely spaced fiber optic connectors. In one embodiment, light from a first light path through the optical block is refracted in the direction of a second light path through the optical block. Prior to intersecting the second light path, the light from the first light path is refracted again to provide the first light path closer to, but independent of, the second light path.
摘要翻译：一种在光电子器件与小尺寸光纤连接器之间耦合光子的方法，设备和系统。光学块包括折射表面，以缩小通过光学块的两个或更多个光传输路径之间的距离，从而使模块能够被耦合到紧密间隔开的光纤连接器。在一个实施例中，来自穿过光学块的第一光路的光在通过光学块的第二光路的方向上被折射。在与第二光路相交之前，再次折射来自第一光路的光，以使第一光路更靠近第二光路，但与第二光路无关。

3. 发明授权

US06873800B1 Hot pluggable optical transceiver in a small form pluggable package 失效
标题翻译：热插拔光收发器采用小型可插拔封装
公开(公告)号：US06873800B1
公开(公告)日：2005-03-29
申请号：US09656779
申请日：2000-09-07
申请人： Cheng Ping Wei , Edwin D. Dair
发明人： Cheng Ping Wei , Edwin D. Dair
IPC分类号： G02B6/42 , H04B10/00 , H05K1/02 , H05K1/14
CPC分类号： H04B10/801 , G02B6/4204 , G02B6/4214 , G02B6/4246 , G02B6/4277 , G02B6/4292 , H05K1/0274 , H05K1/14
摘要： A fiber optic module for transferring data as pulses of light has an optical element with a first light transducer having a straddle mount lead and a second light transducer having a formed or bent signal lead. A first fiber optic receptacle optically couples to the first light transducer and a second fiber optic receptacle optically couples to a second light. A printed circuit board subassembly includes first and second printed circuit boards with an interconnection therebetween to couple to an electrical connector on the first. The first printed circuit board and second printed circuit boards are aligned so that the straddle mount leads couple to contacts on the first and the formed signal lead couple to contacts on the second. One or more electrical components in the fiber optic module process data for communication using light or photons over one or more optical fibers. An outer housing encloses the optical element subassembly and the printed circuit board subassembly. The electrical connector couples external electrical signals to the electrical components.
摘要翻译：用于将数据作为脉冲传送的光纤模块具有光学元件，其具有具有跨骑式安装引线的第一光转换器和具有形成或弯曲的信号引线的第二光转换器。第一光纤插座光耦合到第一光转换器，第二光纤插座光耦合到第二光。印刷电路板子组件包括第一和第二印刷电路板，其间具有互连以耦合到第一印刷电路板上的电连接器。第一印刷电路板和第二印刷电路板对准，使得跨骑式安装引线耦合到第一印刷电路板上的触点，并且所形成的信号引线耦合到第二印刷电路板上的触点。光纤模块中的一个或多个电气部件处理用于在一个或多个光纤上使用光或光子的通信的数据。外壳包围光学元件子组件和印刷电路板子组件。电连接器将外部电信号耦合到电气部件。

4. 发明授权

US6028497A RF pin grid array 失效
标题翻译：射频针阵列
公开(公告)号：US6028497A
公开(公告)日：2000-02-22
申请号：US14556
申请日：1998-01-28
申请人： Barry R. Allen , Edwin D. Dair , Randy J. Duprey
发明人： Barry R. Allen , Edwin D. Dair , Randy J. Duprey
IPC分类号： H05K1/05 , H01L23/66 , H01L25/04 , H01L25/18 , H01P1/00
CPC分类号： H01L23/66 , H01L2924/0002 , H01L2924/3011
摘要： A hermetic RF pin grid array package methodology is described that obviates the need for glass to metal feedthroughs, simplifying construction, improving reliability and reducing the cost of RF multi-chip modules. An array of cylindrical passages (13, 15) through the module's base plate (3) are aligned with and receive respective associated conductor pins (7, 9) depending from the module substrate (1). Cylindrical metal shrouds (11) are positioned within some passages (15) combine with associated pins (9) to define coaxial RF transmission lines and support for an external RF coax coupling. Unshrouded pins (7) serve to connect DC to the integrated circuit chips in the module. Waveguide interfaces, if required, are provided by conductive coupling structures patterned on the substrate, suspended over a waveguide (17) formed in or about the baseplate. The compartmentalized seal ring (5) attached to the top surface of the substrate provides a metal framework that divides the interior area, providing individual compartment for the distinct RF circuits in the module, including the integrated circuit chips associated with each such RF circuit.
摘要翻译：描述了一种封闭的RF针阵列封装方法，其不需要玻璃到金属馈通，简化结构，提高可靠性并降低RF多芯片模块的成本。通过模块的基板（3）的圆柱形通道（13,15）的阵列与模块基板（1）相对准并且接收相应的相应的导体引脚（7,9）。圆柱形金属护罩（11）定位在与相关联的销（9）组合的一些通道（15）内以限定同轴RF传输线并支持外部RF同轴耦合。无罩引脚（7）用于将DC连接到模块中的集成电路芯片。如果需要，波导接口由图案化在衬底上的导电耦合结构提供，悬挂在形成于基板中或其周围的波导（17）上。连接到基板的顶表面的间隔密封环（5）提供了划分内部区域的金属框架，为模块中的不同RF电路提供单独的隔间，包括与每个这样的RF电路相关联的集成电路芯片。

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