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1. 发明授权

US08957597B2 Luminaire 有权
标题翻译：灯具
公开(公告)号：US08957597B2
公开(公告)日：2015-02-17
申请号：US13176714
申请日：2011-07-05
申请人： Wen-Hsiang Lin , Po-Wei Li , Chih-Chiang Kao
发明人： Wen-Hsiang Lin , Po-Wei Li , Chih-Chiang Kao
IPC分类号： H05B37/02 , H05B33/08 , F21K99/00 , F21S9/02 , F21S10/00 , F21V23/04 , F21V8/00 , F21V29/00 , F21V3/00 , F21Y101/02 , G03B21/20
CPC分类号： H05B33/0803 , F21K9/232 , F21K9/65 , F21S9/02 , F21S10/00 , F21V3/00 , F21V23/0485 , F21V29/74 , F21Y2115/10 , G02B6/0068 , G02B6/0076 , G03B21/2033 , H05B33/0842
摘要： A luminaire is provided, which includes a first light source for providing an illumination light and a second light source passing through at least one image pattern for providing a patterned light. The first light source and the second light source are coupled to a driving circuit and covered by a lamp cover. The driving circuit is used to selectively drive at least one of the first light source and the second light source for providing the illumination light and/or the patterned light. A user may turn on or switch different patterns by touching a casing of the luminaire.
摘要翻译：提供了一种照明装置，其包括用于提供照明光的第一光源和穿过至少一个图像图案的第二光源以提供图案化光。第一光源和第二光源耦合到驱动电路并被灯罩覆盖。驱动电路用于选择性地驱动第一光源和第二光源中的至少一个，以提供照明光和/或图案化光。用户可以通过触摸灯具的外壳来打开或切换不同的图案。

2. 发明授权

US08502479B2 Current regulating circuit and light emitting diode device having the same 有权
标题翻译：电流调节电路和具有该电流调节电路的发光二极管装置
公开(公告)号：US08502479B2
公开(公告)日：2013-08-06
申请号：US13097366
申请日：2011-04-29
申请人： Chih-Chiang Kao , Po-Wei Li
发明人： Chih-Chiang Kao , Po-Wei Li
IPC分类号： H05B37/02
CPC分类号： H05B33/0809
摘要： A current regulating circuit is for connection in series between a light emitting diode (LED) and a power source, and includes: a first resistive unit having a first resistance that is proportional to an operation temperature of the LED when the operation temperature is above a predetermined threshold temperature; and a second resistive unit connected in series with said first resistive unit, and having a second resistance that is inversely proportional to the operation temperature of the LED when the operation temperature is above the predetermined threshold temperature. When the operation temperature of the LED is above the predetermined threshold temperature, an effective resistance of said current regulating circuit attributed to said first and second resistive units is proportional to the operation temperature of the LED, and absolute value of a rate of change of the first resistance is larger than that of the second resistance.
摘要翻译：电流调节电路用于串联连接在发光二极管（LED）和电源之间，并且包括：第一电阻单元，具有第一电阻，当第一电阻与操作温度高于LED时的LED的工作温度成比例预定阈值温度; 以及与所述第一电阻单元串联连接的第二电阻单元，并且当所述操作温度高于所述预定阈值温度时具有与所述LED的工作温度成反比的第二电阻。当LED的工作温度高于预定阈值温度时，归因于所述第一和第二电阻单元的所述电流调节电路的有效电阻与LED的操作温度成比例，并且所述LED的变化率的绝对值第一阻力大于第二阻力。

3. 发明授权

US08729681B2 Package structure and LED package structure 有权
标题翻译：封装结构和LED封装结构
公开(公告)号：US08729681B2
公开(公告)日：2014-05-20
申请号：US12889875
申请日：2010-09-24
申请人： Chen-Hsiu Lin , Chih-Chiang Kao
发明人： Chen-Hsiu Lin , Chih-Chiang Kao
IPC分类号： H01L23/495
CPC分类号： H01L33/486 , H01L33/62 , H01L33/64 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A package structure includes a base unit, a pin unit and a housing unit. The base unit has a carrier member and a through hole penetrating through the carrier member, and at least one annular structure is formed in the through hole. The pin unit has a plurality of conductive pins disposed beside the carrier member. The housing unit has an annular housing encircling the carrier member to envelop one part thereof and connecting to the pin unit, and the annular housing is partially filled into the through hole to cover the annular structure. Therefore, the instant disclosure can increase the bonding force between the carrier member and the annular housing and retard external moisture to permeate through slits between the carrier member and the annular housing to intrude into the chip-mounting region, thus the reliability and the usage life are increased.
摘要翻译：封装结构包括基座单元，引脚单元和外壳单元。基座单元具有承载构件和穿过承载构件的通孔，并且在通孔中形成至少一个环形结构。销单元具有设置在承载构件旁边的多个导电销。壳体单元具有围绕载体构件的环形壳体，以包围其一部分并连接到销单元，并且环形壳体部分地填充到通孔中以覆盖环形结构。因此，本公开可以增加载体构件和环形壳体之间的结合力并且阻止外部水分渗透通过载体构件和环形壳体之间的狭缝以侵入芯片安装区域，从而可靠性和使用寿命增加了。

4. 发明授权

US08183759B2 Light emitting diode device and manufacturing method thereof 有权
标题翻译：发光二极管装置及其制造方法
公开(公告)号：US08183759B2
公开(公告)日：2012-05-22
申请号：US12422308
申请日：2009-04-13
申请人： Tzeng-Guang Tsai , Jia-Min Shieh , Chih-Chiang Kao , Hung-Yuan Su
发明人： Tzeng-Guang Tsai , Jia-Min Shieh , Chih-Chiang Kao , Hung-Yuan Su
IPC分类号： H01L51/00
CPC分类号： H01L33/501
摘要： A manufacturing method of an LED device includes the following steps. First, a substrate and at least one LED disposed on the substrate are provided. Next, a porous material layer having a plurality of pores is formed on a surface of the LED. Finally, a plurality of nanocrystals are formed in the pores to construct a phosphor layer on the surface of the LED.
摘要翻译： LED装置的制造方法包括以下步骤。首先，设置基板和设置在基板上的至少一个LED。接下来，在LED的表面上形成具有多个孔的多孔材料层。最后，在孔中形成多个纳米晶体，以在LED的表面上构建荧光体层。

5. 发明授权

US09239742B2 Embedded systems and methods for threads and buffer management thereof 有权
标题翻译：用于线程的嵌入式系统和方法及其缓冲区管理
公开(公告)号：US09239742B2
公开(公告)日：2016-01-19
申请号：US13550223
申请日：2012-07-16
申请人： Hsin-Yi Liu , Chih-Chiang Kao , Cheng-Hung Pan , Chun-Tai Yen
发明人： Hsin-Yi Liu , Chih-Chiang Kao , Cheng-Hung Pan , Chun-Tai Yen
IPC分类号： G06F9/46 , G06F9/52 , G06F9/54 , G06F9/50
CPC分类号： G06F9/52 , G06F9/50 , G06F9/544
摘要： Embedded systems are provided, which includes a processing unit and a memory. The processing unit simultaneously executes first thread having a flag for performing a data acquisition operation and second thread for performing a data process and output operation for the acquired data in the data acquisition operation. The flag is used for indicating whether a state of the first thread is in an execution state or a sleep state. The memory which is coupled to the processing unit provides a shared buffer for the first and second threads. Before executing the second thread, the flag is checked to determine whether to execute the second thread, wherein the second thread is executed when the flag indicates the sleep state while execution of the second thread is suspended when the flag indicates the execution state.
摘要翻译：提供了包括处理单元和存储器的嵌入式系统。处理单元同时执行具有用于执行数据获取操作的标志的第一线程和用于在数据获取操作中对所获取的数据执行数据处理和输出操作的第二线程。标志用于指示第一线程的状态是处于执行状态还是休眠状态。耦合到处理单元的存储器为第一和第二线程提供共享缓冲器。在执行第二线程之前，检查该标志以确定是否执行第二线程，其中当该标志指示执行状态时，当该标志指示休眠状态，同时第二线程的执行被暂停时，第二线程被执行。

6. 发明申请

US20110175134A1 PACKAGE STRUCTURE AND LED PACKAGE STRUCTURE 有权
标题翻译：封装结构和LED封装结构
公开(公告)号：US20110175134A1
公开(公告)日：2011-07-21
申请号：US12889875
申请日：2010-09-24
申请人： Chen-Hsiu Lin , Chih-Chiang Kao
发明人： Chen-Hsiu Lin , Chih-Chiang Kao
IPC分类号： H01L33/62 , H05K5/00
CPC分类号： H01L33/486 , H01L33/62 , H01L33/64 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A package structure includes a base unit, a pin unit and a housing unit. The base unit has a carrier member and a through hole penetrating through the carrier member, and at least one annular structure is formed in the through hole. The pin unit has a plurality of conductive pins disposed beside the carrier member. The housing unit has an annular housing encircling the carrier member to envelop one part thereof and connecting to the pin unit, and the annular housing is partially filled into the through hole to cover the annular structure. Therefore, the instant disclosure can increase the bonding force between the carrier member and the annular housing and retard external moisture to permeate through slits between the carrier member and the annular housing to intrude into the chip-mounting region, thus the reliability and the usage life are increased.
摘要翻译：封装结构包括基座单元，引脚单元和外壳单元。基座单元具有承载构件和穿过承载构件的通孔，并且在通孔中形成至少一个环形结构。销单元具有设置在承载构件旁边的多个导电销。壳体单元具有围绕载体构件的环形壳体，以包围其一部分并且连接到销单元，并且环形壳体部分地填充到通孔中以覆盖环形结构。因此，本公开可以增加载体构件和环形壳体之间的结合力并且阻止外部水分渗透通过载体构件和环形壳体之间的狭缝以侵入芯片安装区域，从而可靠性和使用寿命增加了。

7. 外观设计

USD624885S1 LED package structure 有权
标题翻译： LED封装结构
公开(公告)号：USD624885S1
公开(公告)日：2010-10-05
申请号：US29354644
申请日：2010-01-27
申请人： Chen-Hsiu Lin , Chih-Chiang Kao
设计人： Chen-Hsiu Lin , Chih-Chiang Kao

8. 发明授权

US08421336B2 Light emitting diode device 有权
标题翻译：发光二极管装置
公开(公告)号：US08421336B2
公开(公告)日：2013-04-16
申请号：US13427670
申请日：2012-03-22
申请人： Tseng-Guang Tsai , Jia-Min Shieh , Chih-Chiang Kao , Hung-Yuan Su
发明人： Tseng-Guang Tsai , Jia-Min Shieh , Chih-Chiang Kao , Hung-Yuan Su
IPC分类号： H01J1/62
CPC分类号： H01L33/501
摘要： A manufacturing method of an LED device includes the following steps. First, a substrate and at least one LED disposed on the substrate are provided. Next, a porous material layer having a plurality of pores is formed on a surface of the LED. Finally, a plurality of nanocrystals are formed in the pores to construct a phosphor layer on the surface of the LED.
摘要翻译： LED装置的制造方法包括以下步骤。首先，设置基板和设置在基板上的至少一个LED。接下来，在LED的表面上形成具有多个孔的多孔材料层。最后，在孔中形成多个纳米晶体，以在LED的表面上构建荧光体层。

9. 发明授权

US08357552B2 Light emitting diode chip, and methods for manufacturing and packaging the same 有权
标题翻译：发光二极管芯片及其制造和封装方法
公开(公告)号：US08357552B2
公开(公告)日：2013-01-22
申请号：US12654005
申请日：2009-12-08
申请人： Chih-Chiang Kao
发明人： Chih-Chiang Kao
IPC分类号： H01L21/00
CPC分类号： H01L33/52 , H01L33/0095 , H01L33/20 , H01L33/385 , H01L33/44 , H01L33/46 , H01L33/486 , H01L33/62 , H01L2224/32145 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2924/01019 , H01L2924/01087 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： A light emitting diode chip includes a substrate, an epitaxial layer, two inclined plane units, and two electrode units. The substrate has top and bottom surfaces. The epitaxial layer is disposed on the top surface of the substrate. Each of the inclined plane units is inclined downwardly and outwardly from the epitaxial layer toward the bottom surface of the substrate, and includes an inclined sidewall formed on the epitaxial layer, and a substrate inclined wall formed on the substrate. Each of the electrode units includes an electrode disposed on the epitaxial layer, and a conductive portion extending from the electrode to the substrate inclined wall along corresponding one of the inclined plane units.
摘要翻译：发光二极管芯片包括衬底，外延层，两个倾斜平面单元和两个电极单元。衬底具有顶表面和底表面。外延层设置在基板的顶表面上。每个倾斜平面单元从外延层朝向基板的底表面向下和向外倾斜，并且包括形成在外延层上的倾斜侧壁和形成在基板上的基板倾斜壁。每个电极单元包括设置在外延层上的电极和从相应的一个倾斜平面单元从电极延伸到基板倾斜壁的导电部分。

10. 发明授权

US08303133B2 Light emitting diode, backlight module, and light tube 有权
标题翻译：发光二极管，背光模块和灯管
公开(公告)号：US08303133B2
公开(公告)日：2012-11-06
申请号：US12750905
申请日：2010-03-31
申请人： Hsiu-Tsu Wang , Chia-Hao Wu , Chih-Lung Liang , Chen-Hsiu Lin , Chih-Chiang Kao
发明人： Hsiu-Tsu Wang , Chia-Hao Wu , Chih-Lung Liang , Chen-Hsiu Lin , Chih-Chiang Kao
IPC分类号： F21S4/00
CPC分类号： H01L33/58 , F21K9/27 , F21Y2115/10 , H01L33/505
摘要： A light emitting diode includes: a base with a concave portion; a light emitting chip disposed in the concave portion; an encapsulating layer filled in the concave portion; and an optical adjusting element disposed on the light emitting chip. Herein, the light emitting diode has a batwing distribution in a horizontal view angle, and the light emitting diode has a Lambertian distribution in a vertical view angle thereof.
摘要翻译：发光二极管包括：具有凹部的基座; 设置在所述凹部中的发光芯片; 填充在所述凹部中的封装层; 以及设置在发光芯片上的光学调节元件。这里，发光二极管具有水平视角的蝙蝠分布，并且发光二极管在其垂直视角具有朗伯分布。

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